JPWO2023211970A5 - - Google Patents
Info
- Publication number
- JPWO2023211970A5 JPWO2023211970A5 JP2024551895A JP2024551895A JPWO2023211970A5 JP WO2023211970 A5 JPWO2023211970 A5 JP WO2023211970A5 JP 2024551895 A JP2024551895 A JP 2024551895A JP 2024551895 A JP2024551895 A JP 2024551895A JP WO2023211970 A5 JPWO2023211970 A5 JP WO2023211970A5
- Authority
- JP
- Japan
- Prior art keywords
- patent document
- workpiece
- wire bonding
- application publication
- documents
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202263336227P | 2022-04-28 | 2022-04-28 | |
| US63/336,227 | 2022-04-28 | ||
| PCT/US2023/019849 WO2023211970A1 (en) | 2022-04-28 | 2023-04-25 | Methods of improving wire bonding operations |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2025513998A JP2025513998A (ja) | 2025-05-02 |
| JPWO2023211970A5 true JPWO2023211970A5 (https=) | 2025-12-04 |
| JP2025513998A5 JP2025513998A5 (https=) | 2025-12-04 |
Family
ID=88512658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024551895A Pending JP2025513998A (ja) | 2022-04-28 | 2023-04-25 | ワイヤボンディング操作を改善する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230352443A1 (https=) |
| JP (1) | JP2025513998A (https=) |
| KR (1) | KR20250003487A (https=) |
| CN (1) | CN118872044A (https=) |
| TW (1) | TW202410312A (https=) |
| WO (1) | WO2023211970A1 (https=) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5443200A (en) * | 1993-10-13 | 1995-08-22 | Matsushita Electric Industrial Co., Ltd. | Bonding apparatus and bonding method |
| US7086148B2 (en) * | 2004-02-25 | 2006-08-08 | Agere Systems Inc. | Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit |
| JP5586901B2 (ja) * | 2009-09-09 | 2014-09-10 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP5164230B1 (ja) * | 2011-09-28 | 2013-03-21 | 株式会社カイジョー | ボンディング装置 |
| JP5651575B2 (ja) * | 2011-12-27 | 2015-01-14 | 株式会社カイジョー | ワイヤボンディング装置及びワイヤボンディング方法 |
| JP5686912B1 (ja) * | 2014-02-20 | 2015-03-18 | 株式会社新川 | バンプ形成方法、バンプ形成装置及び半導体装置の製造方法 |
| TWI649816B (zh) * | 2016-08-23 | 2019-02-01 | 日商新川股份有限公司 | 打線方法與打線裝置 |
| US10755988B2 (en) * | 2018-06-29 | 2020-08-25 | Kulicke And Soffa, Industries, Inc. | Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine |
| US11543362B2 (en) * | 2019-05-02 | 2023-01-03 | Asmpt Singapore Pte. Ltd. | Method for measuring the heights of wire interconnections |
| JP7336294B2 (ja) * | 2019-07-26 | 2023-08-31 | キヤノンマシナリー株式会社 | ボンディングワイヤの検査装置、ボンディングワイヤの検査方法、及びボンディングワイヤの検査プログラム |
-
2023
- 2023-04-25 WO PCT/US2023/019849 patent/WO2023211970A1/en not_active Ceased
- 2023-04-25 CN CN202380024036.0A patent/CN118872044A/zh active Pending
- 2023-04-25 JP JP2024551895A patent/JP2025513998A/ja active Pending
- 2023-04-25 US US18/139,209 patent/US20230352443A1/en active Pending
- 2023-04-25 KR KR1020247028918A patent/KR20250003487A/ko active Pending
- 2023-04-26 TW TW112115625A patent/TW202410312A/zh unknown
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