JPWO2022014451A1 - - Google Patents

Info

Publication number
JPWO2022014451A1
JPWO2022014451A1 JP2022536302A JP2022536302A JPWO2022014451A1 JP WO2022014451 A1 JPWO2022014451 A1 JP WO2022014451A1 JP 2022536302 A JP2022536302 A JP 2022536302A JP 2022536302 A JP2022536302 A JP 2022536302A JP WO2022014451 A1 JPWO2022014451 A1 JP WO2022014451A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022536302A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022014451A1 publication Critical patent/JPWO2022014451A1/ja
Priority to JP2022151400A priority Critical patent/JP7293477B2/ja
Priority to JP2022151474A priority patent/JP7417684B2/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07323—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP2022536302A 2020-07-13 2021-07-08 Pending JPWO2022014451A1 (https=)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022151400A JP7293477B2 (ja) 2020-07-13 2022-09-22 実装装置
JP2022151474A JP7417684B2 (ja) 2020-07-13 2022-09-22 実装装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020119622 2020-07-13
JP2021061465 2021-03-31
PCT/JP2021/025715 WO2022014451A1 (ja) 2020-07-13 2021-07-08 実装装置および実装方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2022151400A Division JP7293477B2 (ja) 2020-07-13 2022-09-22 実装装置
JP2022151474A Division JP7417684B2 (ja) 2020-07-13 2022-09-22 実装装置

Publications (1)

Publication Number Publication Date
JPWO2022014451A1 true JPWO2022014451A1 (https=) 2022-01-20

Family

ID=79554833

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2022536302A Pending JPWO2022014451A1 (https=) 2020-07-13 2021-07-08
JP2022151400A Active JP7293477B2 (ja) 2020-07-13 2022-09-22 実装装置
JP2022151474A Active JP7417684B2 (ja) 2020-07-13 2022-09-22 実装装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2022151400A Active JP7293477B2 (ja) 2020-07-13 2022-09-22 実装装置
JP2022151474A Active JP7417684B2 (ja) 2020-07-13 2022-09-22 実装装置

Country Status (4)

Country Link
US (1) US12347803B2 (https=)
JP (3) JPWO2022014451A1 (https=)
CN (1) CN115836383A (https=)
WO (1) WO2022014451A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023157061A1 (ja) * 2022-02-15 2023-08-24 株式会社新川 検査装置、実装装置、検査方法、及びプログラム
WO2025141803A1 (ja) * 2023-12-27 2025-07-03 株式会社Fuji 対基板作業機、および補正データ作成方法
JP2025151308A (ja) * 2024-03-28 2025-10-09 東レエンジニアリング株式会社 実装装置
JP2025151275A (ja) * 2024-03-28 2025-10-09 東レエンジニアリング株式会社 実装装置および位置合わせ方法
KR102914700B1 (ko) * 2025-01-14 2026-01-19 주식회사 브이디 정밀 프레스 장치

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000276233A (ja) * 1999-03-24 2000-10-06 Moritex Corp 位置ずれ検出装置及びそれを用いた位置決め装置
JP2007294611A (ja) * 2006-04-24 2007-11-08 Sony Corp 半導体装置及びその製造方法
JP2008109057A (ja) * 2006-10-27 2008-05-08 Toray Eng Co Ltd 半導体チップの実装装置及び実装方法
JP2010283010A (ja) * 2009-06-02 2010-12-16 Adwelds:Kk アライメント装置、この装置を備えた実装装置およびアライメント方法
JP2019102771A (ja) * 2017-12-08 2019-06-24 アスリートＦａ株式会社 電子部品実装装置及び電子部品実装方法
WO2020044580A1 (ja) * 2018-08-31 2020-03-05 ボンドテック株式会社 部品実装システムおよび部品実装方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003041478A1 (fr) * 2001-11-05 2003-05-15 Toray Engineering Co., Ltd. Procede et dispositif de montage
JP4048896B2 (ja) * 2002-09-30 2008-02-20 ソニー株式会社 ボンディング装置
JP4840862B2 (ja) * 2006-08-29 2011-12-21 東レエンジニアリング株式会社 実装装置のチップ供給方法、及びその実装装置
JP4825171B2 (ja) * 2007-06-08 2011-11-30 株式会社新川 ボンディング装置用撮像装置及び撮像方法
JP2015130414A (ja) * 2014-01-08 2015-07-16 東レエンジニアリング株式会社 自動ボンディング装置
JP6390925B2 (ja) * 2016-05-11 2018-09-19 パナソニックＩｐマネジメント株式会社 部品実装装置
JP6849468B2 (ja) * 2017-02-13 2021-03-24 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP7112341B2 (ja) * 2019-01-23 2022-08-03 東レエンジニアリング株式会社 実装装置および実装方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000276233A (ja) * 1999-03-24 2000-10-06 Moritex Corp 位置ずれ検出装置及びそれを用いた位置決め装置
JP2007294611A (ja) * 2006-04-24 2007-11-08 Sony Corp 半導体装置及びその製造方法
JP2008109057A (ja) * 2006-10-27 2008-05-08 Toray Eng Co Ltd 半導体チップの実装装置及び実装方法
JP2010283010A (ja) * 2009-06-02 2010-12-16 Adwelds:Kk アライメント装置、この装置を備えた実装装置およびアライメント方法
JP2019102771A (ja) * 2017-12-08 2019-06-24 アスリートＦａ株式会社 電子部品実装装置及び電子部品実装方法
WO2020044580A1 (ja) * 2018-08-31 2020-03-05 ボンドテック株式会社 部品実装システムおよび部品実装方法

Also Published As

Publication number Publication date
CN115836383A (zh) 2023-03-21
WO2022014451A1 (ja) 2022-01-20
JP2023051804A (ja) 2023-04-11
JP2023058432A (ja) 2023-04-25
JP7293477B2 (ja) 2023-06-19
US20230163096A1 (en) 2023-05-25
JP7417684B2 (ja) 2024-01-18
US12347803B2 (en) 2025-07-01

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