KR20250003487A - 와이어 본딩 작업 개선 방법 - Google Patents

와이어 본딩 작업 개선 방법 Download PDF

Info

Publication number
KR20250003487A
KR20250003487A KR1020247028918A KR20247028918A KR20250003487A KR 20250003487 A KR20250003487 A KR 20250003487A KR 1020247028918 A KR1020247028918 A KR 1020247028918A KR 20247028918 A KR20247028918 A KR 20247028918A KR 20250003487 A KR20250003487 A KR 20250003487A
Authority
KR
South Korea
Prior art keywords
wire bonding
time
new
search
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247028918A
Other languages
English (en)
Korean (ko)
Inventor
후이 수
웨이 친
양정호
Original Assignee
쿨리케 앤드 소파 인더스트리즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 filed Critical 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드
Publication of KR20250003487A publication Critical patent/KR20250003487A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • H01L24/85—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H01L2224/859—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques

Landscapes

  • Wire Bonding (AREA)
KR1020247028918A 2022-04-28 2023-04-25 와이어 본딩 작업 개선 방법 Pending KR20250003487A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202263336227P 2022-04-28 2022-04-28
US63/336,227 2022-04-28
PCT/US2023/019849 WO2023211970A1 (en) 2022-04-28 2023-04-25 Methods of improving wire bonding operations

Publications (1)

Publication Number Publication Date
KR20250003487A true KR20250003487A (ko) 2025-01-07

Family

ID=88512658

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247028918A Pending KR20250003487A (ko) 2022-04-28 2023-04-25 와이어 본딩 작업 개선 방법

Country Status (6)

Country Link
US (1) US20230352443A1 (https=)
JP (1) JP2025513998A (https=)
KR (1) KR20250003487A (https=)
CN (1) CN118872044A (https=)
TW (1) TW202410312A (https=)
WO (1) WO2023211970A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5443200A (en) * 1993-10-13 1995-08-22 Matsushita Electric Industrial Co., Ltd. Bonding apparatus and bonding method
US7086148B2 (en) * 2004-02-25 2006-08-08 Agere Systems Inc. Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit
JP5586901B2 (ja) * 2009-09-09 2014-09-10 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5164230B1 (ja) * 2011-09-28 2013-03-21 株式会社カイジョー ボンディング装置
JP5651575B2 (ja) * 2011-12-27 2015-01-14 株式会社カイジョー ワイヤボンディング装置及びワイヤボンディング方法
JP5686912B1 (ja) * 2014-02-20 2015-03-18 株式会社新川 バンプ形成方法、バンプ形成装置及び半導体装置の製造方法
TWI649816B (zh) * 2016-08-23 2019-02-01 日商新川股份有限公司 打線方法與打線裝置
US10755988B2 (en) * 2018-06-29 2020-08-25 Kulicke And Soffa, Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
US11543362B2 (en) * 2019-05-02 2023-01-03 Asmpt Singapore Pte. Ltd. Method for measuring the heights of wire interconnections
JP7336294B2 (ja) * 2019-07-26 2023-08-31 キヤノンマシナリー株式会社 ボンディングワイヤの検査装置、ボンディングワイヤの検査方法、及びボンディングワイヤの検査プログラム

Also Published As

Publication number Publication date
JP2025513998A (ja) 2025-05-02
CN118872044A (zh) 2024-10-29
US20230352443A1 (en) 2023-11-02
WO2023211970A1 (en) 2023-11-02
TW202410312A (zh) 2024-03-01

Similar Documents

Publication Publication Date Title
CN110695575B (zh) 用于引线焊接的焊接机上的自动悬置芯片优化工具及相关方法
US9165842B2 (en) Short tail recovery techniques in wire bonding operations
KR950009619B1 (ko) 반도체장치의 와이어 본딩방법
US11865633B2 (en) Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods
US11935864B2 (en) Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods
KR20250003487A (ko) 와이어 본딩 작업 개선 방법
US12183711B2 (en) Methods of determining a sequence for creating a plurality of wire loops in connection with a workpiece
US20230335532A1 (en) Methods of determining a height, and a height profile, of a wire loop on a wire bonding machine
US20250201765A1 (en) Methods of operating wire bonding systems, including methods of detecting and/or preventing wire fly-out on such systems
US12616051B2 (en) Methods a sequence for a plurality of wire loops in connection with a workpiece
US20250391812A1 (en) Methods of determining a bonding status between a portion of wire and a workpiece on a wire bonding system

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000