JPWO2022246137A5 - - Google Patents

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Publication number
JPWO2022246137A5
JPWO2022246137A5 JP2023571443A JP2023571443A JPWO2022246137A5 JP WO2022246137 A5 JPWO2022246137 A5 JP WO2022246137A5 JP 2023571443 A JP2023571443 A JP 2023571443A JP 2023571443 A JP2023571443 A JP 2023571443A JP WO2022246137 A5 JPWO2022246137 A5 JP WO2022246137A5
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Japan
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patent document
bonding
application publication
documents
document
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JP2023571443A
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Japanese (ja)
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JP2024519836A (ja
JP2024519836A5 (https=
JP7834780B2 (ja
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Priority claimed from PCT/US2022/030141 external-priority patent/WO2022246137A1/en
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Publication of JP2024519836A5 publication Critical patent/JP2024519836A5/ja
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JP2023571443A 2021-05-20 2022-05-19 ウェッジボンディング装置のカッター高さを決定および／または校正する方法、および関連するウェッジボンディング装置 Active JP7834780B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163191286P 2021-05-20 2021-05-20
US63/191,286 2021-05-20
PCT/US2022/030141 WO2022246137A1 (en) 2021-05-20 2022-05-19 Methods of determining and/or calibrating a cutter height on a wedge bonding machine, and related wedge bonding machines

Publications (4)

Publication Number Publication Date
JP2024519836A JP2024519836A (ja) 2024-05-21
JPWO2022246137A5 true JPWO2022246137A5 (https=) 2025-05-27
JP2024519836A5 JP2024519836A5 (https=) 2025-05-27
JP7834780B2 JP7834780B2 (ja) 2026-03-24

Family

ID=84102624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023571443A Active JP7834780B2 (ja) 2021-05-20 2022-05-19 ウェッジボンディング装置のカッター高さを決定および／または校正する方法、および関連するウェッジボンディング装置

Country Status (5)

Country Link
US (1) US12485565B2 (https=)
EP (1) EP4341992A4 (https=)
JP (1) JP7834780B2 (https=)
CN (1) CN117337485A (https=)
WO (1) WO2022246137A1 (https=)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2584017B2 (ja) * 1988-11-04 1997-02-19 松下電器産業株式会社 ワイヤボンダのデータ処理方法
JP4201249B2 (ja) * 2002-10-04 2008-12-24 トヨタ自動車株式会社 ワイヤに切り込みを形成する装置のストッパ位置を調整するための冶具とストッパ位置の調整方法
JP3941706B2 (ja) * 2003-02-17 2007-07-04 トヨタ自動車株式会社 調整方法と冶具
JP4351956B2 (ja) * 2004-06-11 2009-10-28 超音波工業株式会社 ワイヤボンディング装置
EP1625911B1 (de) * 2004-08-11 2007-10-10 F&K Delvotec Bondtechnik GmbH Drahtbonder mit einer Kamera, einer Bildverarbeitungseinrichtung, Speichermittel und Vergleichermittel und Verfahren zum Betrieb eines solchen
US7454844B1 (en) * 2005-09-12 2008-11-25 Laszlo Ruby Sheetrock punch apparatus
US7762449B2 (en) * 2008-11-21 2010-07-27 Asm Assembly Automation Ltd Bond head for heavy wire bonder
WO2010090778A2 (en) * 2009-01-20 2010-08-12 Orthodyne Electronics Corporation Cutting blade for a wire bonding system
JP2011218607A (ja) * 2010-04-06 2011-11-04 Sharp Corp 基板分割装置および基板分割方法
US8919632B2 (en) * 2012-11-09 2014-12-30 Asm Technology Singapore Pte. Ltd. Method of detecting wire bonding failures
TWI518816B (zh) * 2013-07-04 2016-01-21 先進科技新加坡有限公司 用於在導線鍵合過程中測量無空氣球尺寸的方法和裝置
US10121759B2 (en) * 2015-11-04 2018-11-06 Kulicke And Soffa Industries, Inc. On-bonder automatic overhang die optimization tool for wire bonding and related methods
US10596803B2 (en) * 2017-05-30 2020-03-24 General Electric Company Calibration systems for calibrating recoater devices of additive manufacturing systems and related program products
CN209150143U (zh) * 2018-11-07 2019-07-23 佛山市国星光电股份有限公司 一种led器件
US11581285B2 (en) * 2019-06-04 2023-02-14 Kulicke And Soffa Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine

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