JPWO2022138355A5 - - Google Patents
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- Publication number
- JPWO2022138355A5 JPWO2022138355A5 JP2022572212A JP2022572212A JPWO2022138355A5 JP WO2022138355 A5 JPWO2022138355 A5 JP WO2022138355A5 JP 2022572212 A JP2022572212 A JP 2022572212A JP 2022572212 A JP2022572212 A JP 2022572212A JP WO2022138355 A5 JPWO2022138355 A5 JP WO2022138355A5
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- layer
- insulator
- conductor
- insulator layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 456
- 239000004020 conductor Substances 0.000 claims description 261
- 239000012212 insulator Substances 0.000 claims description 211
- 239000000758 substrate Substances 0.000 claims description 54
- 238000004519 manufacturing process Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 15
- 239000011888 foil Substances 0.000 claims description 9
- 238000002360 preparation method Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000002788 crimping Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 1
- 239000011229 interlayer Substances 0.000 description 13
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000013459 approach Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
Images
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020214600 | 2020-12-24 | ||
| JP2020214600 | 2020-12-24 | ||
| PCT/JP2021/046177 WO2022138355A1 (ja) | 2020-12-24 | 2021-12-15 | 多層基板及び多層基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022138355A1 JPWO2022138355A1 (enExample) | 2022-06-30 |
| JPWO2022138355A5 true JPWO2022138355A5 (enExample) | 2023-08-22 |
| JP7597128B2 JP7597128B2 (ja) | 2024-12-10 |
Family
ID=82159094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022572212A Active JP7597128B2 (ja) | 2020-12-24 | 2021-12-15 | 多層基板及び多層基板の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12431603B2 (enExample) |
| JP (1) | JP7597128B2 (enExample) |
| CN (1) | CN219626872U (enExample) |
| WO (1) | WO2022138355A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7823794B2 (ja) * | 2023-05-17 | 2026-03-04 | 株式会社村田製作所 | 多層基板及び電子機器 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02109390A (ja) * | 1988-10-18 | 1990-04-23 | Furukawa Electric Co Ltd:The | 高密度フレキシブルプリント回路基板 |
| JPH09199816A (ja) * | 1996-01-16 | 1997-07-31 | Sumitomo Wiring Syst Ltd | フレキシブルプリント基板およびその製造方法 |
| JP3318739B2 (ja) | 1998-03-27 | 2002-08-26 | 日本航空電子工業株式会社 | ディファレンシャル信号伝送線路 |
| JP2003133660A (ja) * | 2001-10-19 | 2003-05-09 | G Tekku:Kk | 電源用と信号用回路が複合されたフレキシブルプリント配線板 |
| KR102376057B1 (ko) | 2014-09-24 | 2022-03-18 | 도아고세이가부시키가이샤 | 접착제 조성물 및 이것을 사용한 접착제층 부착 적층체 |
| JP2022032293A (ja) * | 2020-08-11 | 2022-02-25 | 日本メクトロン株式会社 | 配線体およびその製造方法 |
-
2021
- 2021-12-15 CN CN202190000941.9U patent/CN219626872U/zh active Active
- 2021-12-15 WO PCT/JP2021/046177 patent/WO2022138355A1/ja not_active Ceased
- 2021-12-15 JP JP2022572212A patent/JP7597128B2/ja active Active
-
2023
- 2023-06-08 US US18/207,169 patent/US12431603B2/en active Active
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