JP7834780B2 - ウェッジボンディング装置のカッター高さを決定および／または校正する方法、および関連するウェッジボンディング装置 - Google Patents

ウェッジボンディング装置のカッター高さを決定および／または校正する方法、および関連するウェッジボンディング装置

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Publication number
JP7834780B2
JP7834780B2 JP2023571443A JP2023571443A JP7834780B2 JP 7834780 B2 JP7834780 B2 JP 7834780B2 JP 2023571443 A JP2023571443 A JP 2023571443A JP 2023571443 A JP2023571443 A JP 2023571443A JP 7834780 B2 JP7834780 B2 JP 7834780B2
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Japan
Prior art keywords
cutter
wedge bonding
height
determining
height measurement
Prior art date
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Active
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JP2023571443A
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English (en)
Japanese (ja)
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JPWO2022246137A5 (https=
JP2024519836A (ja
JP2024519836A5 (https=
Inventor
クラーナー、ピーター、ジュリアス
スクラントン、エリック、ティー．
バルテ、カーシック、グンダッパ
デ アルバ、ホセ、デ ヘスス ロサーノ
シャルマ、ディビッシュ
Original Assignee
クリック アンド ソッファ インダストリーズ、インク．
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Application filed by クリック アンド ソッファ インダストリーズ、インク． filed Critical クリック アンド ソッファ インダストリーズ、インク．
Publication of JP2024519836A publication Critical patent/JP2024519836A/ja
Publication of JPWO2022246137A5 publication Critical patent/JPWO2022246137A5/ja
Publication of JP2024519836A5 publication Critical patent/JP2024519836A5/ja
Application granted granted Critical
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2628—Means for adjusting the position of the cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26—Auxiliary equipment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Wire Bonding (AREA)
  • Basic Packing Technique (AREA)
JP2023571443A 2021-05-20 2022-05-19 ウェッジボンディング装置のカッター高さを決定および／または校正する方法、および関連するウェッジボンディング装置 Active JP7834780B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163191286P 2021-05-20 2021-05-20
US63/191,286 2021-05-20
PCT/US2022/030141 WO2022246137A1 (en) 2021-05-20 2022-05-19 Methods of determining and/or calibrating a cutter height on a wedge bonding machine, and related wedge bonding machines

Publications (4)

Publication Number Publication Date
JP2024519836A JP2024519836A (ja) 2024-05-21
JPWO2022246137A5 JPWO2022246137A5 (https=) 2025-05-27
JP2024519836A5 JP2024519836A5 (https=) 2025-05-27
JP7834780B2 true JP7834780B2 (ja) 2026-03-24

Family

ID=84102624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023571443A Active JP7834780B2 (ja) 2021-05-20 2022-05-19 ウェッジボンディング装置のカッター高さを決定および／または校正する方法、および関連するウェッジボンディング装置

Country Status (5)

Country Link
US (1) US12485565B2 (https=)
EP (1) EP4341992A4 (https=)
JP (1) JP7834780B2 (https=)
CN (1) CN117337485A (https=)
WO (1) WO2022246137A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004122323A (ja) 2002-10-04 2004-04-22 Toyota Motor Corp 治具と調整方法
JP2004247693A (ja) 2003-02-17 2004-09-02 Toyota Motor Corp 調整方法と冶具
JP2005353901A (ja) 2004-06-11 2005-12-22 Ultrasonic Engineering Co Ltd ワイヤボンディング装置
US20100127045A1 (en) 2008-11-21 2010-05-27 Chi Wah Cheng Bond head for heavy wire bonder
KR20170052484A (ko) 2015-11-04 2017-05-12 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 와이어 본딩을 위한 본더 상의 돌출 다이 자동 최적화 툴 및 관련 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2584017B2 (ja) * 1988-11-04 1997-02-19 松下電器産業株式会社 ワイヤボンダのデータ処理方法
EP1625911B1 (de) * 2004-08-11 2007-10-10 F&K Delvotec Bondtechnik GmbH Drahtbonder mit einer Kamera, einer Bildverarbeitungseinrichtung, Speichermittel und Vergleichermittel und Verfahren zum Betrieb eines solchen
US7454844B1 (en) * 2005-09-12 2008-11-25 Laszlo Ruby Sheetrock punch apparatus
WO2010090778A2 (en) * 2009-01-20 2010-08-12 Orthodyne Electronics Corporation Cutting blade for a wire bonding system
JP2011218607A (ja) * 2010-04-06 2011-11-04 Sharp Corp 基板分割装置および基板分割方法
US8919632B2 (en) * 2012-11-09 2014-12-30 Asm Technology Singapore Pte. Ltd. Method of detecting wire bonding failures
TWI518816B (zh) * 2013-07-04 2016-01-21 先進科技新加坡有限公司 用於在導線鍵合過程中測量無空氣球尺寸的方法和裝置
US10596803B2 (en) * 2017-05-30 2020-03-24 General Electric Company Calibration systems for calibrating recoater devices of additive manufacturing systems and related program products
CN209150143U (zh) * 2018-11-07 2019-07-23 佛山市国星光电股份有限公司 一种led器件
US11581285B2 (en) * 2019-06-04 2023-02-14 Kulicke And Soffa Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004122323A (ja) 2002-10-04 2004-04-22 Toyota Motor Corp 治具と調整方法
JP2004247693A (ja) 2003-02-17 2004-09-02 Toyota Motor Corp 調整方法と冶具
JP2005353901A (ja) 2004-06-11 2005-12-22 Ultrasonic Engineering Co Ltd ワイヤボンディング装置
US20100127045A1 (en) 2008-11-21 2010-05-27 Chi Wah Cheng Bond head for heavy wire bonder
KR20170052484A (ko) 2015-11-04 2017-05-12 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 와이어 본딩을 위한 본더 상의 돌출 다이 자동 최적화 툴 및 관련 방법
JP2017092464A (ja) 2015-11-04 2017-05-25 クリック アンド ソッファ インダストリーズ、インク． ワイヤーボンディングのためのボンダー上の自動オーバーハングダイ最適化ツールと関連する方法

Also Published As

Publication number Publication date
EP4341992A4 (en) 2025-07-09
EP4341992A1 (en) 2024-03-27
WO2022246137A1 (en) 2022-11-24
US20220371215A1 (en) 2022-11-24
US12485565B2 (en) 2025-12-02
JP2024519836A (ja) 2024-05-21
WO2022246137A8 (en) 2023-01-19
CN117337485A (zh) 2024-01-02

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