|
JPH0798463A
(ja)
|
1993-05-10 |
1995-04-11 |
Matsushita Electric Ind Co Ltd |
空間光接続装置
|
|
US5416861A
(en)
|
1994-04-29 |
1995-05-16 |
University Of Cincinnati |
Optical synchronous clock distribution network and high-speed signal distribution network
|
|
US5771323A
(en)
|
1996-08-28 |
1998-06-23 |
Hewlett-Packard Company |
Micro-photonics module
|
|
US5930429A
(en)
|
1997-07-01 |
1999-07-27 |
Hewlett-Packard Company |
Micro-photonics module integrated on a single substrate
|
|
US6202165B1
(en)
|
1998-07-23 |
2001-03-13 |
Conexant Systems, Inc. |
Photonic clock distribution method and apparatus for electronic systems
|
|
US6684007B2
(en)
*
|
1998-10-09 |
2004-01-27 |
Fujitsu Limited |
Optical coupling structures and the fabrication processes
|
|
US6650803B1
(en)
|
1999-11-02 |
2003-11-18 |
Xros, Inc. |
Method and apparatus for optical to electrical to optical conversion in an optical cross-connect switch
|
|
US6477285B1
(en)
|
2000-06-30 |
2002-11-05 |
Motorola, Inc. |
Integrated circuits with optical signal propagation
|
|
US7941056B2
(en)
|
2001-08-30 |
2011-05-10 |
Micron Technology, Inc. |
Optical interconnect in high-speed memory systems
|
|
US20080044128A1
(en)
|
2001-10-09 |
2008-02-21 |
Infinera Corporation |
TRANSMITTER PHOTONIC INTEGRATED CIRCUITS (TxPICs) AND OPTICAL TRANSPORT NETWORK SYSTEM EMPLOYING TxPICs
|
|
JP4202216B2
(ja)
*
|
2003-09-05 |
2008-12-24 |
日本特殊陶業株式会社 |
光電気複合配線構造体、光学素子搭載基板と光導波路層と光路変換部品とからなる構造体
|
|
US7251386B1
(en)
|
2004-01-14 |
2007-07-31 |
Luxtera, Inc |
Integrated photonic-electronic circuits and systems
|
|
JP3987500B2
(ja)
*
|
2004-02-17 |
2007-10-10 |
浜松ホトニクス株式会社 |
光配線基板および光配線基板の製造方法
|
|
US7271461B2
(en)
|
2004-02-27 |
2007-09-18 |
Banpil Photonics |
Stackable optoelectronics chip-to-chip interconnects and method of manufacturing
|
|
US7310459B1
(en)
|
2005-10-25 |
2007-12-18 |
Xilinx, Inc. |
On-chip programmable optical crossbar switch
|
|
KR101294008B1
(ko)
*
|
2006-07-24 |
2013-08-07 |
삼성디스플레이 주식회사 |
백라이트 어셈블리, 이의 제조 방법 및 이를 갖는 표시장치
|
|
US7894699B2
(en)
|
2006-10-16 |
2011-02-22 |
Hewlett-Packard Development Company, L.P. |
Photonic based interconnects for interconnecting multiple integrated circuits
|
|
JP4825739B2
(ja)
*
|
2007-06-22 |
2011-11-30 |
株式会社日立製作所 |
光電気混載基板と光電気パッケージとの構造体
|
|
US7898885B2
(en)
|
2007-07-19 |
2011-03-01 |
Micron Technology, Inc. |
Analog sensing of memory cells in a solid state memory device
|
|
US8346087B2
(en)
|
2007-09-28 |
2013-01-01 |
Oracle America, Inc. |
Wavelength-division multiplexing for use in multi-chip systems
|
|
US8064739B2
(en)
|
2007-10-23 |
2011-11-22 |
Hewlett-Packard Development Company, L.P. |
Three-dimensional die stacks with inter-device and intra-device optical interconnect
|
|
US8059443B2
(en)
|
2007-10-23 |
2011-11-15 |
Hewlett-Packard Development Company, L.P. |
Three-dimensional memory module architectures
|
|
US7532785B1
(en)
|
2007-10-23 |
2009-05-12 |
Hewlett-Packard Development Company, L.P. |
Photonic interconnects for computer system devices
|
|
DE112008003647B4
(de)
|
2008-01-30 |
2015-05-21 |
Hewlett-Packard Development Company, L.P. |
Optische Verbindungen
|
|
US8831437B2
(en)
|
2009-09-04 |
2014-09-09 |
Luxtera, Inc. |
Method and system for a photonic interposer
|
|
EP3572796B8
(en)
|
2008-10-27 |
2023-01-18 |
Genalyte, Inc. |
Biosensors based on optical probing and sensing
|
|
US8450186B2
(en)
|
2009-09-25 |
2013-05-28 |
Intel Corporation |
Optical modulator utilizing wafer bonding technology
|
|
US8862178B2
(en)
|
2010-02-24 |
2014-10-14 |
Qualcomm Incorporated |
Methods and systems for managing participation in multiple wireless networks
|
|
US9217830B2
(en)
|
2010-05-14 |
2015-12-22 |
Cornell University |
Electro-optic modulator structures, related methods and applications
|
|
US9316788B2
(en)
|
2010-10-14 |
2016-04-19 |
Rwth Aachen |
Laser to chip coupler
|
|
US9099965B2
(en)
|
2010-12-01 |
2015-08-04 |
Stmicroelectronics S.R.L. |
Integrated driver and related method
|
|
US8222084B2
(en)
|
2010-12-08 |
2012-07-17 |
Skorpios Technologies, Inc. |
Method and system for template assisted wafer bonding
|
|
US20120203695A1
(en)
|
2011-02-09 |
2012-08-09 |
American Express Travel Related Services Company, Inc. |
Systems and methods for facilitating secure transactions
|
|
JP5897414B2
(ja)
|
2011-08-23 |
2016-03-30 |
日本オクラロ株式会社 |
光デバイスの製造方法
|
|
US9331051B2
(en)
|
2011-11-04 |
2016-05-03 |
Technische Universiteit Eindhoven |
Wafer scale technique for interconnecting vertically stacked dies
|
|
WO2013081633A1
(en)
|
2011-12-02 |
2013-06-06 |
Intel Corporation |
Stacked memory allowing variance in device interconnects
|
|
WO2013086047A1
(en)
|
2011-12-06 |
2013-06-13 |
Cornell University |
Integrated multi-chip module optical interconnect platform
|
|
US8548288B2
(en)
|
2011-12-20 |
2013-10-01 |
Oracle International Corporation |
Efficient inter-chip optical coupling
|
|
US9570883B2
(en)
|
2011-12-28 |
2017-02-14 |
Intel Corporation |
Photonic package architecture
|
|
US8792786B2
(en)
|
2012-03-15 |
2014-07-29 |
Massachusetts Institute Of Technology |
Photonically-enabled in-flight data reorganization
|
|
US9697147B2
(en)
|
2012-08-06 |
2017-07-04 |
Advanced Micro Devices, Inc. |
Stacked memory device with metadata management
|
|
US9236958B2
(en)
|
2012-08-10 |
2016-01-12 |
Skorpios Technologies, Inc. |
Method and system for performing testing of photonic devices
|
|
US9922887B2
(en)
|
2012-12-11 |
2018-03-20 |
Acacia Communications, Inc. |
Wafer-scale testing of photonic integrated circuits using horizontal spot-size converters
|
|
KR102048251B1
(ko)
|
2013-03-14 |
2019-11-25 |
삼성전자주식회사 |
메모리 칩 패키지, 그것을 포함하는 메모리 시스템, 그것의 구동 방법
|
|
GB2512379A
(en)
|
2013-03-28 |
2014-10-01 |
Ibm |
Photonic and/or optoelectronic packaging assembly
|
|
US9766409B2
(en)
|
2013-06-10 |
2017-09-19 |
Nxp Usa, Inc. |
Optical redundancy
|
|
US9094135B2
(en)
|
2013-06-10 |
2015-07-28 |
Freescale Semiconductor, Inc. |
Die stack with optical TSVs
|
|
JP6277851B2
(ja)
*
|
2014-05-08 |
2018-02-14 |
富士通株式会社 |
光モジュール
|
|
US9960888B2
(en)
|
2014-06-26 |
2018-05-01 |
Luxtera, Inc. |
Method and system for an optoelectronic built-in self-test system for silicon photonics optical transceivers
|
|
WO2016008771A1
(en)
|
2014-07-14 |
2016-01-21 |
University Of Copenhagen |
Optical device having efficient light-matter interface for quantum simulations
|
|
US9671572B2
(en)
*
|
2014-09-22 |
2017-06-06 |
Oracle International Corporation |
Integrated chip package with optical interface
|
|
US9558779B2
(en)
|
2014-12-22 |
2017-01-31 |
Mohammad A Mazed |
System on chip (SoC) based on phase transition and/or phase change material
|
|
US20160191188A1
(en)
|
2014-12-31 |
2016-06-30 |
Alcatel-Lucent Usa Inc. |
System and method for local interconnection of optical nodes
|
|
US9678271B2
(en)
*
|
2015-01-26 |
2017-06-13 |
Oracle International Corporation |
Packaged opto-electronic module
|
|
US9976844B2
(en)
|
2015-02-06 |
2018-05-22 |
Medlumics S.L. |
Miniaturized OCT package and assembly thereof
|
|
US9606308B2
(en)
|
2015-02-27 |
2017-03-28 |
International Business Machines Corporation |
Three dimensional self-alignment of flip chip assembly using solder surface tension during solder reflow
|
|
JP6445138B2
(ja)
*
|
2015-03-20 |
2018-12-26 |
オリンパス株式会社 |
光伝送モジュール、内視鏡、および前記光伝送モジュールの製造方法
|
|
US9910232B2
(en)
|
2015-10-21 |
2018-03-06 |
Luxtera, Inc. |
Method and system for a chip-on-wafer-on-substrate assembly
|
|
US10026723B2
(en)
*
|
2016-01-04 |
2018-07-17 |
Infinera Corporation |
Photonic integrated circuit package
|
|
IT201600084419A1
(it)
*
|
2016-08-10 |
2018-02-10 |
St Microelectronics Srl |
Procedimento per realizzare dispositivi a semiconduttore, dispositivo e circuito corrispondenti
|
|
JP6849907B2
(ja)
*
|
2016-12-01 |
2021-03-31 |
富士通株式会社 |
光モジュール及び光モジュールの製造方法
|
|
JP7145515B2
(ja)
*
|
2017-04-28 |
2022-10-03 |
国立研究開発法人産業技術総合研究所 |
光電子集積回路及びコンピューティング装置
|
|
JP2018195723A
(ja)
*
|
2017-05-18 |
2018-12-06 |
富士通株式会社 |
光モジュールおよびその製造方法並びに光トランシーバ
|
|
US11239377B2
(en)
*
|
2017-08-07 |
2022-02-01 |
Rockley Photonics Limited |
Optoelectronic module package
|
|
US10371893B2
(en)
|
2017-11-30 |
2019-08-06 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Hybrid interconnect device and method
|
|
US11011503B2
(en)
*
|
2017-12-15 |
2021-05-18 |
Invensas Bonding Technologies, Inc. |
Direct-bonded optoelectronic interconnect for high-density integrated photonics
|
|
US11335663B2
(en)
*
|
2017-12-29 |
2022-05-17 |
Intel Corporation |
Microelectronic assemblies
|
|
CN111902755B
(zh)
|
2018-02-05 |
2023-05-09 |
申泰公司 |
光转接板
|
|
US10490503B2
(en)
*
|
2018-03-27 |
2019-11-26 |
Intel Corporation |
Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling same
|
|
US10859776B2
(en)
*
|
2018-04-06 |
2020-12-08 |
The Regents Of The University Of California |
Optical-electrical interposers
|
|
US10872854B2
(en)
*
|
2018-04-25 |
2020-12-22 |
Rockley Photonics Limited |
Electro-optical package and method of fabrication
|
|
US10560765B2
(en)
|
2018-04-25 |
2020-02-11 |
Western Digital Technologies, Inc. |
Node with combined optical and electrical switching
|
|
US11367711B2
(en)
|
2018-05-17 |
2022-06-21 |
Lightmatter, Inc. |
Optically interfaced stacked memories and related methods and systems
|
|
US10930628B2
(en)
*
|
2018-06-27 |
2021-02-23 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Photonic semiconductor device and method
|
|
US11621249B2
(en)
|
2018-09-04 |
2023-04-04 |
Monolithic 3D Inc. |
3D semiconductor device and structure
|
|
US20200111720A1
(en)
*
|
2018-10-05 |
2020-04-09 |
Intel Corporation |
Dual side die packaging for enhanced heat dissipation
|
|
CN113853753B
(zh)
|
2019-03-06 |
2025-03-14 |
轻物质公司 |
光子通信平台
|
|
US12092861B2
(en)
|
2019-09-27 |
2024-09-17 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Photonic semiconductor device and method of manufacture
|
|
US11417698B2
(en)
|
2019-12-26 |
2022-08-16 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Semiconductor package and method of forming the same
|
|
WO2021158500A1
(en)
|
2020-02-03 |
2021-08-12 |
Lightmatter, Inc. |
Photonic wafer communication systems and related packages
|
|
TWI906257B
(zh)
|
2020-02-14 |
2025-12-01 |
美商爾雅實驗室公司 |
藉由單體式封裝光學i/o實施的遠端記憶體架構
|
|
US12130484B2
(en)
|
2021-09-13 |
2024-10-29 |
Lightmatter, Inc. |
Yield enhancement techniques for photonic communications platform
|
|
CN118202286A
(zh)
|
2021-10-13 |
2024-06-14 |
光物质公司 |
多光罩光子通信平台上的多租户隔离
|
|
EP4500242A4
(en)
|
2022-03-28 |
2026-03-04 |
Lightmatter Inc |
Photonic communication platform and related architectures, systems and methods
|