CN116601870A - 谐振子以及谐振装置 - Google Patents

谐振子以及谐振装置 Download PDF

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Publication number
CN116601870A
CN116601870A CN202180082745.5A CN202180082745A CN116601870A CN 116601870 A CN116601870 A CN 116601870A CN 202180082745 A CN202180082745 A CN 202180082745A CN 116601870 A CN116601870 A CN 116601870A
Authority
CN
China
Prior art keywords
support arm
arm
base
vibrating
resonator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180082745.5A
Other languages
English (en)
Chinese (zh)
Inventor
河合良太
福光政和
樋口敬之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN116601870A publication Critical patent/CN116601870A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0595—Holders or supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H9/2468—Tuning fork resonators
    • H03H9/2478—Single-Ended Tuning Fork resonators
    • H03H9/2489—Single-Ended Tuning Fork resonators with more than two fork tines
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02157—Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1057—Mounting in enclosures for microelectro-mechanical devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H9/02433—Means for compensation or elimination of undesired effects
    • H03H2009/02472—Stiction
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
CN202180082745.5A 2020-12-17 2021-07-26 谐振子以及谐振装置 Pending CN116601870A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020209364 2020-12-17
JP2020-209364 2020-12-17
PCT/JP2021/027560 WO2022130676A1 (ja) 2020-12-17 2021-07-26 共振子及び共振装置

Publications (1)

Publication Number Publication Date
CN116601870A true CN116601870A (zh) 2023-08-15

Family

ID=82057519

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180082745.5A Pending CN116601870A (zh) 2020-12-17 2021-07-26 谐振子以及谐振装置

Country Status (4)

Country Link
US (1) US12308821B2 (https=)
JP (1) JP7544146B2 (https=)
CN (1) CN116601870A (https=)
WO (1) WO2022130676A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024009553A1 (ja) 2022-07-05 2024-01-11 株式会社村田製作所 共振装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090174286A1 (en) * 2008-01-09 2009-07-09 Nihon Dempa Kogyo Co., Ltd., Methods for adjusting frequency of piezoelectric vibrating pieces, piezoelectric devices, and tuning-fork type piezoelectric oscillators
US20090178260A1 (en) * 2008-01-15 2009-07-16 Epson Toyocom Corporation Vibrating piece manufacturing method and vibrator manufacturing method
CN102064793A (zh) * 2009-11-11 2011-05-18 精工爱普生株式会社 振动器件及电子设备
CN104079256A (zh) * 2013-03-29 2014-10-01 精工爱普生株式会社 振动元件、振子、振荡器、电子设备以及移动体
CN107431472A (zh) * 2015-04-27 2017-12-01 株式会社村田制作所 谐振子以及谐振装置
WO2020047789A1 (zh) * 2018-09-05 2020-03-12 华为技术有限公司 一种pucch的传输方法及装置
US20200144989A1 (en) * 2017-05-25 2020-05-07 Murata Manufacturing Co., Ltd. Resonator and resonant device
CN111989863A (zh) * 2018-04-27 2020-11-24 株式会社村田制作所 谐振器以及谐振装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4778548B2 (ja) * 2008-12-17 2011-09-21 日本電波工業株式会社 圧電フレーム、圧電デバイス及び圧電フレームの製造方法
JP2010147953A (ja) * 2008-12-22 2010-07-01 Nippon Dempa Kogyo Co Ltd 圧電フレーム及び圧電デバイス
WO2016175218A1 (ja) 2015-04-28 2016-11-03 株式会社村田製作所 共振子及び共振装置
CN112567629B (zh) 2018-09-03 2024-10-01 株式会社村田制作所 谐振子以及具备该谐振子的谐振装置
CN112703673B (zh) 2018-09-28 2024-04-12 株式会社村田制作所 谐振子和谐振装置
WO2021220535A1 (ja) * 2020-04-27 2021-11-04 株式会社村田製作所 共振子及び共振装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090174286A1 (en) * 2008-01-09 2009-07-09 Nihon Dempa Kogyo Co., Ltd., Methods for adjusting frequency of piezoelectric vibrating pieces, piezoelectric devices, and tuning-fork type piezoelectric oscillators
US20090178260A1 (en) * 2008-01-15 2009-07-16 Epson Toyocom Corporation Vibrating piece manufacturing method and vibrator manufacturing method
CN101488731A (zh) * 2008-01-15 2009-07-22 爱普生拓优科梦株式会社 振动片的制造方法和振子的制造方法
CN102064793A (zh) * 2009-11-11 2011-05-18 精工爱普生株式会社 振动器件及电子设备
CN104079256A (zh) * 2013-03-29 2014-10-01 精工爱普生株式会社 振动元件、振子、振荡器、电子设备以及移动体
CN107431472A (zh) * 2015-04-27 2017-12-01 株式会社村田制作所 谐振子以及谐振装置
US20200144989A1 (en) * 2017-05-25 2020-05-07 Murata Manufacturing Co., Ltd. Resonator and resonant device
CN111989863A (zh) * 2018-04-27 2020-11-24 株式会社村田制作所 谐振器以及谐振装置
WO2020047789A1 (zh) * 2018-09-05 2020-03-12 华为技术有限公司 一种pucch的传输方法及装置

Also Published As

Publication number Publication date
JP7544146B2 (ja) 2024-09-03
JPWO2022130676A1 (https=) 2022-06-23
WO2022130676A1 (ja) 2022-06-23
US20230283257A1 (en) 2023-09-07
US12308821B2 (en) 2025-05-20

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