JPH11284006A5 - - Google Patents

Info

Publication number
JPH11284006A5
JPH11284006A5 JP1998087003A JP8700398A JPH11284006A5 JP H11284006 A5 JPH11284006 A5 JP H11284006A5 JP 1998087003 A JP1998087003 A JP 1998087003A JP 8700398 A JP8700398 A JP 8700398A JP H11284006 A5 JPH11284006 A5 JP H11284006A5
Authority
JP
Japan
Prior art keywords
insulating substrate
semiconductor device
ball bumps
semiconductor chip
electrode patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998087003A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11284006A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP10087003A priority Critical patent/JPH11284006A/ja
Priority claimed from JP10087003A external-priority patent/JPH11284006A/ja
Priority to US09/274,939 priority patent/US6160313A/en
Priority to TW088104943A priority patent/TW413911B/zh
Priority to KR1019990010808A priority patent/KR100313826B1/ko
Publication of JPH11284006A publication Critical patent/JPH11284006A/ja
Publication of JPH11284006A5 publication Critical patent/JPH11284006A5/ja
Pending legal-status Critical Current

Links

JP10087003A 1998-03-31 1998-03-31 半導体装置 Pending JPH11284006A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP10087003A JPH11284006A (ja) 1998-03-31 1998-03-31 半導体装置
US09/274,939 US6160313A (en) 1998-03-31 1999-03-23 Semiconductor device having an insulating substrate
TW088104943A TW413911B (en) 1998-03-31 1999-03-29 Semiconductor device having an insulating substrate
KR1019990010808A KR100313826B1 (ko) 1998-03-31 1999-03-29 반도체 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10087003A JPH11284006A (ja) 1998-03-31 1998-03-31 半導体装置

Publications (2)

Publication Number Publication Date
JPH11284006A JPH11284006A (ja) 1999-10-15
JPH11284006A5 true JPH11284006A5 (https=) 2004-12-02

Family

ID=13902733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10087003A Pending JPH11284006A (ja) 1998-03-31 1998-03-31 半導体装置

Country Status (4)

Country Link
US (1) US6160313A (https=)
JP (1) JPH11284006A (https=)
KR (1) KR100313826B1 (https=)
TW (1) TW413911B (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1030366B1 (en) 1999-02-15 2005-10-19 Mitsubishi Gas Chemical Company, Inc. Printed wiring board for semiconductor plastic package
JP2000236040A (ja) * 1999-02-15 2000-08-29 Hitachi Ltd 半導体装置
US7324118B2 (en) * 2001-08-31 2008-01-29 Ricoh Company, Ltd. Super imposed image display color selection system and method
JP2003109986A (ja) * 2001-09-27 2003-04-11 Toshiba Corp 半導体装置
US6476506B1 (en) * 2001-09-28 2002-11-05 Motorola, Inc. Packaged semiconductor with multiple rows of bond pads and method therefor
US6531762B1 (en) * 2001-11-14 2003-03-11 Siliconware Precision Industries Co., Ltd. Semiconductor package
CN1303676C (zh) * 2002-06-18 2007-03-07 矽品精密工业股份有限公司 用以缩短打线长度的半导体封装件
EP1435659A1 (en) * 2002-12-17 2004-07-07 Dialog Semiconductor GmbH Partially populated ball grid design to accomodate landing pads close to the die
KR100592786B1 (ko) * 2003-08-22 2006-06-26 삼성전자주식회사 면 실장형 반도체 패키지를 이용한 적층 패키지 및 그제조 방법
JP4570868B2 (ja) * 2003-12-26 2010-10-27 ルネサスエレクトロニクス株式会社 半導体装置
JP4533173B2 (ja) * 2004-02-24 2010-09-01 キヤノン株式会社 半導体集積回路装置
DE102005035083B4 (de) * 2004-07-24 2007-08-23 Samsung Electronics Co., Ltd., Suwon Bondverbindungssystem, Halbleiterbauelementpackung und Drahtbondverfahren
JP4613590B2 (ja) * 2004-11-16 2011-01-19 セイコーエプソン株式会社 実装基板及び電子機器
KR101013554B1 (ko) * 2008-10-08 2011-02-14 주식회사 하이닉스반도체 적층 반도체 패키지 및 이의 제조 방법
CN201780975U (zh) * 2010-07-30 2011-03-30 国基电子（上海）有限公司 焊盘及具有该焊盘的封装芯片
JP5642473B2 (ja) * 2010-09-22 2014-12-17 セイコーインスツル株式会社 Ｂｇａ半導体パッケージおよびその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2840948B2 (ja) * 1988-08-23 1998-12-24 富士ゼロックス株式会社 半導体装置
JPH0770553B2 (ja) * 1988-09-26 1995-07-31 日本電気株式会社 半導体集積回路装置の製造方法
JPH08115989A (ja) * 1994-08-24 1996-05-07 Fujitsu Ltd 半導体装置及びその製造方法
JP3264147B2 (ja) * 1995-07-18 2002-03-11 日立電線株式会社 半導体装置、半導体装置用インターポーザ及びその製造方法
MY123146A (en) * 1996-03-28 2006-05-31 Intel Corp Perimeter matrix ball grid array circuit package with a populated center

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