JP2025513998A - ワイヤボンディング操作を改善する方法 - Google Patents

ワイヤボンディング操作を改善する方法 Download PDF

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Publication number
JP2025513998A
JP2025513998A JP2024551895A JP2024551895A JP2025513998A JP 2025513998 A JP2025513998 A JP 2025513998A JP 2024551895 A JP2024551895 A JP 2024551895A JP 2024551895 A JP2024551895 A JP 2024551895A JP 2025513998 A JP2025513998 A JP 2025513998A
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wire bonding
time
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new
search height
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JP2024551895A
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Japanese (ja)
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JPWO2023211970A5 (https=
JP2025513998A5 (https=
Inventor
シュ、フイ
チン、ウェイ
ヤン、チョンホ
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クリック アンド ソッファ インダストリーズ、インク．
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Publication of JP2025513998A publication Critical patent/JP2025513998A/ja
Publication of JPWO2023211970A5 publication Critical patent/JPWO2023211970A5/ja
Publication of JP2025513998A5 publication Critical patent/JP2025513998A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques

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  • Wire Bonding (AREA)
JP2024551895A 2022-04-28 2023-04-25 ワイヤボンディング操作を改善する方法 Pending JP2025513998A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202263336227P 2022-04-28 2022-04-28
US63/336,227 2022-04-28
PCT/US2023/019849 WO2023211970A1 (en) 2022-04-28 2023-04-25 Methods of improving wire bonding operations

Publications (3)

Publication Number Publication Date
JP2025513998A true JP2025513998A (ja) 2025-05-02
JPWO2023211970A5 JPWO2023211970A5 (https=) 2025-12-04
JP2025513998A5 JP2025513998A5 (https=) 2025-12-04

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ID=88512658

Family Applications (1)

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JP2024551895A Pending JP2025513998A (ja) 2022-04-28 2023-04-25 ワイヤボンディング操作を改善する方法

Country Status (6)

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US (1) US20230352443A1 (https=)
JP (1) JP2025513998A (https=)
KR (1) KR20250003487A (https=)
CN (1) CN118872044A (https=)
TW (1) TW202410312A (https=)
WO (1) WO2023211970A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5443200A (en) * 1993-10-13 1995-08-22 Matsushita Electric Industrial Co., Ltd. Bonding apparatus and bonding method
US7086148B2 (en) * 2004-02-25 2006-08-08 Agere Systems Inc. Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit
JP5586901B2 (ja) * 2009-09-09 2014-09-10 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5164230B1 (ja) * 2011-09-28 2013-03-21 株式会社カイジョー ボンディング装置
JP5651575B2 (ja) * 2011-12-27 2015-01-14 株式会社カイジョー ワイヤボンディング装置及びワイヤボンディング方法
JP5686912B1 (ja) * 2014-02-20 2015-03-18 株式会社新川 バンプ形成方法、バンプ形成装置及び半導体装置の製造方法
TWI649816B (zh) * 2016-08-23 2019-02-01 日商新川股份有限公司 打線方法與打線裝置
US10755988B2 (en) * 2018-06-29 2020-08-25 Kulicke And Soffa, Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
US11543362B2 (en) * 2019-05-02 2023-01-03 Asmpt Singapore Pte. Ltd. Method for measuring the heights of wire interconnections
JP7336294B2 (ja) * 2019-07-26 2023-08-31 キヤノンマシナリー株式会社 ボンディングワイヤの検査装置、ボンディングワイヤの検査方法、及びボンディングワイヤの検査プログラム

Also Published As

Publication number Publication date
KR20250003487A (ko) 2025-01-07
CN118872044A (zh) 2024-10-29
US20230352443A1 (en) 2023-11-02
WO2023211970A1 (en) 2023-11-02
TW202410312A (zh) 2024-03-01

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