JPH11284006A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH11284006A
JPH11284006A JP10087003A JP8700398A JPH11284006A JP H11284006 A JPH11284006 A JP H11284006A JP 10087003 A JP10087003 A JP 10087003A JP 8700398 A JP8700398 A JP 8700398A JP H11284006 A JPH11284006 A JP H11284006A
Authority
JP
Japan
Prior art keywords
tape
semiconductor device
electrode
semiconductor chip
shaped substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10087003A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11284006A5 (https=
Inventor
Akira Takashima
晃 高島
Fumihiko Taniguchi
文彦 谷口
Toshihisa Higashiyama
敏久 東山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10087003A priority Critical patent/JPH11284006A/ja
Priority to US09/274,939 priority patent/US6160313A/en
Priority to TW088104943A priority patent/TW413911B/zh
Priority to KR1019990010808A priority patent/KR100313826B1/ko
Publication of JPH11284006A publication Critical patent/JPH11284006A/ja
Publication of JPH11284006A5 publication Critical patent/JPH11284006A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP10087003A 1998-03-31 1998-03-31 半導体装置 Pending JPH11284006A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP10087003A JPH11284006A (ja) 1998-03-31 1998-03-31 半導体装置
US09/274,939 US6160313A (en) 1998-03-31 1999-03-23 Semiconductor device having an insulating substrate
TW088104943A TW413911B (en) 1998-03-31 1999-03-29 Semiconductor device having an insulating substrate
KR1019990010808A KR100313826B1 (ko) 1998-03-31 1999-03-29 반도체 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10087003A JPH11284006A (ja) 1998-03-31 1998-03-31 半導体装置

Publications (2)

Publication Number Publication Date
JPH11284006A true JPH11284006A (ja) 1999-10-15
JPH11284006A5 JPH11284006A5 (https=) 2004-12-02

Family

ID=13902733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10087003A Pending JPH11284006A (ja) 1998-03-31 1998-03-31 半導体装置

Country Status (4)

Country Link
US (1) US6160313A (https=)
JP (1) JPH11284006A (https=)
KR (1) KR100313826B1 (https=)
TW (1) TW413911B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005191447A (ja) * 2003-12-26 2005-07-14 Renesas Technology Corp 半導体装置およびその製造方法
JP2005277392A (ja) * 2004-02-24 2005-10-06 Canon Inc 半導体集積回路装置
JP2006041529A (ja) * 2004-07-24 2006-02-09 Samsung Electronics Co Ltd リードフレーム基盤及び基板基盤半導体パッケージ用ボンディング構造とその製造方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1030366B1 (en) 1999-02-15 2005-10-19 Mitsubishi Gas Chemical Company, Inc. Printed wiring board for semiconductor plastic package
JP2000236040A (ja) * 1999-02-15 2000-08-29 Hitachi Ltd 半導体装置
US7324118B2 (en) * 2001-08-31 2008-01-29 Ricoh Company, Ltd. Super imposed image display color selection system and method
JP2003109986A (ja) * 2001-09-27 2003-04-11 Toshiba Corp 半導体装置
US6476506B1 (en) * 2001-09-28 2002-11-05 Motorola, Inc. Packaged semiconductor with multiple rows of bond pads and method therefor
US6531762B1 (en) * 2001-11-14 2003-03-11 Siliconware Precision Industries Co., Ltd. Semiconductor package
CN1303676C (zh) * 2002-06-18 2007-03-07 矽品精密工业股份有限公司 用以缩短打线长度的半导体封装件
EP1435659A1 (en) * 2002-12-17 2004-07-07 Dialog Semiconductor GmbH Partially populated ball grid design to accomodate landing pads close to the die
KR100592786B1 (ko) * 2003-08-22 2006-06-26 삼성전자주식회사 면 실장형 반도체 패키지를 이용한 적층 패키지 및 그제조 방법
JP4613590B2 (ja) * 2004-11-16 2011-01-19 セイコーエプソン株式会社 実装基板及び電子機器
KR101013554B1 (ko) * 2008-10-08 2011-02-14 주식회사 하이닉스반도체 적층 반도체 패키지 및 이의 제조 방법
CN201780975U (zh) * 2010-07-30 2011-03-30 国基电子（上海）有限公司 焊盘及具有该焊盘的封装芯片
JP5642473B2 (ja) * 2010-09-22 2014-12-17 セイコーインスツル株式会社 Ｂｇａ半導体パッケージおよびその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2840948B2 (ja) * 1988-08-23 1998-12-24 富士ゼロックス株式会社 半導体装置
JPH0770553B2 (ja) * 1988-09-26 1995-07-31 日本電気株式会社 半導体集積回路装置の製造方法
JPH08115989A (ja) * 1994-08-24 1996-05-07 Fujitsu Ltd 半導体装置及びその製造方法
JP3264147B2 (ja) * 1995-07-18 2002-03-11 日立電線株式会社 半導体装置、半導体装置用インターポーザ及びその製造方法
MY123146A (en) * 1996-03-28 2006-05-31 Intel Corp Perimeter matrix ball grid array circuit package with a populated center

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005191447A (ja) * 2003-12-26 2005-07-14 Renesas Technology Corp 半導体装置およびその製造方法
JP2005277392A (ja) * 2004-02-24 2005-10-06 Canon Inc 半導体集積回路装置
US7902658B2 (en) 2004-02-24 2011-03-08 Canon Kabushiki Kaisha Integrated circuit having wide power lines
JP2006041529A (ja) * 2004-07-24 2006-02-09 Samsung Electronics Co Ltd リードフレーム基盤及び基板基盤半導体パッケージ用ボンディング構造とその製造方法

Also Published As

Publication number Publication date
KR19990078363A (ko) 1999-10-25
KR100313826B1 (ko) 2001-11-15
US6160313A (en) 2000-12-12
TW413911B (en) 2000-12-01

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