JPWO2024071110A1 - - Google Patents
Info
- Publication number
- JPWO2024071110A1 JPWO2024071110A1 JP2024549418A JP2024549418A JPWO2024071110A1 JP WO2024071110 A1 JPWO2024071110 A1 JP WO2024071110A1 JP 2024549418 A JP2024549418 A JP 2024549418A JP 2024549418 A JP2024549418 A JP 2024549418A JP WO2024071110 A1 JPWO2024071110 A1 JP WO2024071110A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
- H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/20—Configurations of stacked chips
- H10W90/293—Configurations of stacked chips characterised by non-galvanic coupling between the chips, e.g. capacitive coupling
- H10W90/295—Configurations of stacked chips characterised by non-galvanic coupling between the chips, e.g. capacitive coupling optical coupling
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022152741 | 2022-09-26 | ||
| PCT/JP2023/034917 WO2024071110A1 (ja) | 2022-09-26 | 2023-09-26 | 半導体モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024071110A1 true JPWO2024071110A1 (https=) | 2024-04-04 |
| JPWO2024071110A5 JPWO2024071110A5 (https=) | 2025-06-12 |
Family
ID=90478003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024549418A Pending JPWO2024071110A1 (https=) | 2022-09-26 | 2023-09-26 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4597565A1 (https=) |
| JP (1) | JPWO2024071110A1 (https=) |
| CN (1) | CN119895565A (https=) |
| WO (1) | WO2024071110A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001007403A (ja) * | 1999-06-23 | 2001-01-12 | Nec Corp | 並列伝送型光モジュールおよびその製造方法 |
| JP2005064384A (ja) * | 2003-08-19 | 2005-03-10 | Toshiba Corp | インターフェイスモジュール付ｌｓｉパッケージ及びそれに用いるヒートシンク |
| JP2010211157A (ja) * | 2009-03-12 | 2010-09-24 | Hitachi Cable Ltd | 光送受信器 |
| JP2014178383A (ja) * | 2013-03-13 | 2014-09-25 | Hitachi Metals Ltd | 通信モジュール及びそれを備えた信号伝送装置 |
| JP2015084040A (ja) * | 2013-10-25 | 2015-04-30 | 日立金属株式会社 | 光通信モジュール |
| JP2016031990A (ja) * | 2014-07-28 | 2016-03-07 | 日立金属株式会社 | 光電気変換モジュールおよび光電気変換モジュールを用いた伝送装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7087738B2 (ja) | 2018-07-04 | 2022-06-21 | 沖電気工業株式会社 | 光通信装置、及び光通信装置の製造方法 |
-
2023
- 2023-09-26 WO PCT/JP2023/034917 patent/WO2024071110A1/ja not_active Ceased
- 2023-09-26 EP EP23872333.2A patent/EP4597565A1/en not_active Withdrawn
- 2023-09-26 CN CN202380066637.8A patent/CN119895565A/zh active Pending
- 2023-09-26 JP JP2024549418A patent/JPWO2024071110A1/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001007403A (ja) * | 1999-06-23 | 2001-01-12 | Nec Corp | 並列伝送型光モジュールおよびその製造方法 |
| JP2005064384A (ja) * | 2003-08-19 | 2005-03-10 | Toshiba Corp | インターフェイスモジュール付ｌｓｉパッケージ及びそれに用いるヒートシンク |
| JP2010211157A (ja) * | 2009-03-12 | 2010-09-24 | Hitachi Cable Ltd | 光送受信器 |
| JP2014178383A (ja) * | 2013-03-13 | 2014-09-25 | Hitachi Metals Ltd | 通信モジュール及びそれを備えた信号伝送装置 |
| JP2015084040A (ja) * | 2013-10-25 | 2015-04-30 | 日立金属株式会社 | 光通信モジュール |
| JP2016031990A (ja) * | 2014-07-28 | 2016-03-07 | 日立金属株式会社 | 光電気変換モジュールおよび光電気変換モジュールを用いた伝送装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4597565A1 (en) | 2025-08-06 |
| WO2024071110A1 (ja) | 2024-04-04 |
| CN119895565A (zh) | 2025-04-25 |
Similar Documents
Legal Events
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