JPWO2022130676A1 - - Google Patents

Info

Publication number
JPWO2022130676A1
JPWO2022130676A1 JP2022569700A JP2022569700A JPWO2022130676A1 JP WO2022130676 A1 JPWO2022130676 A1 JP WO2022130676A1 JP 2022569700 A JP2022569700 A JP 2022569700A JP 2022569700 A JP2022569700 A JP 2022569700A JP WO2022130676 A1 JPWO2022130676 A1 JP WO2022130676A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022569700A
Other languages
Japanese (ja)
Other versions
JPWO2022130676A5 (https=
JP7544146B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022130676A1 publication Critical patent/JPWO2022130676A1/ja
Publication of JPWO2022130676A5 publication Critical patent/JPWO2022130676A5/ja
Application granted granted Critical
Publication of JP7544146B2 publication Critical patent/JP7544146B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0595—Holders or supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H9/2468—Tuning fork resonators
    • H03H9/2478—Single-Ended Tuning Fork resonators
    • H03H9/2489—Single-Ended Tuning Fork resonators with more than two fork tines
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02157—Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1057—Mounting in enclosures for microelectro-mechanical devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H9/02433—Means for compensation or elimination of undesired effects
    • H03H2009/02472—Stiction
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2022569700A 2020-12-17 2021-07-26 共振子及び共振装置 Active JP7544146B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020209364 2020-12-17
JP2020209364 2020-12-17
PCT/JP2021/027560 WO2022130676A1 (ja) 2020-12-17 2021-07-26 共振子及び共振装置

Publications (3)

Publication Number Publication Date
JPWO2022130676A1 true JPWO2022130676A1 (https=) 2022-06-23
JPWO2022130676A5 JPWO2022130676A5 (https=) 2023-07-27
JP7544146B2 JP7544146B2 (ja) 2024-09-03

Family

ID=82057519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022569700A Active JP7544146B2 (ja) 2020-12-17 2021-07-26 共振子及び共振装置

Country Status (4)

Country Link
US (1) US12308821B2 (https=)
JP (1) JP7544146B2 (https=)
CN (1) CN116601870A (https=)
WO (1) WO2022130676A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024009553A1 (ja) 2022-07-05 2024-01-11 株式会社村田製作所 共振装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016174789A1 (ja) * 2015-04-27 2016-11-03 株式会社村田製作所 共振子及び共振装置
WO2019207829A1 (ja) * 2018-04-27 2019-10-31 株式会社村田製作所 共振子及び共振装置
WO2020049789A1 (ja) * 2018-09-03 2020-03-12 株式会社村田製作所 共振子及びそれを備えた共振装置
WO2020067484A1 (ja) * 2018-09-28 2020-04-02 株式会社村田製作所 共振子及び共振装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009165006A (ja) * 2008-01-09 2009-07-23 Nippon Dempa Kogyo Co Ltd 圧電振動片、圧電デバイス及び音叉型圧電振動子の周波数調整方法
JP4533934B2 (ja) * 2008-01-15 2010-09-01 エプソントヨコム株式会社 振動片及び振動子の製造方法
JP4778548B2 (ja) * 2008-12-17 2011-09-21 日本電波工業株式会社 圧電フレーム、圧電デバイス及び圧電フレームの製造方法
JP2010147953A (ja) * 2008-12-22 2010-07-01 Nippon Dempa Kogyo Co Ltd 圧電フレーム及び圧電デバイス
JP5593979B2 (ja) * 2009-11-11 2014-09-24 セイコーエプソン株式会社 振動片、振動子、発振器、センサー及び電子機器
KR20140118840A (ko) * 2013-03-29 2014-10-08 세이코 엡슨 가부시키가이샤 진동 소자, 진동자, 발진기, 전자 기기 및 이동체
WO2016175218A1 (ja) 2015-04-28 2016-11-03 株式会社村田製作所 共振子及び共振装置
WO2018216264A1 (ja) * 2017-05-25 2018-11-29 株式会社村田製作所 共振子及び共振装置
WO2020047789A1 (zh) * 2018-09-05 2020-03-12 华为技术有限公司 一种pucch的传输方法及装置
WO2021220535A1 (ja) * 2020-04-27 2021-11-04 株式会社村田製作所 共振子及び共振装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016174789A1 (ja) * 2015-04-27 2016-11-03 株式会社村田製作所 共振子及び共振装置
WO2019207829A1 (ja) * 2018-04-27 2019-10-31 株式会社村田製作所 共振子及び共振装置
WO2020049789A1 (ja) * 2018-09-03 2020-03-12 株式会社村田製作所 共振子及びそれを備えた共振装置
WO2020067484A1 (ja) * 2018-09-28 2020-04-02 株式会社村田製作所 共振子及び共振装置

Also Published As

Publication number Publication date
JP7544146B2 (ja) 2024-09-03
WO2022130676A1 (ja) 2022-06-23
US20230283257A1 (en) 2023-09-07
CN116601870A (zh) 2023-08-15
US12308821B2 (en) 2025-05-20

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