JP2006128567A5 - - Google Patents

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Publication number
JP2006128567A5
JP2006128567A5 JP2004318225A JP2004318225A JP2006128567A5 JP 2006128567 A5 JP2006128567 A5 JP 2006128567A5 JP 2004318225 A JP2004318225 A JP 2004318225A JP 2004318225 A JP2004318225 A JP 2004318225A JP 2006128567 A5 JP2006128567 A5 JP 2006128567A5
Authority
JP
Japan
Prior art keywords
adhesive film
array package
solder
bump array
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004318225A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006128567A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004318225A priority Critical patent/JP2006128567A/ja
Priority claimed from JP2004318225A external-priority patent/JP2006128567A/ja
Priority to US11/577,921 priority patent/US20090127692A1/en
Priority to EP05812409A priority patent/EP1810325A2/en
Priority to CNB2005800382096A priority patent/CN100550329C/zh
Priority to KR1020077012273A priority patent/KR20070084607A/ko
Priority to PCT/US2005/037287 priority patent/WO2006049853A2/en
Priority to TW094137985A priority patent/TW200620513A/zh
Publication of JP2006128567A publication Critical patent/JP2006128567A/ja
Publication of JP2006128567A5 publication Critical patent/JP2006128567A5/ja
Pending legal-status Critical Current

Links

JP2004318225A 2004-11-01 2004-11-01 半導体パッケージのプリント配線板への接続方法 Pending JP2006128567A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2004318225A JP2006128567A (ja) 2004-11-01 2004-11-01 半導体パッケージのプリント配線板への接続方法
US11/577,921 US20090127692A1 (en) 2004-11-01 2005-10-14 Method of connecting a semiconductor package to a printed wiring board
EP05812409A EP1810325A2 (en) 2004-11-01 2005-10-14 Method of connecting a semiconductor package to a printed wiring board
CNB2005800382096A CN100550329C (zh) 2004-11-01 2005-10-14 将半导体封装连接到印刷线路板上的方法
KR1020077012273A KR20070084607A (ko) 2004-11-01 2005-10-14 인쇄 회로 기판에 반도체 패키지를 접속하는 방법
PCT/US2005/037287 WO2006049853A2 (en) 2004-11-01 2005-10-14 Method of connecting a semiconductor package to a printed wiring board
TW094137985A TW200620513A (en) 2004-11-01 2005-10-28 Method of connecting a semiconductor package to a printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004318225A JP2006128567A (ja) 2004-11-01 2004-11-01 半導体パッケージのプリント配線板への接続方法

Publications (2)

Publication Number Publication Date
JP2006128567A JP2006128567A (ja) 2006-05-18
JP2006128567A5 true JP2006128567A5 (https=) 2007-12-06

Family

ID=36216812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004318225A Pending JP2006128567A (ja) 2004-11-01 2004-11-01 半導体パッケージのプリント配線板への接続方法

Country Status (7)

Country Link
US (1) US20090127692A1 (https=)
EP (1) EP1810325A2 (https=)
JP (1) JP2006128567A (https=)
KR (1) KR20070084607A (https=)
CN (1) CN100550329C (https=)
TW (1) TW200620513A (https=)
WO (1) WO2006049853A2 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5336700B2 (ja) * 2006-11-30 2013-11-06 ローム株式会社 半導体装置およびそれを用いた電子機器
US8039305B2 (en) 2007-04-27 2011-10-18 Sumitomo Bakelite Company, Ltd. Method for bonding semiconductor wafers and method for manufacturing semiconductor device
US9024455B2 (en) * 2010-05-26 2015-05-05 Hitachi Chemical Company, Ltd. Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device
KR100891537B1 (ko) * 2007-12-13 2009-04-03 주식회사 하이닉스반도체 반도체 패키지용 기판 및 이를 갖는 반도체 패키지
JP5662855B2 (ja) * 2011-03-25 2015-02-04 株式会社日立製作所 プリント基板の製造装置および製造方法
JP5864367B2 (ja) * 2011-06-16 2016-02-17 日東電工株式会社 蛍光接着シート、蛍光体層付発光ダイオード素子、発光ダイオード装置およびそれらの製造方法
WO2013048496A1 (en) 2011-09-30 2013-04-04 Intel Corporation Method for handling very thin device wafers
US8815706B2 (en) * 2012-01-20 2014-08-26 Infineon Technologies Ag Methods of forming semiconductor devices
US9472531B2 (en) 2015-02-06 2016-10-18 Semigear, Inc. Device packaging facility and method, and device processing apparatus utilizing phthalate
US9824998B2 (en) 2015-02-06 2017-11-21 Semigear, Inc. Device packaging facility and method, and device processing apparatus utilizing DEHT
JP2017108090A (ja) * 2015-12-08 2017-06-15 リンテック株式会社 ダイシングシートおよびダイシングシートの製造方法
CN108307591A (zh) * 2017-01-13 2018-07-20 奥特斯奥地利科技与系统技术有限公司 通过在安装于部件承载件材料之前用附着物覆盖部件制造的部件承载件
CN109047965B (zh) * 2018-09-20 2021-02-19 北京机械设备研究所 一种多管脚封装器件的焊接工装及其使用方法

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
JPH01263112A (ja) * 1988-04-15 1989-10-19 Fujitsu Ltd 半導体封止用エポキシ樹脂組成物
US5128746A (en) * 1990-09-27 1992-07-07 Motorola, Inc. Adhesive and encapsulant material with fluxing properties
US5543585A (en) * 1994-02-02 1996-08-06 International Business Machines Corporation Direct chip attachment (DCA) with electrically conductive adhesives
US5932682A (en) * 1995-12-19 1999-08-03 International Business Machines Corporation Cleavable diepoxide for removable epoxy compositions
EP1025587A4 (en) * 1997-07-21 2000-10-04 Aguila Technologies Inc SEMICONDUCTOR FLIPCHIP PACK AND PRODUCTION METHOD THEREFOR
US6260264B1 (en) * 1997-12-08 2001-07-17 3M Innovative Properties Company Methods for making z-axis electrical connections
JPH11289033A (ja) * 1998-04-03 1999-10-19 Toshiba Corp 液状エポキシ樹脂組成物および樹脂封止型半導体装置
JP3336253B2 (ja) * 1998-04-23 2002-10-21 松下電工株式会社 半導体装置とその製造方法、実装方法および用途
US6265776B1 (en) * 1998-04-27 2001-07-24 Fry's Metals, Inc. Flip chip with integrated flux and underfill
US6228678B1 (en) * 1998-04-27 2001-05-08 Fry's Metals, Inc. Flip chip with integrated mask and underfill
JP2000040711A (ja) * 1998-07-23 2000-02-08 Sony Corp 樹脂封止型半導体装置とその製造方法
JP3558576B2 (ja) * 1999-02-22 2004-08-25 三菱電機株式会社 半導体装置の製造方法および半導体装置
US6746896B1 (en) * 1999-08-28 2004-06-08 Georgia Tech Research Corp. Process and material for low-cost flip-chip solder interconnect structures
JP4195541B2 (ja) * 2000-05-12 2008-12-10 三井化学株式会社 半導体チップをプリント配線基板に装着する方法及びその方法の実施に用いる装着用シート
JP4441090B2 (ja) * 2000-10-11 2010-03-31 三井化学株式会社 プリント配線基板に半導体チップを装着する方法
US6518675B2 (en) * 2000-12-29 2003-02-11 Samsung Electronics Co., Ltd. Wafer level package and method for manufacturing the same
US6624216B2 (en) * 2002-01-31 2003-09-23 National Starch And Chemical Investment Holding Corporation No-flow underfill encapsulant
US6869832B2 (en) * 2003-02-07 2005-03-22 Lockheed Martin Corporation Method for planarizing bumped die
EP1557880A1 (en) * 2004-01-21 2005-07-27 Nitto Denko Corporation Resin composition for encapsulating semiconductor

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