Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
  • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
  • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
  • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
  • B26D7/2628—Means for adjusting the position of the cutting member
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
  • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
  • B23K20/26—Auxiliary equipment
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/04—Apparatus for manufacture or treatment
  • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2101/00—Articles made by soldering, welding or cutting
  • B23K2101/36—Electric or electronic devices
  • B23K2101/42—Printed circuits

Definitions

• the invention relates to methods of determining and/or calibrating a cutter height on a wedge bonding machine, and related wedge bonding machines.
• wire and ribbon bonding are widely adopted technologies using a wire bonding machine.
• various types of energy e.g., ultrasonic energy, thermosonic energy, thermocompressive energy, etc.
• ultrasonic energy e.g., ultrasonic energy, thermosonic energy, thermocompressive energy, etc.
• a wire loop is a structure including at least a first bond portion and a second bond.
• Exemplary conductive materials used for the wire/ribbon in conventional wire bonding include aluminum, copper, gold, among others.
• a cutter tool may be used to cut a wire or ribbon after forming a wire structure (e.g., a wire loop).
• a wire structure e.g., a wire loop
• Such a cutter has a relative height on a wedge bonding machine (e.g., relative to a wedge bonding tool). This relative height may change, for example, by wear and/or by cutter replacement.
• a method of determining a cutter height on a wedge bonding machine includes the steps of: (a) lowering a wedge bonding tool toward a surface on the wedge bonding machine; (b) determining a first height measurement when the wedge bonding tool contacts the surface; (c) lowering a cutter of the wedge bonding machine, relative to the wedge bonding tool; (d) determining a second height measurement when the cutter contacts the surface; and (e) determining a cutter height using the first height measurement and the second height measurement.
• another method of determining a cutter height on a wedge bonding machine includes the steps of: (a) moving a wedge bonding tool toward a surface on the wedge bonding machine, the surface being integrated with a spring assembly; (b) determining a first height measurement when the wedge bonding tool contacts the surface; (c) compressing a spring portion of the spring assembly by lowering the wedge bonding tool further downward after contact between the wedge bonding tool and the surface; (d) raising the wedge bonding tool, and the surface, while extending the spring portion after step (c) until the cutter is in contact with the surface; (e) determining a second height measurement when the cutter contacts the surface; and (f) determining a cutter height using the first height measurement and the second height measurement.
• another method of determining a cutter height on a wedge bonding machine includes the steps of: (a) lowering a wedge bonding tool toward a surface on the wedge bonding machine, the surface being integrated with a spring assembly; (b) compressing a spring portion of the spring assembly by lowering the wedge bonding tool further downward after contact between the wedge bonding tool and the surface; (c) compressing a spring portion of the spring assembly by lowering the wedge bonding tool further downward after contact between the wedge bonding tool and the surface; and (d) determining a height measurement when the cutter contacts the surface.
• another method of determining a cutter height on a wedge bonding machine includes the steps of: (a) moving at least one of a wedge bonding tool and a surface on the wedge bonding machine relative to one another; (b) determining a first height measurement when the wedge bonding tool contacts the surface; (c) moving at least one of a cutter of the wedge bonding machine and the surface relative to one another; (d) determining a second height measurement when the cutter contacts the surface; and (e) determining a cutter height using the first height measurement and the second height measurement.
• a method of determining a cutting profile of a cutter on a wedge bonding machine includes the steps of: (a) determining a cutter height on the wedge bonding machine; and (b) determining a cutting profile of a cutter on the wedge bonding machine using the cutter height determined in step (a).
• wedge bonding machines are provided. Such wedge bonding machines include elements referenced above in connection with the methods of determining the cutter height on the wedge bonding machine. Such wedge bonding machines may include any other element referenced in the present application including, for example, a load cell for detecting contact between the wedge bonding tool (and/or the cutter) and the surface, an electrical detection system for detecting electrical continuity between the wedge bonding tool (and/or the cutter) and the surface, a spring assembly including a surface described herein, etc.
• FIG. 1 is a block diagram side view of a wedge bonding machine useful for performing methods in connection with various exemplary embodiments of the invention
• FIGS. 2A-2D are a series of block diagrams illustrating a method of determining a cutter height on a wedge bonding machine in accordance with an exemplary embodiment of the invention
• FIGS. 3A-3E are a series of block diagrams illustrating another method of determining a cutter height on a wedge bonding machine in accordance with an exemplary embodiment of the invention
• FIGS. 3F-3I are a series of block diagrams illustrating yet another method of determining a cutter height on a wedge bonding machine in accordance with an exemplary embodiment of the invention.
• FIGS. 4A-4D are a series of block diagrams illustrating yet another method of determining a cutter height on a wedge bonding machine in accordance with an exemplary embodiment of the invention.
• FIGS. 5A-5D are a series of block diagrams illustrating a method of determining a cutting profile of a cutter on the wedge bonding machine, in accordance with an exemplary embodiment of the invention.
• FIGS. 6, 7A-7B, and 8 are flow diagrams illustrating various methods of determining a cutter height on a wedge bonding machine in accordance with various exemplary embodiments of the invention.
• FIG. 9 is a flow diagram illustrating a method of determining a cutting profile of a cutter on the wedge bonding machine, in accordance with an exemplary embodiment of the invention.
• a cutter height e.g., a relative cutter height of the cutter with respect to a wedge bonding tool
• the wedge bonding machine may be operated (e.g., programmed) to adjust to the changed value of the cutter height.
• aspects of the invention relate to determining the cutter height when changing from a prior cutter on the wedge bonding machine to a new cutter (e.g., the cutter may be considered a consumable part). According to other aspects of the invention, the cutter height may be determined at some predetermined interval.
• exemplary methods of the invention separate the distance into (i) the calibrated cutter height above the bond tool (which is relative to the start of cut of the wire/ribbon location) and (ii) the actual cut depth into the wire/ribbon.
• cutter calibration method separates the distance into (i) the calibrated cutter height above the bond tool (which is relative to the start of cut of the wire/ribbon location) and (ii) the actual cut depth into the wire/ribbon.
• Exemplary aspects of the invention involve using active force and/or position feedback to calibrate the cutter during setup.
• Such an approach may apply to both wire and ribbon cutting processes. For example: (i) bond tool followed by a cutter contacting a load cell - when contact is sensed the cutter position is read out; (ii) bond tool followed by a cutter contacting a hard surface using the motion control system's motor current as feedback mechanism; and (iii) bond tool followed by a cutter contacting a hard surface using the motion control system's following error as feedback mechanism.
• bond tool followed by a cutter contacting a load cell when contact is sensed the cutter position is read out
• bond tool followed by a cutter contacting a hard surface using the motion control system's motor current as feedback mechanism and
• bond tool followed by a cutter contacting a hard surface using the motion control system's following error as feedback mechanism are within the scope of the invention.
• cutter height is a distance between a contact portion of a wedge bonding tool and a tip portion of a cutter.
• the cutter height is labelled “RCH” (relative cutter height).
• the cutter height may be considered a relative height between the cutter and the wedge bonding tool.
• Exemplary ranges for the cutter height determined in accordance with aspects of the invention are: 100-2500 microns; 300-1500 microns; and 400-1200 microns. Of course, different cutter height ranges are contemplated.
• a cutting profile for the cutter may be determined, where such cutting profile may utilize the cutter height determined after a cutter change on the wedge bonding machine.
• the cutting profile includes an amount of cutting (e.g., cutting depth) to be applied in a given application.
• the cutting profile may also include other elements such as time and force (e.g., cutting depth vs. time, force applied during cutting, etc.). Another value that may be used in connection with determining the cutting profile is a height of the portion of a wire extending below a bonding surface of wedge tool (e.g., see hwire in FIGS. 5B-5D).
• FIG. 1 illustrates a wedge bonding machine 100.
• Wedge bonding machine 100 includes machine structure 102 (e.g., a workpiece support structure, or other structure) and a contact structure 104 on machine structure 102.
• Contact structure 104 includes surface 104e configured for use in connection with height measurements related to various aspects of the invention.
• Contact structure 104 may be a substrate or a workpiece configured to be wire bonded, or a different contact structure specifically configured for use in connection with the invention (e.g., a calibration or measurement station).
• Contact structure 104 may vary depending on the application (e.g., see contact structure 104' in FIGS. 2A-2D, contact structure 104" in FIGS. 3A-3E and in FIGS. 3F-3I, contact structure 104"' in FIGS. 4A-4D, among others).
• contact structure 104 may include other exemplary elements such as: force (load) sensor 104a (e.g., for determining contact between wedge bonding tool 106 and surface 104e, and/or for determining contact between cutter 108 and surface 104a); electrical continuity detector 104b (e.g., for sensing completion of an electrical circuit including wedge bonding tool 106 and surface 104e, for determining contact therebetween, and/or for sensing completion of an electrical circuit including cutter 108 and surface 104e for determining contact therebetween); spring assembly 104c (e.g., see spring portion 150 of a spring assembly shown in FIGS. 3A-3E and in FIGS. 3F-3I); and contact structure motion system 104d (e.g., for moving the contact structure along a z-axis, as in FIGS. 4B-4D).
• force (load) sensor 104a e.g., for determining contact between wedge bonding tool 106 and surface 104e, and/or for determining contact between cutter 108 and surface 104a
• Wedge bonding machine 100 also includes a bond head assembly 110 carrying wedge bonding tool 106 (including working end 106a having a contact surface 106al) and cutter 108 (including cutter tip 108a).
• Bond head assembly 110 is moved along a z-axis of the wedge bonding machine 100 using a z-axis motion system 114.
• Cutter 108 may also be moved along the z-axis of the wedge bonding machine 100 using z-axis motion system 114; however, a cutter z-axis motion system 116 may optionally be included to move the cutter along the z-axis (instead of, or in addition to, using z-axis motion system 114).
• Bond head assembly 110 includes transducer 110a, and may include one or more of the following: force (load) sensor 110b (e.g., for determining contact between wedge bonding tool 106 and surface 104e, and/or for determining contact between cutter 108 and surface 104e); electrical continuity detector 110c (e.g., for sensing completion of an electrical circuit including wedge bonding tool 106 and surface 104e, for determining contact therebetween, and/or for sensing completion of an electrical circuit including cutter 108 and surface 104e for determining contact therebetween); z-axis position detector llOd (e.g., a z-axis encoder for determining a height of a portion of the z-axis motion system); overtravel z-axis position detector llOe (e.g., a z-axis encoder for determining a height of a portion of an overtravel mechanism of the z-axis motion system); and an overtravel mechanism llOf.
• force (load) sensor 110b e
• overtravel mechanism llOf provides for independent certain movement of the cutter with respect to a wedge bonding tool.
• overtravel mechanism llOf allows for cutter 108 to move downward independent of wedge bonding tool 106 as shown between FIG. 2C and FIG. 2D
• overtravel mechanism llOf allows for wedge bonding tool 106 to move upward independent of cutter 108 as shown between FIG. 3D and FIG. 3E
• overtravel mechanism llOf allows for wedge bonding tool 106 to move independent of cutter 108 as shown between FIG. 3H and FIG. 31
• overtravel mechanism llOf allows for wedge bonding tool 106 to move upward independent of cutter 108 as shown between FIG. 4C and FIG. 4D.
• Wedge bonding machine 100 also includes computer 112 (which represents one or more local or remote computing systems).
• Computer 112 communicates with z- axis motion system 114 and elements of bond head assembly 110 for data collection and control.
• computer 112 receives information (e.g., from an encoder) related to z-axis height measurements used to determine a cutter height).
• FIGS. 2A-2D are a series of block diagrams illustrating a method of determining a cutter height on wedge bonding machine 100.
• wedge bonding tool 106 (only tip portion 106a is shown in FIG. 2A) and cutter 108 are positioned above surface 104e' of contact structure 104'.
• wedge bonding tool 106 defines a groove 106b for receiving a wire, with a peak 106bl.
• FIG. 2B wedge bonding tool 106 is being lowered toward surface 104e' (e.g., using z-axis motion system 114).
• contact surface 106al of wedge bonding tool 106 has contacted surface 104e'.
• a first height measurement (hi) is determined at this time (e.g., using z-axis position detector llOd, such as an encoder of the z-axis motion system). Then, cutter 108 is lowered relative to wedge bonding tool 106 (e.g., using z-axis motion system 114 and overtravel mechanism llOf). For example, because of overtravel mechanism llOf (e.g., see FIG. 1), cutter 108 can be lowered after the contact shown in FIG. 2C. At FIG. 2D, tip portion 108a of cutter 108 contacts surface 104e'.
• a second height measurement (h2) is determined at this time (e.g., using z-axis position detector llOd, such as an encoder of the z-axis motion system). Using hi and h2, a cutter height may be determined.
• FIGS. 3A-3E are a series of block diagrams illustrating another method of determining a cutter height on wedge bonding machine 100.
• wedge bonding tool 106 (only tip portion 106a is shown in FIG. 3A) and cutter 108 are positioned above surface 104e" of contact structure 104".
• wedge bonding tool 106 defines a groove 106b for receiving a wire, with a peak 106bl.
• a spring assembly (including spring portion 150) is integrated with surface 104e".
• spring portion 150 is provided between contact structure 104" and machine structure 102".
• wedge bonding tool 106 is being lowered toward surface 104e" (e.g., using z-axis motion system 114).
• contact surface 106al of wedge bonding tool 106 has contacted surface 104e".
• a first height measurement (hi) is determined at this time (e.g., using z-axis position detector llOd, such as an encoder of the z-axis motion system).
• wedge bonding tool 106 is further lowered to compress spring portion 150 until an intermediate height is reached (i.e., labelled as hint in FIG. 3D).
• wedge bonding tool 106 and surface 104e" are raised.
• the force applied by z-axis motion system 114 may be reduced (e.g., incrementally) such that the spring force of spring portion 150 pushes upward.
• the force applied by z-axis motion system 114 may be shut off such that that the spring force of spring portion 150 pushes upward.
• spring portion 150 extends until tip portion 108a of cutter 108 is in contact with surface 104e" as shown in FIG. 3E.
• a second height measurement (h2) is determined at this time (e.g., using z-axis position detector llOd, such as an encoder of the z-axis motion system). Using hi and h2, a cutter height may be determined.
• a first height measurement and a second height measurement are determined and used to provide the cutter height.
• it is possible to measure the cutter height using a single height measurement e.g., because the measurement, such as an overtravel measurement, may begin at a known or zero reference value.
• wedge bonding tool 106 (only tip portion 106a is shown in FIG. 3A) and cutter 108 are positioned above surface 104e" of contact structure 104".
• wedge bonding tool defines a groove 106b for receiving a wire, with a peak 106bl.
• a spring assembly (including spring portion 150) is integrated with surface 104e". More specifically, spring portion 150 is provided between contact structure 104" and machine structure 102". In FIG. 3G, wedge bonding tool 106 is being lowered toward surface 104e" (e.g., using z-axis motion system 114). In FIG.
• cutter 108 is lowered, with respect to wedge bonding tool 106 and surface 104e", until tip portion 108a of cutter 108 is in contact with surface 104e" as shown in FIG. 31.
• a height measurement (hi) is determined at this time (e.g., using z-axis position detector llOd, such as an encoder of the z-axis motion system or an overtravel encoder). This height measurement may be considered the cutter height, or used to derive the cutter height.
• FIGS. 4A-4D are a series of block diagrams illustrating a method of determining a cutter height on wedge bonding machine 100, where wedge bonding machine includes a contact structure motion system 104d (e.g., see FIG. 1) for moving contact structure 104"'.
• wedge bonding tool 106 (only tip portion 106a is shown in FIG. 4A) and cutter 108 are positioned above surface 104e"' of contact structure 104"'.
• wedge bonding tool 106 defines a groove 106b for receiving a wire, with a peak 106bl.
• contact structure 104' is being raised toward wedge bonding tool 106 (e.g., using contact structure motion system 104d).
• contact surface 106al of wedge bonding tool 106 has contacted surface 104e'".
• a first height measurement (hi) is determined at this time (e.g., using z-axis position detector HOd, such as an encoder of the z-axis motion system).
• contact structure 104"' is further raised while in contact with wedge bonding tool 106 (by virtue of overtravel mechanism llOf); that is, contact structure 104"' is further raised using contact structure motion system 104d until surface 104e'" is in contact with tip portion 108a of cutter 108 (as shown in FIG. 4D).
• a second height measurement (h2) is determined at this time (e.g., using z-axis position detector HOd, such as an encoder of the z-axis motion system). Using hi and h2, a cutter height may be determined.
• the cutter height may be used in connection with subsequent cutting operations (e.g., in conjunction with a cutter depth value) on the wedge bonding machine.
• the cutter height may be used in connection with providing a cutting profile for a cutter on a wedge bonding machine.
• FIGS. 5A-5D illustrate an exemplary method of determining such a cutting profile.
• FIG. 5A indicates that a cutter height is determined (e.g., as in FIGS. 2A-2D,
• a wire 118 is engaged with wedge bonding tool 106.
• wedge bonding tool 106 (only tip portion 106a is shown in FIG. 5B) and cutter 108 are positioned above surface 120a of structure 120.
• wedge bonding tool 106 defines a groove 106b for receiving a wire 118, with a peak 106bl.
• wire 118 is engaged with wire bonding tool 106.
• a portion of wire 118 extends below contact surface 106al of wedge bonding tool 106.
• wire 118 The dimension of this portion of wire 118 is labelled as hwire in FIG. 5B.
• wedge bonding tool 106 is being lowered toward surface 120a (e.g., using z-axis motion system 114).
• wire 118 has contacted surface 120a.
• a height measurement is determined at this time (e.g., using z- axis position detector HOd, such as an encoder of the z-axis motion system). Using this height measurement, and the cutter height (at least including the first height measurement and the second height measurement determined in connected with the cutter height determination), a cutting profile may be determined.
• structure 120 including surface 120a shown in FIGS.
• FIGS. 6-8 are flow diagrams illustrating various exemplary methods of determining a cutter height on a wedge bonding machine in accordance with the invention.
• FIG. 9 is a flow diagram illustrating an exemplary method of determining a cutting profile of a cutter on a wedge bonding machine in accordance with the invention. As is understood by those skilled in the art, certain steps included in the flow diagrams may be omitted; certain additional steps may be added; and the order of the steps may be altered from the order illustrated - all within the scope of the invention.
• a wire is removed from engagement with a wedge bonding tool. That is, if a wire is engaged with (e.g., under the working end of the wedge bonding tool) the wedge bonding tool, that wire is removed from its location.
• a bond head e.g., carrying a wedge bonding tool and a cutter
• the test location may be, for example, any location as desired on the wedge bonding machine.
• a wedge bonding tool is lowered toward a surface on a wedge bonding machine (e.g., see FIG. 2B).
• a first height measurement is determined when the wedge bonding tool contacts the surface (e.g., see determination of height hi in FIG. 2C).
• the cutter is lowered relative to the wedge bonding tool, and at Step 610, a second height measurement is determined when the cutter contacts the surface (e.g., see determination of height h2 in FIG. 2D).
• a cutter height is determined using the first height measurement and the second height measurement (e.g., by determining the difference between the first height measurement and the second height measurement).
• a wire is removed from engagement with a wedge bonding tool. That is, if a wire is engaged with (e.g., under the working end of the wedge bonding tool) the wedge bonding tool, that wire is removed from its location.
• a bond head e.g., carrying a wedge bonding tool and a cutter
• the test location may be, for example, any location as desired on the wedge bonding machine.
• a wedge bonding tool is lowered toward a surface on a wedge bonding machine (e.g., see FIG. 3B), where the surface is integrated with a spring assembly.
• a first height measurement is determined when the wedge bonding tool contacts the surface (e.g., see determination of height hi in FIG. 3C).
• a spring portion of the spring assembly is compressed by lowering the wedge bonding tool further after contact between the wedge bonding tool and the surface (e.g., see FIG. 3D).
• the wedge bonding tool and the surface are raised, while extending the spring portion, after Step 708, until the cutter is in contact with the surface.
• a second height measurement is determined when the cutter contacts the surface (e.g., see determination of height h2 in FIG. 3E).
• a cutter height is determined using the first height measurement and the second height measurement (e.g., by determining the difference between the first height measurement and the second height measurement).
• a wire is removed from engagement with a wedge bonding tool. That is, if a wire is engaged with (e.g., under the working end of the wedge bonding tool) the wedge bonding tool, that wire is removed from its location.
• a bond head e.g., carrying a wedge bonding tool and a cutter
• the test location may be, for example, any location as desired on the wedge bonding machine.
• a wedge bonding tool is lowered toward a surface on a wedge bonding machine (e.g., see FIG. 3G, and contact at FIG.
• a spring portion of the spring assembly is compressed by lowering the wedge bonding tool further after contact between the wedge bonding tool and the surface (e.g., see FIG. 31).
• the cutter is lowered, with respect to the wedge bonding tool and the surface, until the cutter is in contact with the surface (e.g., also see FIG. 31).
• a height measurement is determined when the cutter contacts the surface (e.g., see height hi in FIG. 31). This height measurement is used to determine the cutter height.
• a wire is removed from engagement with a wedge bonding tool. That is, if a wire is engaged with (e.g., under the working end of the wedge bonding tool) the wedge bonding tool, that wire is removed from its location.
• a bond head e.g., carrying a wedge bonding tool and a cutter
• the test location may be, for example, any location as desired on the wedge bonding machine.
• at least one of a wedge bonding tool and a surface is moved relative to one another (see movement of wedge bonding tool 106 in FIG.
• a first height measurement is determined when the wedge bonding tool contacts the surface (e.g., see determination of height hi in FIG. 2C, or determination of height hi in FIG. 4C).
• at least one of a cutter and the surface is moved relative to one another (see movement of cutter 108 in FIG. 2D, or movement of surface 104e"' in FIG. 4D).
• a second height measurement is determined when the cutter contacts the surface (e.g., see determination of height h2 in FIG. 2D, or determination of height h2 in FIG. 4D).
• a cutter height is determined using the first height measurement and the second height measurement (e.g., by determining the difference between the first height measurement and the second height measurement).
• a wire is removed from engagement with a wedge bonding tool. That is, if a wire is engaged with (e.g., under the working end of the wedge bonding tool) the wedge bonding tool, that wire is removed from its location.
• a bond head e.g., carrying a wedge bonding tool and a cutter
• the test location may be, for example, any location as desired on the wedge bonding machine.
• a cutter height is determined on a wedge bonding machine. The cutter height may be determined using any technique as desired (e.g., the method of FIGS. 2A-2D, the method of FIGS. BA BE, the method of FIGS. 3F-3I, the method of FIGS. 4A-4D, among others).
• a cutting profile is determined using the cutter height determined in Step 904.
• Step 904 a wire is engaged with the wedge bonding tool (e.g., positioned under the working end of the wedge bonding tool) - essentially reversing Step 900. Then, the wedge bonding tool (with the wire engaged therewith) is lowered toward a surface on the wedge bonding machine (e.g., see FIG. 5C). Then, a height measurement is determined when the wire contacts the surface (e.g., the height at FIG.
• Step 906 the cutting profile of the cutter is determined using the cutter height (e.g., at least the first height measurement hi, and the second height measurement h2), and the third height measurement (hwire) . More specifically, using the cutter height, and hwire, a cutting profile may be determined.
• the various height measurements may be shown with respect to a given structure, but this is simply illustrative.
• a height hi is shown with respect to tip portion 108a of cutter 108.
• a height h2 is shown with respect to tip portion 108a of cutter 108.
• these height measurements i.e., hi and h2 may be taken with respect to various structures so long as the result is that the cutter height (e.g., RCH shown in FIG. 2B) may be determined.
• the various height measurements described herein may be determined using various mechanisms.
• a z-axis position detector llOd may be used as shown in FIG. 1 (e.g., a z-axis encoder of a z-axis motion system).
• the various height measurements described herein may be determined using overtravel z-axis position detector llOe as shown in FIG. 1 (e.g., an encoder of the overtravel mechanism).
• wedge bonding tools including grooves configured to receive a wire (e.g., groove 106b), it is understood that the invention is applicable to any type of wedge bonding tool (including ribbon bonding tools) with or without a groove.

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