JPWO2024071110A5 - - Google Patents

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Publication number
JPWO2024071110A5
JPWO2024071110A5 JP2024549418A JP2024549418A JPWO2024071110A5 JP WO2024071110 A5 JPWO2024071110 A5 JP WO2024071110A5 JP 2024549418 A JP2024549418 A JP 2024549418A JP 2024549418 A JP2024549418 A JP 2024549418A JP WO2024071110 A5 JPWO2024071110 A5 JP WO2024071110A5
Authority
JP
Japan
Prior art keywords
module according
semiconductor module
substrate
heat dissipation
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024549418A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024071110A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/034917 external-priority patent/WO2024071110A1/ja
Publication of JPWO2024071110A1 publication Critical patent/JPWO2024071110A1/ja
Publication of JPWO2024071110A5 publication Critical patent/JPWO2024071110A5/ja
Pending legal-status Critical Current

Links

JP2024549418A 2022-09-26 2023-09-26 Pending JPWO2024071110A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022152741 2022-09-26
PCT/JP2023/034917 WO2024071110A1 (ja) 2022-09-26 2023-09-26 半導体モジュール

Publications (2)

Publication Number Publication Date
JPWO2024071110A1 JPWO2024071110A1 (https=) 2024-04-04
JPWO2024071110A5 true JPWO2024071110A5 (https=) 2025-06-12

Family

ID=90478003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024549418A Pending JPWO2024071110A1 (https=) 2022-09-26 2023-09-26

Country Status (4)

Country Link
EP (1) EP4597565A1 (https=)
JP (1) JPWO2024071110A1 (https=)
CN (1) CN119895565A (https=)
WO (1) WO2024071110A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3405402B2 (ja) * 1999-06-23 2003-05-12 日本電気株式会社 並列伝送型光モジュールおよびその製造方法
JP3834023B2 (ja) * 2003-08-19 2006-10-18 株式会社東芝 インターフェイスモジュール付ｌｓｉパッケージ及びそれに用いるヒートシンク
JP5182166B2 (ja) * 2009-03-12 2013-04-10 日立電線株式会社 光送受信器
JP5904146B2 (ja) * 2013-03-13 2016-04-13 日立金属株式会社 通信モジュール及びそれを備えた信号伝送装置
JP6155531B2 (ja) * 2013-10-25 2017-07-05 ＡＰＲＥＳＩＡ Ｓｙｓｔｅｍｓ株式会社 光通信モジュール
JP2016031990A (ja) * 2014-07-28 2016-03-07 日立金属株式会社 光電気変換モジュールおよび光電気変換モジュールを用いた伝送装置
JP7087738B2 (ja) 2018-07-04 2022-06-21 沖電気工業株式会社 光通信装置、及び光通信装置の製造方法

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