JP4335751B2 - ワイヤボンディング装置 - Google Patents
ワイヤボンディング装置 Download PDFInfo
- Publication number
- JP4335751B2 JP4335751B2 JP2004174249A JP2004174249A JP4335751B2 JP 4335751 B2 JP4335751 B2 JP 4335751B2 JP 2004174249 A JP2004174249 A JP 2004174249A JP 2004174249 A JP2004174249 A JP 2004174249A JP 4335751 B2 JP4335751 B2 JP 4335751B2
- Authority
- JP
- Japan
- Prior art keywords
- cutter
- cutting
- bonding
- contact
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7855—Mechanical means, e.g. for severing, pressing, stamping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
2 ワイヤガイド
3 カッタ
4 超音波振動系
5 カッタ駆動機構
8 マイクロコンピュータ
11 カッタホルダ
12 電動アクチュエータ
13 アーム
19 変位センサ
25 出力軸
26 動力伝達部
27 連結部
28 第1の係合部
29 第2の係合部
31 先端部、31a 動力伝達面
32 ストッパ、32a 規制面
33 係合部
A ボンディングワイヤ
Claims (2)
- ボンディングワイヤに切り込みを入れるカッタと、
このカッタに切り込み動作を行わせるカッタ駆動手段と、
前記カッタの刃先がボンディングワイヤに接触したことを検知する接触検知手段と、
この接触検知手段により検知した接触位置を基準にして前記カッタ駆動手段の動作を制御する制御手段とを有することを特徴とするワイヤボンディング装置。 - 前記カッタの変位量を検出する変位量検出手段をさらに有し、
前記カッタ駆動手段が、切り込み抵抗力を下回る力で前記カッタに進行動作を行わせる第1のカッタ駆動手段と、切り込み抵抗力を上回る力で前記カッタに切り込み動作を行わせる第2のカッタ駆動手段とからなり、
前記接触検知手段が、前記変位量検出手段により検出された変位量に基づいて、前記第1のカッタ駆動手段により進行動作する前記カッタがボンディングワイヤに接触することにより停止した接触停止状態を判別することを特徴とする請求項1に記載のワイヤボンディング装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004174249A JP4335751B2 (ja) | 2004-06-11 | 2004-06-11 | ワイヤボンディング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004174249A JP4335751B2 (ja) | 2004-06-11 | 2004-06-11 | ワイヤボンディング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005353903A JP2005353903A (ja) | 2005-12-22 |
JP4335751B2 true JP4335751B2 (ja) | 2009-09-30 |
Family
ID=35588099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004174249A Expired - Fee Related JP4335751B2 (ja) | 2004-06-11 | 2004-06-11 | ワイヤボンディング装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4335751B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6420704B2 (ja) | 2015-03-30 | 2018-11-07 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
TWI650625B (zh) * | 2017-11-16 | 2019-02-11 | 財團法人工業技術研究院 | 刀具磨耗檢測裝置、其檢測方法及刀具磨耗補償方法 |
-
2004
- 2004-06-11 JP JP2004174249A patent/JP4335751B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005353903A (ja) | 2005-12-22 |
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