JPWO2021235288A5 - - Google Patents
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- Publication number
- JPWO2021235288A5 JPWO2021235288A5 JP2022524408A JP2022524408A JPWO2021235288A5 JP WO2021235288 A5 JPWO2021235288 A5 JP WO2021235288A5 JP 2022524408 A JP2022524408 A JP 2022524408A JP 2022524408 A JP2022524408 A JP 2022524408A JP WO2021235288 A5 JPWO2021235288 A5 JP WO2021235288A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- transformer
- transformers
- power circuit
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 26
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000001816 cooling Methods 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020088546 | 2020-05-21 | ||
| JP2020088546 | 2020-05-21 | ||
| PCT/JP2021/018016 WO2021235288A1 (ja) | 2020-05-21 | 2021-05-12 | 電力回路装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021235288A1 JPWO2021235288A1 (https=) | 2021-11-25 |
| JPWO2021235288A5 true JPWO2021235288A5 (https=) | 2022-08-10 |
| JP7305044B2 JP7305044B2 (ja) | 2023-07-07 |
Family
ID=78707865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022524408A Active JP7305044B2 (ja) | 2020-05-21 | 2021-05-12 | 電力回路装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7305044B2 (https=) |
| WO (1) | WO2021235288A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07106732A (ja) * | 1993-10-05 | 1995-04-21 | Fujitsu Ltd | コンデンサの実装構造 |
| WO2002049106A1 (fr) * | 2000-12-11 | 2002-06-20 | Fujitsu Limited | Module électronique |
| US6767765B2 (en) * | 2002-03-27 | 2004-07-27 | Intel Corporation | Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device |
| JP2008125249A (ja) * | 2006-11-13 | 2008-05-29 | Densei Lambda Kk | 電源装置 |
| JP2008187136A (ja) * | 2007-01-31 | 2008-08-14 | Densei Lambda Kk | 放熱構造 |
| US8498124B1 (en) * | 2009-12-10 | 2013-07-30 | Universal Lighting Technologies, Inc. | Magnetic circuit board stacking component |
| US8659895B1 (en) * | 2011-05-13 | 2014-02-25 | Google Inc. | Air-cooled data center rows |
| JP5758747B2 (ja) * | 2011-08-30 | 2015-08-05 | 新電元工業株式会社 | トランス装置 |
| EP3399546A1 (de) * | 2017-05-02 | 2018-11-07 | Siemens Aktiengesellschaft | Elektronische baugruppe mit einem zwischen zwei substraten eingebauten bauelement und verfahren zu dessen herstellung |
-
2021
- 2021-05-12 WO PCT/JP2021/018016 patent/WO2021235288A1/ja not_active Ceased
- 2021-05-12 JP JP2022524408A patent/JP7305044B2/ja active Active
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