TW202419504A - 環氧樹脂組成物、電子零件安裝構造體及電子零件安裝構造體之製造方法 - Google Patents

環氧樹脂組成物、電子零件安裝構造體及電子零件安裝構造體之製造方法 Download PDF

Info

Publication number
TW202419504A
TW202419504A TW112129377A TW112129377A TW202419504A TW 202419504 A TW202419504 A TW 202419504A TW 112129377 A TW112129377 A TW 112129377A TW 112129377 A TW112129377 A TW 112129377A TW 202419504 A TW202419504 A TW 202419504A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
filler
electronic component
grinding
Prior art date
Application number
TW112129377A
Other languages
English (en)
Chinese (zh)
Inventor
大江貴之
齊藤裕
上村剛
Original Assignee
日商納美仕股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕股份有限公司 filed Critical 日商納美仕股份有限公司
Publication of TW202419504A publication Critical patent/TW202419504A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/26—Silicon- containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW112129377A 2022-11-10 2023-08-04 環氧樹脂組成物、電子零件安裝構造體及電子零件安裝構造體之製造方法 TW202419504A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022180433 2022-11-10
JP2022-180433 2022-11-10

Publications (1)

Publication Number Publication Date
TW202419504A true TW202419504A (zh) 2024-05-16

Family

ID=91032570

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112129377A TW202419504A (zh) 2022-11-10 2023-08-04 環氧樹脂組成物、電子零件安裝構造體及電子零件安裝構造體之製造方法

Country Status (4)

Country Link
JP (1) JPWO2024100934A1 (https=)
KR (1) KR20250105356A (https=)
TW (1) TW202419504A (https=)
WO (1) WO2024100934A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025254026A1 (ja) * 2024-06-05 2025-12-11 ナミックス株式会社 エポキシ樹脂組成物、硬化物、及び半導体装置
WO2026009778A1 (ja) * 2024-07-03 2026-01-08 ナミックス株式会社 エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法
WO2026009780A1 (ja) * 2024-07-03 2026-01-08 ナミックス株式会社 エポキシ樹脂組成物、硬化物、半導体装置、及び半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4176619B2 (ja) * 2003-07-18 2008-11-05 信越化学工業株式会社 フリップチップ実装用サイドフィル材及び半導体装置
TWI898612B (zh) * 2017-05-31 2025-09-21 日商力森諾科股份有限公司 壓縮成形用液狀樹脂組成物及電子零件裝置
US11608435B2 (en) * 2017-06-09 2023-03-21 Nagase Chemtex Corporation Epoxy resin composition, electronic component mounting structure, and method for producing the same
KR102581569B1 (ko) * 2017-10-10 2023-10-05 아지노모토 가부시키가이샤 경화체 및 이의 제조방법, 수지 시트 및 수지 조성물
JP7148946B2 (ja) * 2017-12-21 2022-10-06 ナミックス株式会社 樹脂組成物
JP7631828B2 (ja) * 2021-01-22 2025-02-19 味の素株式会社 樹脂組成物、樹脂ペースト、硬化物、半導体チップパッケージ及び半導体装置

Also Published As

Publication number Publication date
WO2024100934A1 (ja) 2024-05-16
JPWO2024100934A1 (https=) 2024-05-16
KR20250105356A (ko) 2025-07-08

Similar Documents

Publication Publication Date Title
TW202419504A (zh) 環氧樹脂組成物、電子零件安裝構造體及電子零件安裝構造體之製造方法
TWI883181B (zh) 液狀壓縮成型材
JP7420559B2 (ja) 封止用樹脂組成物
KR102582382B1 (ko) 에폭시 수지 조성물, 전자 부품 실장 구조체 및 그 제조 방법
JPWO2017038941A1 (ja) 樹脂組成物、硬化物、封止用フィルム及び封止構造体
JP6988952B2 (ja) 封止組成物及び半導体装置
TW202321339A (zh) 環氧樹脂組成物、液狀壓模材、圓頂封裝（ｇｌｏｂ ｔｏｐ）材及半導體裝置
TW201627393A (zh) 四甲基聯苯酚型環氧樹脂、環氧樹脂組成物、硬化物及半導體密封材
TW201934651A (zh) 密封組成物及半導體裝置
JP7849687B2 (ja) Ｔｓｖ用モールドアンダーフィル組成物
KR102428705B1 (ko) 대면적의 반도체 소자 탑재 기재를 밀봉하는 방법
TW202007721A (zh) 用於封裝半導體裝置的環氧樹脂組成物和半導體裝置
JP2021155731A (ja) 半導体封止用樹脂組成物および半導体装置
CN116444942B (zh) 一种自修复环氧塑封料及其制备方法和应用
JP2021113270A (ja) 樹脂組成物、樹脂組成物の製造方法、及び、これらに用いる無機粒子
TW202440783A (zh) 環氧樹脂組成物、電子零件、半導體裝置、半導體裝置之製造方法
JP2016079195A (ja) 電気絶縁樹脂
US20250026920A1 (en) Liquid epoxy resin composition for use as mold underfill material for tsv
WO2025004453A1 (ja) 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
JP4622025B2 (ja) エポキシ樹脂組成物及び半導体装置
JP2025011965A (ja) 液状コンプレッションモールド材及びそれを用いた電子部品
KR20250077048A (ko) 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
KR20250106924A (ko) 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
JPH05218240A (ja) 半導体封止用樹脂組成物