JPWO2022113923A5 - - Google Patents
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- Publication number
- JPWO2022113923A5 JPWO2022113923A5 JP2022565314A JP2022565314A JPWO2022113923A5 JP WO2022113923 A5 JPWO2022113923 A5 JP WO2022113923A5 JP 2022565314 A JP2022565314 A JP 2022565314A JP 2022565314 A JP2022565314 A JP 2022565314A JP WO2022113923 A5 JPWO2022113923 A5 JP WO2022113923A5
- Authority
- JP
- Japan
- Prior art keywords
- silver
- particles
- containing paste
- mass
- paste according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 29
- 229910052709 silver Inorganic materials 0.000 claims 29
- 239000004332 silver Substances 0.000 claims 29
- 239000002245 particle Substances 0.000 claims 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 7
- 229920005989 resin Polymers 0.000 claims 7
- 239000011347 resin Substances 0.000 claims 7
- 229910052710 silicon Inorganic materials 0.000 claims 7
- 239000010703 silicon Substances 0.000 claims 7
- 239000000463 material Substances 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 230000001588 bifunctional effect Effects 0.000 claims 3
- 239000003960 organic solvent Substances 0.000 claims 3
- 239000012790 adhesive layer Substances 0.000 claims 2
- 238000005245 sintering Methods 0.000 claims 2
- 239000006087 Silane Coupling Agent Substances 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 210000003918 fraction a Anatomy 0.000 claims 1
- 210000000540 fraction c Anatomy 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020195062 | 2020-11-25 | ||
| JP2020195062 | 2020-11-25 | ||
| PCT/JP2021/042727 WO2022113923A1 (ja) | 2020-11-25 | 2021-11-22 | 銀含有ペーストおよび接合体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022113923A1 JPWO2022113923A1 (https=) | 2022-06-02 |
| JPWO2022113923A5 true JPWO2022113923A5 (https=) | 2023-03-08 |
| JP7392876B2 JP7392876B2 (ja) | 2023-12-06 |
Family
ID=81754614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022565314A Active JP7392876B2 (ja) | 2020-11-25 | 2021-11-22 | 銀含有ペーストおよび接合体 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7392876B2 (https=) |
| KR (1) | KR20230108331A (https=) |
| CN (1) | CN116547357A (https=) |
| TW (1) | TWI889941B (https=) |
| WO (1) | WO2022113923A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024011945A (ja) * | 2022-07-15 | 2024-01-25 | 住友ベークライト株式会社 | 導電性ペースト、硬化物および半導体装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000239616A (ja) | 1999-02-24 | 2000-09-05 | Hitachi Chem Co Ltd | 樹脂ペースト組成物及びこれを用いた半導体装置 |
| WO2013133085A1 (ja) * | 2012-03-05 | 2013-09-12 | ナミックス株式会社 | 銀微粒子焼結体 |
| JP5567636B2 (ja) | 2012-10-05 | 2014-08-06 | 京セラケミカル株式会社 | 半導体接着用熱硬化型樹脂組成物及び半導体装置 |
| JP2014225350A (ja) | 2013-05-15 | 2014-12-04 | 日立化成株式会社 | 銀ペースト組成物 |
| WO2017073393A1 (ja) * | 2015-10-29 | 2017-05-04 | 三菱マテリアル株式会社 | 樹脂組成物、接合体及び半導体装置 |
| JP6747000B2 (ja) * | 2016-03-25 | 2020-08-26 | 住友ベークライト株式会社 | ペースト状接着剤組成物、半導体装置、半導体装置の製造方法および放熱板の接着方法 |
| CN113632219A (zh) * | 2019-03-20 | 2021-11-09 | 住友电木株式会社 | 导热性组合物和半导体装置 |
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2021
- 2021-11-22 CN CN202180079421.6A patent/CN116547357A/zh active Pending
- 2021-11-22 KR KR1020237020917A patent/KR20230108331A/ko active Pending
- 2021-11-22 JP JP2022565314A patent/JP7392876B2/ja active Active
- 2021-11-22 WO PCT/JP2021/042727 patent/WO2022113923A1/ja not_active Ceased
- 2021-11-24 TW TW110143758A patent/TWI889941B/zh active