JPWO2022045237A1 - - Google Patents

Info

Publication number
JPWO2022045237A1
JPWO2022045237A1 JP2022545694A JP2022545694A JPWO2022045237A1 JP WO2022045237 A1 JPWO2022045237 A1 JP WO2022045237A1 JP 2022545694 A JP2022545694 A JP 2022545694A JP 2022545694 A JP2022545694 A JP 2022545694A JP WO2022045237 A1 JPWO2022045237 A1 JP WO2022045237A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022545694A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022045237A1 publication Critical patent/JPWO2022045237A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/06—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • C08L101/08—Carboxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/18—Homopolymers or copolymers or tetrafluoroethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C08L61/14—Modified phenol-aldehyde condensates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022545694A 2020-08-31 2021-08-26 Pending JPWO2022045237A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020146251 2020-08-31
PCT/JP2021/031299 WO2022045237A1 (ja) 2020-08-31 2021-08-26 液状組成物及び凸部付き基材

Publications (1)

Publication Number Publication Date
JPWO2022045237A1 true JPWO2022045237A1 (ja) 2022-03-03

Family

ID=80353366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022545694A Pending JPWO2022045237A1 (ja) 2020-08-31 2021-08-26

Country Status (5)

Country Link
JP (1) JPWO2022045237A1 (ja)
KR (1) KR20230058313A (ja)
CN (1) CN115996990A (ja)
TW (1) TW202219156A (ja)
WO (1) WO2022045237A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023190802A1 (ja) * 2022-03-31 2023-10-05 株式会社レゾナック 感光性樹脂フィルム、プリント配線板、半導体パッケージ及びプリント配線板の製造方法
WO2023190801A1 (ja) * 2022-03-31 2023-10-05 株式会社レゾナック 感光性多層樹脂フィルム、プリント配線板、半導体パッケージ及びプリント配線板の製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012007025A (ja) * 2010-06-23 2012-01-12 Toyo Ink Sc Holdings Co Ltd カルボキシル基含有変性フェノール樹脂、及びそれを含有するカラーフィルタ用着色組成物
EP3722384A1 (en) * 2012-06-29 2020-10-14 Agc Inc. Powder coating composition, process for producing cured film and coated article
WO2015098776A1 (ja) * 2013-12-27 2015-07-02 旭硝子株式会社 樹脂組成物
JP6754999B2 (ja) * 2015-03-05 2020-09-16 パナソニックＩｐマネジメント株式会社 樹脂組成物、低誘電率樹脂シート、プリプレグ、金属箔張り積層板、高周波回路基板および多層配線基板
JP6582448B2 (ja) 2015-03-05 2019-10-02 サミー株式会社 弾球遊技機
CN107429028B (zh) * 2015-04-01 2020-06-23 三菱铅笔株式会社 含氟系树脂的非水系分散体、包含其的产品和它们的制造方法
TWI781918B (zh) * 2016-02-02 2022-11-01 日商三菱瓦斯化學股份有限公司 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、印刷電路板及半導體裝置
CN107436535B (zh) * 2016-05-26 2022-06-10 太阳油墨制造株式会社 感光性树脂组合物、干膜、固化物和印刷电路板
CN109415571B (zh) * 2016-06-23 2021-08-03 Ａｇｃ株式会社 含有氟树脂粉末的液态组合物的制造方法
WO2018128037A1 (ja) * 2017-01-05 2018-07-12 住友電工プリントサーキット株式会社 プリント配線板の製造方法
JP6828510B2 (ja) * 2017-02-27 2021-02-10 味の素株式会社 樹脂組成物
KR102511228B1 (ko) * 2017-03-31 2023-03-17 다이요 홀딩스 가부시키가이샤 경화성 수지 조성물, 드라이 필름, 경화물, 전자 부품 및 프린트 배선판
JP6910929B2 (ja) * 2017-11-15 2021-07-28 オキツモ株式会社 フッ素樹脂粒子含有のレジストインキ組成物
CN109970953B (zh) * 2017-12-27 2021-04-09 太阳油墨（苏州）有限公司 固化性树脂组合物、干膜、固化物、及印刷电路板
JP7053345B2 (ja) * 2018-03-30 2022-04-12 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2019178418A (ja) * 2018-03-30 2019-10-17 Ｊｘ金属株式会社 金属材、プリント配線板、プリント配線板の製造方法及び電子機器の製造方法
JP7130519B2 (ja) * 2018-09-28 2022-09-05 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、および電子部品
WO2020137879A1 (ja) * 2018-12-27 2020-07-02 Ａｇｃ株式会社 パウダー分散液、積層体及びプリント基板
JP7192521B2 (ja) * 2019-01-23 2022-12-20 Dic株式会社 酸基含有（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材

Also Published As

Publication number Publication date
WO2022045237A1 (ja) 2022-03-03
KR20230058313A (ko) 2023-05-03
TW202219156A (zh) 2022-05-16
CN115996990A (zh) 2023-04-21

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