CN117337485A - 确定和/或校准楔焊机上的切割器高度的方法以及相关的楔焊机 - Google Patents

确定和/或校准楔焊机上的切割器高度的方法以及相关的楔焊机 Download PDF

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Publication number
CN117337485A
CN117337485A CN202280035787.8A CN202280035787A CN117337485A CN 117337485 A CN117337485 A CN 117337485A CN 202280035787 A CN202280035787 A CN 202280035787A CN 117337485 A CN117337485 A CN 117337485A
Authority
CN
China
Prior art keywords
cutter
wedge
height
wedge bonding
height measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280035787.8A
Other languages
English (en)
Chinese (zh)
Inventor
P·J·克雷尔内尔
E·T·斯克兰顿
K·G·巴尔特
J·D·J·洛扎诺德阿尔瓦
D·夏尔马
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kulicke and Soffa Industries Inc
Original Assignee
Kulicke and Soffa Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke and Soffa Industries Inc filed Critical Kulicke and Soffa Industries Inc
Publication of CN117337485A publication Critical patent/CN117337485A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2628—Means for adjusting the position of the cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26—Auxiliary equipment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Wire Bonding (AREA)
  • Basic Packing Technique (AREA)
CN202280035787.8A 2021-05-20 2022-05-19 确定和/或校准楔焊机上的切割器高度的方法以及相关的楔焊机 Pending CN117337485A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163191286P 2021-05-20 2021-05-20
US63/191,286 2021-05-20
PCT/US2022/030141 WO2022246137A1 (en) 2021-05-20 2022-05-19 Methods of determining and/or calibrating a cutter height on a wedge bonding machine, and related wedge bonding machines

Publications (1)

Publication Number Publication Date
CN117337485A true CN117337485A (zh) 2024-01-02

Family

ID=84102624

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280035787.8A Pending CN117337485A (zh) 2021-05-20 2022-05-19 确定和/或校准楔焊机上的切割器高度的方法以及相关的楔焊机

Country Status (5)

Country Link
US (1) US12485565B2 (https=)
EP (1) EP4341992A4 (https=)
JP (1) JP7834780B2 (https=)
CN (1) CN117337485A (https=)
WO (1) WO2022246137A1 (https=)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2584017B2 (ja) * 1988-11-04 1997-02-19 松下電器産業株式会社 ワイヤボンダのデータ処理方法
JP4201249B2 (ja) * 2002-10-04 2008-12-24 トヨタ自動車株式会社 ワイヤに切り込みを形成する装置のストッパ位置を調整するための冶具とストッパ位置の調整方法
JP3941706B2 (ja) * 2003-02-17 2007-07-04 トヨタ自動車株式会社 調整方法と冶具
JP4351956B2 (ja) * 2004-06-11 2009-10-28 超音波工業株式会社 ワイヤボンディング装置
EP1625911B1 (de) * 2004-08-11 2007-10-10 F&K Delvotec Bondtechnik GmbH Drahtbonder mit einer Kamera, einer Bildverarbeitungseinrichtung, Speichermittel und Vergleichermittel und Verfahren zum Betrieb eines solchen
US7454844B1 (en) * 2005-09-12 2008-11-25 Laszlo Ruby Sheetrock punch apparatus
US7762449B2 (en) * 2008-11-21 2010-07-27 Asm Assembly Automation Ltd Bond head for heavy wire bonder
WO2010090778A2 (en) * 2009-01-20 2010-08-12 Orthodyne Electronics Corporation Cutting blade for a wire bonding system
JP2011218607A (ja) * 2010-04-06 2011-11-04 Sharp Corp 基板分割装置および基板分割方法
US8919632B2 (en) * 2012-11-09 2014-12-30 Asm Technology Singapore Pte. Ltd. Method of detecting wire bonding failures
TWI518816B (zh) * 2013-07-04 2016-01-21 先進科技新加坡有限公司 用於在導線鍵合過程中測量無空氣球尺寸的方法和裝置
US10121759B2 (en) * 2015-11-04 2018-11-06 Kulicke And Soffa Industries, Inc. On-bonder automatic overhang die optimization tool for wire bonding and related methods
US10596803B2 (en) * 2017-05-30 2020-03-24 General Electric Company Calibration systems for calibrating recoater devices of additive manufacturing systems and related program products
CN209150143U (zh) * 2018-11-07 2019-07-23 佛山市国星光电股份有限公司 一种led器件
US11581285B2 (en) * 2019-06-04 2023-02-14 Kulicke And Soffa Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine

Also Published As

Publication number Publication date
EP4341992A4 (en) 2025-07-09
EP4341992A1 (en) 2024-03-27
WO2022246137A1 (en) 2022-11-24
US20220371215A1 (en) 2022-11-24
US12485565B2 (en) 2025-12-02
JP2024519836A (ja) 2024-05-21
WO2022246137A8 (en) 2023-01-19
JP7834780B2 (ja) 2026-03-24

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