CN118872044A - 改进焊线操作的方法 - Google Patents

改进焊线操作的方法 Download PDF

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Publication number
CN118872044A
CN118872044A CN202380024036.0A CN202380024036A CN118872044A CN 118872044 A CN118872044 A CN 118872044A CN 202380024036 A CN202380024036 A CN 202380024036A CN 118872044 A CN118872044 A CN 118872044A
Authority
CN
China
Prior art keywords
wire bonding
seek
time
height
new
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380024036.0A
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English (en)
Chinese (zh)
Inventor
徐慧
秦巍
J·杨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kulicke and Soffa Industries Inc
Original Assignee
Kulicke and Soffa Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke and Soffa Industries Inc filed Critical Kulicke and Soffa Industries Inc
Publication of CN118872044A publication Critical patent/CN118872044A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques

Landscapes

  • Wire Bonding (AREA)
CN202380024036.0A 2022-04-28 2023-04-25 改进焊线操作的方法 Pending CN118872044A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202263336227P 2022-04-28 2022-04-28
US63/336,227 2022-04-28
PCT/US2023/019849 WO2023211970A1 (en) 2022-04-28 2023-04-25 Methods of improving wire bonding operations

Publications (1)

Publication Number Publication Date
CN118872044A true CN118872044A (zh) 2024-10-29

Family

ID=88512658

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380024036.0A Pending CN118872044A (zh) 2022-04-28 2023-04-25 改进焊线操作的方法

Country Status (6)

Country Link
US (1) US20230352443A1 (https=)
JP (1) JP2025513998A (https=)
KR (1) KR20250003487A (https=)
CN (1) CN118872044A (https=)
TW (1) TW202410312A (https=)
WO (1) WO2023211970A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5443200A (en) * 1993-10-13 1995-08-22 Matsushita Electric Industrial Co., Ltd. Bonding apparatus and bonding method
US7086148B2 (en) * 2004-02-25 2006-08-08 Agere Systems Inc. Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit
JP5586901B2 (ja) * 2009-09-09 2014-09-10 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5164230B1 (ja) * 2011-09-28 2013-03-21 株式会社カイジョー ボンディング装置
JP5651575B2 (ja) * 2011-12-27 2015-01-14 株式会社カイジョー ワイヤボンディング装置及びワイヤボンディング方法
JP5686912B1 (ja) * 2014-02-20 2015-03-18 株式会社新川 バンプ形成方法、バンプ形成装置及び半導体装置の製造方法
TWI649816B (zh) * 2016-08-23 2019-02-01 日商新川股份有限公司 打線方法與打線裝置
US10755988B2 (en) * 2018-06-29 2020-08-25 Kulicke And Soffa, Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
US11543362B2 (en) * 2019-05-02 2023-01-03 Asmpt Singapore Pte. Ltd. Method for measuring the heights of wire interconnections
JP7336294B2 (ja) * 2019-07-26 2023-08-31 キヤノンマシナリー株式会社 ボンディングワイヤの検査装置、ボンディングワイヤの検査方法、及びボンディングワイヤの検査プログラム

Also Published As

Publication number Publication date
KR20250003487A (ko) 2025-01-07
JP2025513998A (ja) 2025-05-02
US20230352443A1 (en) 2023-11-02
WO2023211970A1 (en) 2023-11-02
TW202410312A (zh) 2024-03-01

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