CN115836383A - 安装装置及安装方法 - Google Patents

安装装置及安装方法 Download PDF

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Publication number
CN115836383A
CN115836383A CN202180048846.0A CN202180048846A CN115836383A CN 115836383 A CN115836383 A CN 115836383A CN 202180048846 A CN202180048846 A CN 202180048846A CN 115836383 A CN115836383 A CN 115836383A
Authority
CN
China
Prior art keywords
substrate
chip
mounting
identification mark
identification
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180048846.0A
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English (en)
Chinese (zh)
Inventor
寺田胜美
滨川健史
晴孝志
田村泰司
田岛见祐
米田高志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
Original Assignee
Toray Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co Ltd filed Critical Toray Engineering Co Ltd
Publication of CN115836383A publication Critical patent/CN115836383A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07323—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
CN202180048846.0A 2020-07-13 2021-07-08 安装装置及安装方法 Pending CN115836383A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020-119622 2020-07-13
JP2020119622 2020-07-13
JP2021-061465 2021-03-31
JP2021061465 2021-03-31
PCT/JP2021/025715 WO2022014451A1 (ja) 2020-07-13 2021-07-08 実装装置および実装方法

Publications (1)

Publication Number Publication Date
CN115836383A true CN115836383A (zh) 2023-03-21

Family

ID=79554833

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180048846.0A Pending CN115836383A (zh) 2020-07-13 2021-07-08 安装装置及安装方法

Country Status (4)

Country Link
US (1) US12347803B2 (https=)
JP (3) JPWO2022014451A1 (https=)
CN (1) CN115836383A (https=)
WO (1) WO2022014451A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023157061A1 (ja) * 2022-02-15 2023-08-24 株式会社新川 検査装置、実装装置、検査方法、及びプログラム
WO2025141803A1 (ja) * 2023-12-27 2025-07-03 株式会社Fuji 対基板作業機、および補正データ作成方法
JP2025151308A (ja) * 2024-03-28 2025-10-09 東レエンジニアリング株式会社 実装装置
JP2025151275A (ja) * 2024-03-28 2025-10-09 東レエンジニアリング株式会社 実装装置および位置合わせ方法
KR102914700B1 (ko) * 2025-01-14 2026-01-19 주식회사 브이디 정밀 프레스 장치

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000276233A (ja) * 1999-03-24 2000-10-06 Moritex Corp 位置ずれ検出装置及びそれを用いた位置決め装置
WO2003041478A1 (fr) * 2001-11-05 2003-05-15 Toray Engineering Co., Ltd. Procede et dispositif de montage
JP2004127981A (ja) * 2002-09-30 2004-04-22 Sony Corp ボンディング装置
JP2008060137A (ja) * 2006-08-29 2008-03-13 Toray Eng Co Ltd 実装装置のチップ供給方法、及びその実装装置
CN101320703A (zh) * 2007-06-08 2008-12-10 株式会社新川 焊接装置用摄像装置及摄像方法
JP2015130414A (ja) * 2014-01-08 2015-07-16 東レエンジニアリング株式会社 自動ボンディング装置
CN108428643A (zh) * 2017-02-13 2018-08-21 捷进科技有限公司 半导体制造装置和半导体器件的制造方法
CN109906029A (zh) * 2017-12-08 2019-06-18 爱立发株式会社 电子部件安装装置以及电子部件安装方法
WO2020044580A1 (ja) * 2018-08-31 2020-03-05 ボンドテック株式会社 部品実装システムおよび部品実装方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5245209B2 (ja) * 2006-04-24 2013-07-24 ソニー株式会社 半導体装置及びその製造方法
JP4838095B2 (ja) * 2006-10-27 2011-12-14 東レエンジニアリング株式会社 半導体チップの実装装置及び実装方法
JP2010283010A (ja) * 2009-06-02 2010-12-16 Adwelds:Kk アライメント装置、この装置を備えた実装装置およびアライメント方法
JP6390925B2 (ja) * 2016-05-11 2018-09-19 パナソニックＩｐマネジメント株式会社 部品実装装置
JP7112341B2 (ja) * 2019-01-23 2022-08-03 東レエンジニアリング株式会社 実装装置および実装方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000276233A (ja) * 1999-03-24 2000-10-06 Moritex Corp 位置ずれ検出装置及びそれを用いた位置決め装置
WO2003041478A1 (fr) * 2001-11-05 2003-05-15 Toray Engineering Co., Ltd. Procede et dispositif de montage
JP2004127981A (ja) * 2002-09-30 2004-04-22 Sony Corp ボンディング装置
JP2008060137A (ja) * 2006-08-29 2008-03-13 Toray Eng Co Ltd 実装装置のチップ供給方法、及びその実装装置
CN101320703A (zh) * 2007-06-08 2008-12-10 株式会社新川 焊接装置用摄像装置及摄像方法
JP2015130414A (ja) * 2014-01-08 2015-07-16 東レエンジニアリング株式会社 自動ボンディング装置
CN108428643A (zh) * 2017-02-13 2018-08-21 捷进科技有限公司 半导体制造装置和半导体器件的制造方法
CN109906029A (zh) * 2017-12-08 2019-06-18 爱立发株式会社 电子部件安装装置以及电子部件安装方法
WO2020044580A1 (ja) * 2018-08-31 2020-03-05 ボンドテック株式会社 部品実装システムおよび部品実装方法

Also Published As

Publication number Publication date
WO2022014451A1 (ja) 2022-01-20
JP2023051804A (ja) 2023-04-11
JP2023058432A (ja) 2023-04-25
JP7293477B2 (ja) 2023-06-19
JPWO2022014451A1 (https=) 2022-01-20
US20230163096A1 (en) 2023-05-25
JP7417684B2 (ja) 2024-01-18
US12347803B2 (en) 2025-07-01

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