KR20230108331A - 은 함유 페이스트 및 접합체 - Google Patents

은 함유 페이스트 및 접합체 Download PDF

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Publication number
KR20230108331A
KR20230108331A KR1020237020917A KR20237020917A KR20230108331A KR 20230108331 A KR20230108331 A KR 20230108331A KR 1020237020917 A KR1020237020917 A KR 1020237020917A KR 20237020917 A KR20237020917 A KR 20237020917A KR 20230108331 A KR20230108331 A KR 20230108331A
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KR
South Korea
Prior art keywords
silver
particles
containing paste
mass
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237020917A
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English (en)
Korean (ko)
Inventor
나오키 와타나베
마코토 다카모토
Original Assignee
스미또모 베이크라이트 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미또모 베이크라이트 가부시키가이샤 filed Critical 스미또모 베이크라이트 가부시키가이샤
Publication of KR20230108331A publication Critical patent/KR20230108331A/ko
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H01L21/52—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Powder Metallurgy (AREA)
KR1020237020917A 2020-11-25 2021-11-22 은 함유 페이스트 및 접합체 Pending KR20230108331A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020195062 2020-11-25
JPJP-P-2020-195062 2020-11-25
PCT/JP2021/042727 WO2022113923A1 (ja) 2020-11-25 2021-11-22 銀含有ペーストおよび接合体

Publications (1)

Publication Number Publication Date
KR20230108331A true KR20230108331A (ko) 2023-07-18

Family

ID=81754614

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237020917A Pending KR20230108331A (ko) 2020-11-25 2021-11-22 은 함유 페이스트 및 접합체

Country Status (5)

Country Link
JP (1) JP7392876B2 (https=)
KR (1) KR20230108331A (https=)
CN (1) CN116547357A (https=)
TW (1) TWI889941B (https=)
WO (1) WO2022113923A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024011945A (ja) * 2022-07-15 2024-01-25 住友ベークライト株式会社 導電性ペースト、硬化物および半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000239616A (ja) 1999-02-24 2000-09-05 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2014074132A (ja) 2012-10-05 2014-04-24 Kyocera Chemical Corp 半導体接着用熱硬化型樹脂組成物及び半導体装置
JP2014225350A (ja) 2013-05-15 2014-12-04 日立化成株式会社 銀ペースト組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013133085A1 (ja) * 2012-03-05 2013-09-12 ナミックス株式会社 銀微粒子焼結体
WO2017073393A1 (ja) * 2015-10-29 2017-05-04 三菱マテリアル株式会社 樹脂組成物、接合体及び半導体装置
JP6747000B2 (ja) * 2016-03-25 2020-08-26 住友ベークライト株式会社 ペースト状接着剤組成物、半導体装置、半導体装置の製造方法および放熱板の接着方法
CN113632219A (zh) * 2019-03-20 2021-11-09 住友电木株式会社 导热性组合物和半导体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000239616A (ja) 1999-02-24 2000-09-05 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2014074132A (ja) 2012-10-05 2014-04-24 Kyocera Chemical Corp 半導体接着用熱硬化型樹脂組成物及び半導体装置
JP2014225350A (ja) 2013-05-15 2014-12-04 日立化成株式会社 銀ペースト組成物

Also Published As

Publication number Publication date
TW202227561A (zh) 2022-07-16
TWI889941B (zh) 2025-07-11
JP7392876B2 (ja) 2023-12-06
JPWO2022113923A1 (https=) 2022-06-02
WO2022113923A1 (ja) 2022-06-02
CN116547357A (zh) 2023-08-04

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