Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
  • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
  • C08K3/013—Fillers, pigments or reinforcing additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/34—Silicon-containing compounds
  • C08K3/36—Silica
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K7/00—Use of ingredients characterised by shape
  • C08K7/22—Expanded, porous or hollow particles
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K7/00—Use of ingredients characterised by shape
  • C08K7/22—Expanded, porous or hollow particles
  • C08K7/24—Expanded, porous or hollow particles inorganic
  • C08K7/26—Silicon- containing compounds
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
  • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/01—Manufacture or treatment
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
  • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
  • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Definitions

• the present invention relates to an epoxy resin composition, an electronic component mounting structure, and a method for manufacturing an electronic component mounting structure.
• semiconductor elements such as IC chips are first mounted on a wafer, and then (i) sealing of the semiconductor elements using an epoxy resin composition, (ii) polishing of the surface of the cured epoxy resin composition formed by sealing, and (iii) formation of a rewiring layer on the polished surface formed by polishing are sequentially performed. Therefore, in the chip-first process, it is important to ensure high flatness on the polished surface formed by polishing the surface of the cured epoxy resin composition before forming the rewiring layer.
• Patent Document 1 a technique for forming a polished surface having high flatness prior to the formation of a rewiring layer is known, for example, as described in Patent Document 1.
• the number of holes having a diameter of more than 5 ⁇ m observed within an area of 25 mm2 on a polished surface obtained by polishing the surface of a cured product of an epoxy resin composition containing hollow particles with a grinder is controlled to 1 or less.
• the present invention has been made in consideration of the above circumstances, and aims to provide an epoxy resin composition that can further suppress the occurrence of dent defects formed on the polished surface when the surface of a cured product of the epoxy resin composition is polished, an electronic component mounting structure using the same, and a method for manufacturing the electronic component mounting structure.
• the epoxy resin composition of the present invention is an epoxy resin composition comprising (A) an epoxy resin, (B) at least one component selected from the group consisting of a curing agent and a curing accelerator, and (C) a filler, wherein the average density of dents having a diameter of 0.5 ⁇ m or more observed on a polished surface of a cured product of the epoxy resin composition is 1.00 dents/ mm2 or less.
• the (C) filler does not contain a hollow filler.
• the (C) filler preferably contains a hollow filler, and the content of the hollow filler in the (C) filler is preferably 100 ppm or less.
• the viscosity at room temperature is preferably 1 Pa.s or more and 1000 Pa.s or less.
• the content of the filler component (C) contained in the epoxy resin composition is preferably 55% by mass to 86% by mass.
• Another embodiment of the epoxy resin composition of the present invention is preferably for use in liquid compression molding.
• the electronic component mounting structure of the present invention comprises an electronic component, a cured product of an epoxy resin composition having a polished surface on its surface and sealing the electronic component, and a redistribution layer formed on the polished surface of the cured product, wherein the epoxy resin composition comprises (A) an epoxy resin, (B) at least one component selected from the group consisting of a curing agent and a curing accelerator, and (C) a filler, and the average density of dents having a diameter of 0.5 ⁇ m or more observed on the polished surface is 1.00 dents/ mm2 or less.
• the method for producing an electronic component mounting structure of the present invention includes a sealing step of sealing an electronic component with a cured product of an epoxy resin composition containing (A) an epoxy resin, (B) at least one component selected from the group consisting of a curing agent and a curing accelerator, and (C) a filler, a polished surface formation step of polishing a surface of the cured product to form a polished surface, and a rewiring layer formation step of forming a rewiring layer on the polished surface, wherein the average density of dents having a diameter of 0.5 ⁇ m or more observed on the polished surface is 1.00 dents/ mm2 or less.
• the sealing step is preferably performed by a compression molding method.
• the present invention provides an epoxy resin composition that can further suppress the occurrence of dent defects formed on the polished surface when the surface of a cured product of the epoxy resin composition is polished, an electronic component mounting structure using the same, and a method for manufacturing the electronic component mounting structure.
• the epoxy resin composition of this embodiment includes (A) an epoxy resin, (B) at least one component selected from the group consisting of a curing agent and a curing accelerator, and (C) a filler.
• the average density of dents having a diameter of 0.5 ⁇ m or more observed on the polished surface of the cured product of this epoxy resin composition is 1.00 pieces/ mm2 or less. Therefore, in the epoxy resin composition of this embodiment, the occurrence of dent defects formed on the polished surface when the surface of the cured product of the epoxy resin composition is polished can be further suppressed. Therefore, as a result, it becomes easy to further improve the performance and reliability of the electronic component mounting structure manufactured using the epoxy resin composition of this embodiment.
• the average density of dents present on a polished surface is measured by the following procedure.
• an epoxy resin composition is heat-treated at 150°C for 2 hours to obtain a cured product, and a dicing device is used to prepare a polishing sample (length: 1 mm, width: 1 mm, thickness: 500 ⁇ m).
• the surface of the polishing sample (surface of length and width: 1 mm x 1 mm) is polished.
• a polishing process using a slurry containing an inorganic abrasive with an average particle size of 0.5 ⁇ m or less is performed as the final polishing process performed just before the polished surface is completed, to form the polished surface to be measured. In this way, 10 observation samples are prepared.
• the average density of dents with a diameter of 0.5 ⁇ m or more is preferably 0.80 pieces/ mm2 or less, more preferably 0.60 pieces/ mm2 or less, even more preferably 0.30 pieces/ mm2 or less, particularly preferably 0.18 pieces/ mm2 or less, and most preferably 0 pieces/ mm2 .
• the average density of dents having a diameter of 0.5 ⁇ m or more exceeds 0/ mm2 , there is a possibility that dents having a larger diameter are formed on the polished surface.
• the average density of dents having a diameter of 1.5 ⁇ m to 5.0 ⁇ m is preferably 0.02/ mm2 or less, more preferably 0.01/ mm2 , and even more preferably 0/ mm2 .
• the average density of dents having a diameter of more than 5.0 ⁇ m is also preferably 0/ mm2 .
• grinder polishing is the mainstream polishing method used to form a polished surface (final polish) in the manufacture of electronic component mounting structures such as semiconductor devices having a rewiring layer (for example, JP 2022-141179 A/paragraphs 0020, 0025, etc., and JP 2019-129179 A/paragraphs 0054-0055). Therefore, as disclosed in Patent Document 1 (particularly paragraphs 0065-0066, Table 1-2), evaluating dent defects on the polished surface formed by grinder polishing as the final polish is considered to be useful in improving the performance and reliability of electronic component mounting structures at the time of filing this application.
• grinder polishing which is a polishing method in which a grinding wheel is rotated at high speed and brought into contact with a workpiece to grind the surface
• mechanical damage to the polished surface during the formation of the polished surface is large, and as a result, it is thought that the number and size of dent defects are likely to be large.
• polishing methods that cause less mechanical damage to the polished surface than grinder polishing will be adopted as the final polish when forming a polished surface, instead of grinder polishing.
• polishing processes barrel polishing, buff polishing, chemical mechanical polishing, etc.
• slurries containing inorganic abrasives with an average particle size of 0.5 ⁇ m or less (more preferably 0.1 ⁇ m or less) will become mainstream.
• the epoxy resin composition of this embodiment it was considered extremely important to reduce the size tolerance of dent defects formed on the polished surface of the cured product to less than 0.5 ⁇ m, and to evaluate dent defects formed on the polished surface after a final polish using a slurry containing an inorganic abrasive with an average particle size of 0.5 ⁇ m or less. Based on the future predictions and knowledge described above, the inventors have discovered the epoxy resin composition of this embodiment, the electronic component mounting structure, and the manufacturing method thereof.
• Epoxy Resin The epoxy resin used in the epoxy resin composition of the present embodiment is not particularly limited as long as it is a variety of epoxy resins generally used for semiconductor encapsulation, but from the viewpoint of viscosity and injectability, it is preferable to use a liquid epoxy resin. Moreover, as the epoxy resin to be blended in the epoxy resin composition, only one type of epoxy resin may be used, or two or more types of epoxy resins may be used in combination.
• epoxy resins include, but are not limited to, aromatic epoxy resins and aliphatic epoxy resins.
• aromatic epoxy resins include bisphenol A type epoxy resins such as p-glycidyloxyphenyldimethyltrisbisphenol A diglycidyl ether; bisphenol F type epoxy resins; novolac type epoxy resins; fluorene type epoxy resins; biphenyl aralkyl epoxy resins; diepoxy resins such as p-tert-butylphenyl glycidyl ether and 1,4-phenyldimethanol diglycidyl ether; biphenyl type epoxy resins such as 3,3',5,5'-tetramethyl-4,4'-diglycidyloxybiphenyl; aminophenol type epoxy resins such as diglycidylaniline, diglycidyltoluidine, triglycidyl-p-aminophenol, and tetraglycidyl-m-xylylenediamine;
• aliphatic epoxy resins include monofunctional aliphatic epoxy compounds having one epoxy group in the molecule, such as alkyl alcohol glycidyl ethers [butyl glycidyl ether, 2-ethylhexyl glycidyl ether, etc.] and alkenyl alcohol glycidyl ethers [vinyl glycidyl ether, allyl glycidyl ether, etc.]; difunctional aliphatic epoxy compounds having two epoxy groups in the molecule, such as polyalkylene glycol diglycidyl ethers and alkenylene glycol diglycidyl ethers, such as alkylene glycol diglycidyl ether and polytetramethylene glycol diglycidyl ether; and polyfunctional aliphatic epoxy compounds having three or more epoxy groups in the molecule, such as polyglycidyl ethers of trifunctional or higher alcohols, such as trimethylolpropane, pentaerythr
• the content of the epoxy resin in the epoxy resin composition is preferably 1 to 50 parts by mass, more preferably 5 to 45 parts by mass, and even more preferably 12 to 40 parts by mass.
• epoxy resin compositions when two or more types of epoxy resin compositions are used in combination, particularly when an aromatic epoxy resin and an aliphatic epoxy resin are used in combination, it is preferable to use (poly)tetramethylene glycol diglycidyl ether represented by the following general formula (1) as the epoxy resin, from the viewpoint of facilitating the reduction in viscosity of the epoxy resin composition.
• n is preferably a natural number from 1 to 15.
• the number average molecular weight of the (poly)tetramethylene glycol diglycidyl ether represented by general formula (1) is more preferably from 200 to 2000.
• An example of a commercially available (poly)tetramethylene glycol diglycidyl ether represented by general formula (1) is Epogosee PT General Grade.
• the filler (C) it is preferable to use a filler having a maximum particle size of 5 ⁇ m or less as the filler (C).
• a filler having a maximum particle size of 5 ⁇ m or less it is preferable to use as the filler (C).
• the viscosity of the epoxy resin composition is likely to increase, and the preparation of the epoxy resin composition itself may become difficult.
• the content of the (poly)tetramethylene glycol diglycidyl ether represented by general formula (1) is preferably 5.0 parts by mass to 50.0 parts by mass, and more preferably 10.0 parts by mass to 40.0 parts by mass, from the viewpoint of ensuring appropriate viscosity and injectability, assuming that the total amount of the epoxy resin (A) is 100 parts by mass.
• at least one component selected from the group consisting of a curing agent and a curing accelerator is used.
• the curing agent or the curing accelerator may be used alone, or both may be used in combination.
• the curing agent is not particularly limited as long as it is a commonly used curing agent.
• As the curing agent blended in the epoxy resin composition only one type of curing agent may be used, or two or more types of curing agents may be used in combination.
• Examples of the curing agent include amine-based curing agents, acid anhydride-based curing agents, and phenol-based curing agents.
• amine-based hardeners include aliphatic polyamines such as triethylenetetramine, tetraethylenepentamine, m-xylenediamine, trimethylhexamethylenediamine, and 2-methylpentamethylenediamine; alicyclic polyamines such as isophoronediamine, 1,3-bisaminomethylcyclohexane, bis(4-aminocyclohexyl)methane, norbornenediamine, and 1,2-diaminocyclohexane; piperazine-type polyamines such as N-aminoethylpiperazine and 1,4-bis(2-amino-2-methylpropyl)piperazine; and aromatic polyamines such as diethyltoluenediamine, dimethylthiotoluenediamine, 4,4'-diamino-3,3'-diethyldiphenylmethane, bis(methylthio)toluenediamine, diaminodipheny
• acid anhydride-based hardeners include alkylated tetrahydrophthalic anhydrides such as methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, and methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhimic anhydride, succinic anhydride substituted with an alkenyl group, methylnadic anhydride, and glutaric anhydride.
• alkylated tetrahydrophthalic anhydrides such as methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, and methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhimic anhydride, succinic anhydride substituted with an alkenyl group, methylnadic anhydride, and glutaric anhydride.
• phenol-based hardeners include monomers, oligomers, and polymers that have a phenolic hydroxyl group, such as phenol novolac resin and its alkylated or allylated derivatives, cresol novolac resin, phenol aralkyl (containing phenylene and biphenylene skeletons) resin, naphthol aralkyl resin, triphenolmethane resin, and dicyclopentadiene-type phenol resin.
• the amount of the curing agent blended into the epoxy resin composition is preferably an amount that results in a stoichiometric equivalent ratio with the epoxy resin (curing agent equivalent/epoxy group equivalent) of 0.01 to 1.5, and more preferably an amount that results in a stoichiometric equivalent ratio of 0.02 to 1.4.
• the blending ratio of the curing agent to the liquid components excluding the solid components ((C) filler and other solid materials added as necessary) from the epoxy resin composition is preferably 1 part by mass to 80 parts by mass, and more preferably 5 parts by mass to 50 parts by mass.
• the curing accelerator is not particularly limited as long as it is a commonly used curing accelerator.
• As the curing accelerator blended in the epoxy resin composition only one type of curing accelerator may be used, or two or more types of curing accelerators may be used in combination.
• Examples of the curing accelerator include imidazole-based curing accelerators, tertiary amine-based curing accelerators (excluding imidazole-based curing accelerators), and phosphorus-based curing accelerators.
• imidazole-based curing accelerators include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-isopropylimidazole, 2-undecylimidazole, 2-dodecylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-benzylimidazole, 2,4,5-trimethylimidazole, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, etc.
• tertiary amine-based curing accelerators are compounds having one or more tertiary amino groups.
• phosphorus-based curing accelerators include tertiary phosphines such as triphenylphosphine, and phosphonium salts such as tetraphenylphosphonium and tetraphenylborate.
• the mixing ratio of the curing accelerator to the liquid components excluding the solid components ((C) filler and other solid materials added as necessary) from the epoxy resin composition is preferably 0.01 parts by mass to 50 parts by mass, more preferably 0.02 parts by mass to 40 parts by mass, and even more preferably 0.03 parts by mass to 30 parts by mass.
• the filler is not particularly limited as long as it has the effect of reducing the thermal expansion coefficient of the cured product of the epoxy resin composition.
• the filler material include silica, alumina, aluminum, aluminum nitride, silicon carbide, silicon nitride, etc.
• silica filler is particularly suitable from the viewpoint of being able to increase the amount of filler blended (loading amount) in the epoxy resin composition.
• the filler may be surface-treated with a surface treatment agent such as a silane coupling agent.
• the shape of the filler is not particularly limited, and may be any of spherical, amorphous, scaly, etc.
• the average particle size of the filler is preferably 0.01 ⁇ m to 10.0 ⁇ m, more preferably 0.02 ⁇ m to 5.0 ⁇ m, and even more preferably 0.03 ⁇ m to 2.0 ⁇ m.
• the average particle size refers to the volume average particle size D50 (particle size that is 50% cumulative from the small diameter side of the volume-based particle size distribution) value measured using a laser diffraction particle size distribution measuring device.
• the upper limit of the maximum particle size of the filler is preferably 20.0 ⁇ m or less, more preferably 12 ⁇ m or less, even more preferably 7.5 ⁇ m or less, and particularly preferably 5.0 ⁇ m or less.
• the maximum particle size of all types of fillers is within the above range.
• the lower limit of the maximum particle size is not particularly limited, but in practice, it is sufficient as long as it exceeds the average particle size, and for example, it is preferable that it is 1.1 to 1.4 times the average particle size or more.
• the maximum particle size of the filler means the value of the volume average particle size D99.95 (the particle size that is 99.95% cumulative from the small diameter side of the volume-based particle size distribution) measured using a laser diffraction particle size distribution measuring device.
• the filler used in the preparation of the epoxy resin composition may be one whose average particle size or maximum particle size has been adjusted to the desired value by various classification processes in advance.
• fillers there are various methods for manufacturing fillers, but among these, in fillers manufactured by the melting method, deflagration method, etc., the particles are formed in such a way that air is entrained during granulation, resulting in the generation of hollow fillers as unavoidable particles.
• Representative fillers containing hollow fillers include silica fillers and alumina fillers manufactured by the above-mentioned manufacturing methods. Therefore, from the viewpoint of fundamentally preventing the occurrence of hollow filler-derived dent defects, it is most preferable to use a filler that does not generate hollow fillers during granulation, in other words, a filler that does not contain hollow fillers as unavoidable particles (a filler with a hollow filler content of 0 ppm). Examples of such fillers include fillers manufactured by wet methods (such as the sol-gel method).
• the hollow filler content is preferably 100 ppm or less, more preferably 50 ppm or less, and even more preferably 5 ppm or less, and the smaller the content value, the better.
• the hollow filler content is preferably 100 ppm or less based on the total amount of filler.
• a filler in which the content of hollow fillers with large hollow portions has been reduced in advance by precision classification processing such as destructive classification or wet classification can also be used.
• the content of the filler in the epoxy resin composition is preferably 50% to 95% by mass, more preferably 55% to 86% by mass, and even more preferably 60% to 84% by mass, from the viewpoint of lowering the thermal expansion coefficient of the cured product and facilitating the preparation of an epoxy resin composition with appropriate fluidity.
• the epoxy resin composition of this embodiment may further contain other components other than the above components (A) to (C) as necessary.
• the other components are not particularly limited, but examples thereof include ion trapping agents, leveling agents, antioxidants, antifoaming agents, flame retardants, colorants, reactive diluents, elastomers, etc.
• the amount of the other components to be added can be appropriately selected depending on the type of the other components.
• the epoxy resin composition of this embodiment is prepared by mixing and stirring the components (A) to (C) and the other components (D) used as necessary.
• known mixing and stirring means such as a roll mill or a planetary mixer can be appropriately used.
• all the components constituting the epoxy resin composition may be mixed and stirred at the same time, or a primary mixture obtained by mixing and stirring only some of the components may be prepared, and the remaining components may be further added to this primary mixture and mixed and stirred. If the content of the filler used in the preparation of the epoxy resin composition exceeds 86 mass%, depending on the type and amount of components other than the filler, the mixing and stirring device used for mixing and stirring, and the conditions thereof, it may be difficult to prepare the epoxy resin composition.
• the content of the filler used in the preparation of the epoxy resin is 86 mass% or less, and more preferably to set it to 84 mass% or less.
• the viscosity of the epoxy resin composition of this embodiment at room temperature (25°C) is preferably 1 Pa ⁇ s to 1000 Pa ⁇ s, more preferably 5 Pa ⁇ s to 800 Pa ⁇ s, and even more preferably 7 Pa ⁇ s to 700 Pa ⁇ s.
• the epoxy resin composition of this embodiment can also be suitably used in a process for manufacturing an electromagnetic component mounting structure such as a semiconductor device, by encapsulating an electronic component such as a semiconductor device with a cured product of the epoxy resin composition, polishing the surface of the cured product, and then forming a rewiring layer on the polished surface formed on the surface of the cured product.
• the epoxy resin composition of this embodiment is an epoxy resin composition for compression molding, which manufactures an electromagnetic component mounting structure by a compression molding method in the above process.
• the electronic component mounting structure of this embodiment includes an electronic component, a cured product of an epoxy resin composition having a polished surface on its surface and sealing the electronic component, and a rewiring layer formed on the polished surface of the cured product.
• the epoxy resin composition includes (A) an epoxy resin, (B) at least one component selected from the group consisting of a curing agent and a curing accelerator, and (C) a filler.
• the average density of dents having a diameter of 0.5 ⁇ m or more observed on the polished surface is 1.0 pieces/ mm2 or less.
• a semiconductor element is a representative example of the electronic component, various electronic elements other than the semiconductor element can of course be used.
• a semiconductor device is a representative example of the electronic component mounting structure.
• the method for manufacturing an electronic component mounting structure of this embodiment includes a sealing step of sealing with a cured product of an epoxy resin composition containing (A) an epoxy resin, (B) at least one component selected from the group consisting of a curing agent and a curing accelerator, and (C) a filler, a polished surface forming step of polishing the surface of the cured product to form a polished surface, and a rewiring layer forming step of forming a rewiring layer on the polished surface.
• the average density of dents with a diameter of 0.5 ⁇ m or more observed on the polished surface is 1.00 pieces/ mm2 or less. It is preferable that the sealing step is performed by a compression molding method.
• the average density of dents having a diameter of 0.5 ⁇ m or more is preferably 0.80 pieces/mm 2 or less, more preferably 0.60 pieces/mm 2 or less, even more preferably 0.30 pieces/mm 2 or less, particularly preferably 0.18 pieces/mm 2 or less, and most preferably 0 pieces/mm 2. If the average density of dents having a diameter of 0.5 ⁇ m or more exceeds 0 pieces/mm 2 , there is a possibility that dents having a larger diameter are formed on the polished surface.
• the average density of dents having a diameter of 1.5 ⁇ m to 5.0 ⁇ m is preferably 0.02 pieces/mm 2 or less, more preferably 0.01 pieces/mm 2 , and even more preferably 0 pieces/mm 2. From the same viewpoint, the average density of dents having a diameter of more than 5.0 ⁇ m is also preferably 0 pieces/mm 2 .
• the polished surface is formed by performing a polishing process using a slurry containing an inorganic abrasive with an average particle size of 0.5 ⁇ m or less (more preferably 0.1 ⁇ m or less) as a final polish.
• the polishing conditions for forming the polished surface are not particularly limited, except for the above conditions for the final polish.
• a multi-step polishing process may be performed, or only a single-step polishing process (i.e., only the final polish) may be performed, but in practice, it is preferable to perform a multi-step polishing process. In this case, it is preferable to perform a polishing process that causes less mechanical damage to the polished surface, such as by reducing the particle size of the abrasive contained in the slurry used as the steps progress.
• the material of the inorganic abrasive contained in the slurry can be any known material without particular restrictions, such as diamond, alumina, or silica. It is preferable to use a slurry containing an inorganic abrasive made of diamond.
• Epoxy Resin Compositions The epoxy resin compositions of Examples 1 to 18 and Comparative Example 1 were prepared by mixing and stirring the raw materials using a roll mill so as to obtain the blending ratios shown in Tables 1 and 2. Details of the components (A) to (C) used as the raw materials are as follows.
• the filler used as component (C) was a commercially available filler that was used as is without classification treatment.
• Epoxy resin/Epoxy resin A (YDF8170, bisphenol F type liquid epoxy resin, manufactured by Nippon Steel Chemical & Material Co., Ltd., epoxy equivalent 158 g/eq)
• Epoxy resin B (jER630, aminophenol type liquid epoxy resin, manufactured by Mitsubishi Chemical Corporation, epoxy equivalent 98 g/eq)
• Epoxy resin C (Epogose PT general grade, polytetramethylene glycol diglycidyl ether, manufactured by Yokkaichi Synthetic Co., Ltd., epoxy equivalent 440 g/eq)
• Epoxy resin D (RE410S, bisphenol A type liquid epoxy resin, manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 178 g/eq)
• Curing agent A HN-2200, acid anhydride curing agent, manufactured by Showa Denko Materials Co., Ltd.
• Curing accelerator A (2P4MZ, 2-phenyl-4-methylimidazole, manufactured by Shikoku Chemical Industry Co., Ltd.
• Curing accelerator B (2MZA, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, manufactured by Shikoku Chemical Industry Co., Ltd.)
• Filler A Silica filler (average particle size 1.8 ⁇ m, maximum particle size 5.0 ⁇ m, filler manufacturing method: deflagration method), product name SE605H-SMG, manufactured by Admatechs Co., Ltd.
• Filler B Silica filler (average particle size 0.3 ⁇ m, maximum particle size 1.0 ⁇ m, filler manufacturing method: deflagration method), product name SE101G-SMO, manufactured by Admatechs Co., Ltd.
• Filler C Silica filler (average particle size 0.5 ⁇ m, maximum particle size 0.7 ⁇ m
• Filler D Silica filler (average particle size 0.6 ⁇ m, maximum particle size 3.0 ⁇ m, filler manufacturing method: deflagration method), product name SE203G-SEJ, manufactured by Admatechs Co., Ltd.
• Filler E Silica filler (average particle size 10.0 ⁇ m, maximum particle size 20.0 ⁇ m, filler manufacturing method: deflagration method), product name STW7010-20, manufactured by Nippon Steel Chemical & Material Co., Ltd.)
• Filler F Silica filler (average particle size 2.0 ⁇ m, maximum particle size 10.0 ⁇ m, filler manufacturing method: deflagration method), product name SE6200, manufactured by Admatechs Co., Ltd.)
• Filler G Silica filler (average particle size 4.0 ⁇ m, maximum particle size 10.0 ⁇ m, filler manufacturing method: melting method), product name 40SM-E2, manufactured by Admatechs Co., Ltd.)
• Filler H Silica filler (average particle size 5.0 ⁇ m, maximum particle size 25.0 ⁇ m, filler manufacturing method: melting method), product name FB5SDX, manufactured by Denka Co., Ltd.)
• polishing conditions for forming a polished surface (polished surface area of the cured product: length x width: 1 mm x 1 mm) by polishing the surface of the sample to be polished are as follows:
• Step 1 Abrasive materials: Water-resistant abrasive paper #600 Polishing time 3 minutes
• Step 2 Polishing material: Diamond slurry (Engis Japan Co., Ltd., 6-PC, 6 ⁇ slurry (particle size range: 4-8 ⁇ m)) Polishing time 6 minutes
• Step 3 Polishing material: Diamond slurry (Engis Japan Co., Ltd., 1-PC, 1 ⁇ slurry (particle size range: 0-2 ⁇ m)) Polishing time 3 minutes
• Step 4 (Final Polish): Polishing material: Diamond slurry (Master prep, manufactured by BUEHLER, average particle size 0.05 ⁇ m) Polishing time: 2 minutes
• the polished surface of the observation sample was observed using a scanning electron microscope (S-3400N, Hitachi High-Tech Fielding Corporation) at a magnification of 2000 times and an accelerating voltage of 15 kV.
• the observation range was the entire polished surface (length: 1 mm ⁇ width: 1 mm) of the cured material embedded in the observation sample.
• the average particle size and maximum particle size of the filler used in the preparation of the epoxy resin composition of each Example and Comparative Example were measured by the following procedure using a laser diffraction particle size distribution measuring device (LS13320, manufactured by Beckman Coulter, Inc.). First, a measurement sample was prepared by mixing 5 mg of filler with 50 mg of a dispersant (aqueous solution in which 0.5 mass % of Aerosol OT (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) was added to pure water) and dispersing for 10 minutes using an ultrasonic disperser.
• a dispersant aqueous solution in which 0.5 mass % of Aerosol OT (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) was added to pure water
• volume-based average particle size D50 particle size that is 50% cumulative from the small diameter side of the volume-based particle size distribution
• the volume-based average particle size D99.95 particle size that is 99.95% cumulative from the small diameter side of the volume-based particle size distribution
• Viscosity of Epoxy Resin Composition The viscosity of the epoxy resin composition of each of the Examples and Comparative Examples was measured immediately after preparation of the epoxy resin composition using a Brookfield HB-DV viscometer (model: HB-DV1) at a liquid temperature of 25°C and a rotation speed of 10 rpm.
• Hollow filler content in the filler was measured by the following procedure. First, 40 g of Solmix AP-1 (organic solvent, mixture of ethanol/methanol/IPA (isopropyl alcohol), manufactured by Japan Alcohol Sales Co., Ltd.) and 10 g of filler were weighed into the same sample bottle, and the mixture was prepared by stirring with a stirrer at a rotation speed of 2000 rpm for 2 minutes. After stirring, the sample bottle removed from the stirrer was left to stand for 24 hours in an environment at a temperature of 25 ° C. After standing, the filler floating on the liquid surface of the mixture in the sample bottle was collected with a dropper together with the mixture and placed in a container of known weight.
• Solmix AP-1 organic solvent, mixture of ethanol/methanol/IPA (isopropyl alcohol), manufactured by Japan Alcohol Sales Co., Ltd.
• the container containing the wet filler was placed in a dryer set to 150 ° C. and heated to volatilize the solvent (Solmix AP-1) contained in the wet filler to obtain a dried product (residue).
• the weight of the container containing the residue was measured, and the weight of the residue was calculated from the difference between this weight and the weight of the container.
• the weight ratio (ppm) of the residue obtained from 10 g of the filler was calculated as the content of hollow filler particles in the filler.
• Table 1-2 shows the composition of the epoxy resin composition, as well as the average particle size, maximum particle size, and hollow filler content of the filler used, the viscosity of the epoxy resin composition, the average density of pits with a diameter of 0.5 ⁇ m or more, and the average density of pits with a diameter of 1.5 ⁇ m to 5.0 ⁇ m. It was found from the observation of the polished surface with a scanning electron microscope that the majority of the pits with a diameter of 0.5 ⁇ m or more observed on the polished surface in each of the Examples and Comparative Examples were due to hollow fillers. Furthermore, no pits with a diameter of more than 5.0 ⁇ m were observed in any of the Examples.

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