CN119895565A - 半导体模块 - Google Patents

半导体模块 Download PDF

Info

Publication number
CN119895565A
CN119895565A CN202380066637.8A CN202380066637A CN119895565A CN 119895565 A CN119895565 A CN 119895565A CN 202380066637 A CN202380066637 A CN 202380066637A CN 119895565 A CN119895565 A CN 119895565A
Authority
CN
China
Prior art keywords
substrate
semiconductor module
module according
heat dissipation
chip resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380066637.8A
Other languages
English (en)
Chinese (zh)
Inventor
辻野咲季
赤星知幸
山本崇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN119895565A publication Critical patent/CN119895565A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/293—Configurations of stacked chips characterised by non-galvanic coupling between the chips, e.g. capacitive coupling
    • H10W90/295—Configurations of stacked chips characterised by non-galvanic coupling between the chips, e.g. capacitive coupling optical coupling

Landscapes

  • Optical Couplings Of Light Guides (AREA)
CN202380066637.8A 2022-09-26 2023-09-26 半导体模块 Pending CN119895565A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022152741 2022-09-26
JP2022-152741 2022-09-26
PCT/JP2023/034917 WO2024071110A1 (ja) 2022-09-26 2023-09-26 半導体モジュール

Publications (1)

Publication Number Publication Date
CN119895565A true CN119895565A (zh) 2025-04-25

Family

ID=90478003

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380066637.8A Pending CN119895565A (zh) 2022-09-26 2023-09-26 半导体模块

Country Status (4)

Country Link
EP (1) EP4597565A1 (https=)
JP (1) JPWO2024071110A1 (https=)
CN (1) CN119895565A (https=)
WO (1) WO2024071110A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3405402B2 (ja) * 1999-06-23 2003-05-12 日本電気株式会社 並列伝送型光モジュールおよびその製造方法
JP3834023B2 (ja) * 2003-08-19 2006-10-18 株式会社東芝 インターフェイスモジュール付ｌｓｉパッケージ及びそれに用いるヒートシンク
JP5182166B2 (ja) * 2009-03-12 2013-04-10 日立電線株式会社 光送受信器
JP5904146B2 (ja) * 2013-03-13 2016-04-13 日立金属株式会社 通信モジュール及びそれを備えた信号伝送装置
JP6155531B2 (ja) * 2013-10-25 2017-07-05 ＡＰＲＥＳＩＡ Ｓｙｓｔｅｍｓ株式会社 光通信モジュール
JP2016031990A (ja) * 2014-07-28 2016-03-07 日立金属株式会社 光電気変換モジュールおよび光電気変換モジュールを用いた伝送装置
JP7087738B2 (ja) 2018-07-04 2022-06-21 沖電気工業株式会社 光通信装置、及び光通信装置の製造方法

Also Published As

Publication number Publication date
EP4597565A1 (en) 2025-08-06
JPWO2024071110A1 (https=) 2024-04-04
WO2024071110A1 (ja) 2024-04-04

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