TW202410312A - 改進導線接合操作的方法 - Google Patents

改進導線接合操作的方法 Download PDF

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Publication number
TW202410312A
TW202410312A TW112115625A TW112115625A TW202410312A TW 202410312 A TW202410312 A TW 202410312A TW 112115625 A TW112115625 A TW 112115625A TW 112115625 A TW112115625 A TW 112115625A TW 202410312 A TW202410312 A TW 202410312A
Authority
TW
Taiwan
Prior art keywords
wire bonding
time
new
height
search
Prior art date
Application number
TW112115625A
Other languages
English (en)
Chinese (zh)
Inventor
徐慧
巍 秦
梁正虎
Original Assignee
美商庫利克和索夫工業公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商庫利克和索夫工業公司 filed Critical 美商庫利克和索夫工業公司
Publication of TW202410312A publication Critical patent/TW202410312A/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques

Landscapes

  • Wire Bonding (AREA)
TW112115625A 2022-04-28 2023-04-26 改進導線接合操作的方法 TW202410312A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202263336227P 2022-04-28 2022-04-28
US63/336,227 2022-04-28

Publications (1)

Publication Number Publication Date
TW202410312A true TW202410312A (zh) 2024-03-01

Family

ID=88512658

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112115625A TW202410312A (zh) 2022-04-28 2023-04-26 改進導線接合操作的方法

Country Status (6)

Country Link
US (1) US20230352443A1 (https=)
JP (1) JP2025513998A (https=)
KR (1) KR20250003487A (https=)
CN (1) CN118872044A (https=)
TW (1) TW202410312A (https=)
WO (1) WO2023211970A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5443200A (en) * 1993-10-13 1995-08-22 Matsushita Electric Industrial Co., Ltd. Bonding apparatus and bonding method
US7086148B2 (en) * 2004-02-25 2006-08-08 Agere Systems Inc. Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit
JP5586901B2 (ja) * 2009-09-09 2014-09-10 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5164230B1 (ja) * 2011-09-28 2013-03-21 株式会社カイジョー ボンディング装置
JP5651575B2 (ja) * 2011-12-27 2015-01-14 株式会社カイジョー ワイヤボンディング装置及びワイヤボンディング方法
JP5686912B1 (ja) * 2014-02-20 2015-03-18 株式会社新川 バンプ形成方法、バンプ形成装置及び半導体装置の製造方法
TWI649816B (zh) * 2016-08-23 2019-02-01 日商新川股份有限公司 打線方法與打線裝置
US10755988B2 (en) * 2018-06-29 2020-08-25 Kulicke And Soffa, Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
US11543362B2 (en) * 2019-05-02 2023-01-03 Asmpt Singapore Pte. Ltd. Method for measuring the heights of wire interconnections
JP7336294B2 (ja) * 2019-07-26 2023-08-31 キヤノンマシナリー株式会社 ボンディングワイヤの検査装置、ボンディングワイヤの検査方法、及びボンディングワイヤの検査プログラム

Also Published As

Publication number Publication date
KR20250003487A (ko) 2025-01-07
JP2025513998A (ja) 2025-05-02
CN118872044A (zh) 2024-10-29
US20230352443A1 (en) 2023-11-02
WO2023211970A1 (en) 2023-11-02

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