TW202319431A - 環氧樹脂組成物 - Google Patents

環氧樹脂組成物 Download PDF

Info

Publication number
TW202319431A
TW202319431A TW111130796A TW111130796A TW202319431A TW 202319431 A TW202319431 A TW 202319431A TW 111130796 A TW111130796 A TW 111130796A TW 111130796 A TW111130796 A TW 111130796A TW 202319431 A TW202319431 A TW 202319431A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
compound
present
epoxy
Prior art date
Application number
TW111130796A
Other languages
English (en)
Chinese (zh)
Inventor
齊藤篤志
Original Assignee
日商納美仕有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW202319431A publication Critical patent/TW202319431A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
TW111130796A 2021-08-20 2022-08-16 環氧樹脂組成物 TW202319431A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-134823 2021-08-20
JP2021134823 2021-08-20

Publications (1)

Publication Number Publication Date
TW202319431A true TW202319431A (zh) 2023-05-16

Family

ID=85240599

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111130796A TW202319431A (zh) 2021-08-20 2022-08-16 環氧樹脂組成物

Country Status (3)

Country Link
JP (1) JPWO2023022148A1 (https=)
TW (1) TW202319431A (https=)
WO (1) WO2023022148A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6447868B2 (ja) * 2014-12-22 2019-01-09 株式会社スリーボンド 嫌気硬化性接着剤
CN107987287B (zh) * 2017-11-15 2020-09-25 中山光禾医疗科技有限公司 光致亚硝基交联水凝胶材料及其制备方法与应用
CN112442256B (zh) * 2020-11-03 2021-12-17 南京大学 一种环氧树脂基高分子材料及其制备方法和应用

Also Published As

Publication number Publication date
JPWO2023022148A1 (https=) 2023-02-23
WO2023022148A1 (ja) 2023-02-23

Similar Documents

Publication Publication Date Title
TWI815031B (zh) 環氧樹脂組成物
TWI826714B (zh) 環氧樹脂組成物
JP6603004B1 (ja) エポキシ樹脂組成物
KR102699841B1 (ko) 에폭시 수지 조성물
JP2019156965A (ja) エポキシ樹脂組成物
KR102187495B1 (ko) 에폭시 수지 조성물
WO2025023048A1 (ja) エポキシ樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
WO2025023051A1 (ja) エポキシ樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
TW202319431A (zh) 環氧樹脂組成物
JP7217565B1 (ja) 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
EP4289821A1 (en) Charge transfer complex
KR102129331B1 (ko) 에폭시 수지 조성물
JP2021031666A (ja) エポキシ樹脂組成物
JP7217566B1 (ja) 樹脂組成物、接着剤、封止材、硬化物及び半導体装置
KR102187518B1 (ko) 에폭시 수지 조성물
JP2024147840A (ja) エポキシ樹脂組成物
WO2024090259A1 (ja) 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品