JP7392876B2 - 銀含有ペーストおよび接合体 - Google Patents

銀含有ペーストおよび接合体 Download PDF

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Publication number
JP7392876B2
JP7392876B2 JP2022565314A JP2022565314A JP7392876B2 JP 7392876 B2 JP7392876 B2 JP 7392876B2 JP 2022565314 A JP2022565314 A JP 2022565314A JP 2022565314 A JP2022565314 A JP 2022565314A JP 7392876 B2 JP7392876 B2 JP 7392876B2
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Japan
Prior art keywords
silver
particles
mass
resin
containing paste
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JP2022565314A
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English (en)
Japanese (ja)
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JPWO2022113923A1 (https=
JPWO2022113923A5 (https=
Inventor
直輝 渡部
真 高本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Publication of JPWO2022113923A1 publication Critical patent/JPWO2022113923A1/ja
Publication of JPWO2022113923A5 publication Critical patent/JPWO2022113923A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Powder Metallurgy (AREA)
JP2022565314A 2020-11-25 2021-11-22 銀含有ペーストおよび接合体 Active JP7392876B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020195062 2020-11-25
JP2020195062 2020-11-25
PCT/JP2021/042727 WO2022113923A1 (ja) 2020-11-25 2021-11-22 銀含有ペーストおよび接合体

Publications (3)

Publication Number Publication Date
JPWO2022113923A1 JPWO2022113923A1 (https=) 2022-06-02
JPWO2022113923A5 JPWO2022113923A5 (https=) 2023-03-08
JP7392876B2 true JP7392876B2 (ja) 2023-12-06

Family

ID=81754614

Family Applications (1)

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JP2022565314A Active JP7392876B2 (ja) 2020-11-25 2021-11-22 銀含有ペーストおよび接合体

Country Status (5)

Country Link
JP (1) JP7392876B2 (https=)
KR (1) KR20230108331A (https=)
CN (1) CN116547357A (https=)
TW (1) TWI889941B (https=)
WO (1) WO2022113923A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024011945A (ja) * 2022-07-15 2024-01-25 住友ベークライト株式会社 導電性ペースト、硬化物および半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017073393A1 (ja) 2015-10-29 2017-05-04 三菱マテリアル株式会社 樹脂組成物、接合体及び半導体装置
JP2017171844A (ja) 2016-03-25 2017-09-28 住友ベークライト株式会社 ペースト状接着剤組成物、半導体装置、半導体装置の製造方法および放熱板の接着方法
WO2020189445A1 (ja) 2019-03-20 2020-09-24 住友ベークライト株式会社 熱伝導性組成物および半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000239616A (ja) 1999-02-24 2000-09-05 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
WO2013133085A1 (ja) * 2012-03-05 2013-09-12 ナミックス株式会社 銀微粒子焼結体
JP5567636B2 (ja) 2012-10-05 2014-08-06 京セラケミカル株式会社 半導体接着用熱硬化型樹脂組成物及び半導体装置
JP2014225350A (ja) 2013-05-15 2014-12-04 日立化成株式会社 銀ペースト組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017073393A1 (ja) 2015-10-29 2017-05-04 三菱マテリアル株式会社 樹脂組成物、接合体及び半導体装置
JP2017171844A (ja) 2016-03-25 2017-09-28 住友ベークライト株式会社 ペースト状接着剤組成物、半導体装置、半導体装置の製造方法および放熱板の接着方法
WO2020189445A1 (ja) 2019-03-20 2020-09-24 住友ベークライト株式会社 熱伝導性組成物および半導体装置

Also Published As

Publication number Publication date
TW202227561A (zh) 2022-07-16
TWI889941B (zh) 2025-07-11
JPWO2022113923A1 (https=) 2022-06-02
WO2022113923A1 (ja) 2022-06-02
KR20230108331A (ko) 2023-07-18
CN116547357A (zh) 2023-08-04

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