CN201780975U - 焊盘及具有该焊盘的封装芯片 - Google Patents

焊盘及具有该焊盘的封装芯片 Download PDF

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CN201780975U
CN201780975U CN201020277093XU CN201020277093U CN201780975U CN 201780975 U CN201780975 U CN 201780975U CN 201020277093X U CN201020277093X U CN 201020277093XU CN 201020277093 U CN201020277093 U CN 201020277093U CN 201780975 U CN201780975 U CN 201780975U
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pad
filter capacitor
packaged chip
bonding pad
groups
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梁婷
亓艳
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Ambit Microsystems Shanghai Ltd
Hon Hai Precision Industry Co Ltd
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Ambit Microsystems Shanghai Ltd
Hon Hai Precision Industry Co Ltd
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Abstract

本实用新型涉及一种焊盘及具有该焊盘的封装芯片。该焊盘用以贴装滤波电容，为一四角处分别切割掉四个扇形区域的正方形区域。本实用新型的焊盘将会和周围过孔产生干涉的部分切除，使焊盘的边缘与周围过孔的距离可确保每个电源管脚放置滤波电容，从而提高滤波电容的设置密度，保证电源的完整性。

Description

焊盘及具有该焊盘的封装芯片
技术领域
本实用新型涉及一种焊盘及具有该焊盘的封装芯片，尤其涉及一种适用于贴装电容的焊盘及具有该焊盘的球栅阵列封装技术(Ball Grid Array Package，BGA)封装芯片。
背景技术
随着电子设备元器件密度的不断提高，小间距封装应用日益广泛，其中，较为常见的为BGA封装技术。然而，BGA封装芯片在设计时，一般要求在每个电源管脚都连接至少一滤波电容，若BGA芯片体积较小或其中两管脚间距过小，则很难实现。
请参阅图1所示的一种现有的BGA封装芯片10，其正面上设有若干管脚11及若干用以引出每一管脚11信号的过孔12。该等管脚11及过孔12均匀地布设于BGA封装芯片10的正面。
请一并参阅图2，该BGA封装芯片10的背面设有若干现有的用以贴设滤波电容的焊盘13，贴设于该焊盘13的滤波电容可通过过孔12与电源管脚11相连。然而，在贴装过程中，为保证焊盘13之间间距，例如为1mm，则会因该焊盘13与周围过孔12的距离过小，即部分与过孔12干涉，而导致滤波电容无法装入焊盘13。或者，贴装滤波电容至焊盘13后，导致BGA封装芯片10上无法设置过孔12。
因此，现有设计方式通常通过减少滤波电容贴装数量，即降低电容的设置密度，来满足小间距的封装要求，如此一来，便会破坏BGA芯片的完整性。
实用新型内容
针对上述问题，有必要提供一种提高电容设置密度，保证电源完整性的焊盘。
另外，还有必要提供一种具有上述焊盘的封装芯片。
一种焊盘，用以贴装滤波电容，该焊盘为一四角处分别切割掉四个扇形区域的正方形区域。
优选地，该焊盘包括二组具有二相对设置的直线边缘及二组具有二相对设置的弧线边缘。
优选地，该直线边缘的长度为0.22mm。
优选地，该焊盘的高度为0.55mm。
一种封装芯片，该封装芯片的每个电源管脚通过一过孔与背面的滤波电容相连，该滤波电容的焊盘为一四角处分别切割掉四个扇形区域的正方形区域。
优选地，该焊盘包括二组具有二相对设置的直线边缘及二组具有二相对设置的弧线边缘。
优选地，每一该弧形边缘与相邻过孔的距离可确保贴装一滤波电容。
优选地，该直线边缘的长度为0.22mm。
优选地，该焊盘的高度为0.55mm。
优选地，每相邻的二焊盘的中心距离为1mm。
相较于现有技术，本实用新型的焊盘将会和周围过孔产生干涉的部分切除，使焊盘的边缘与周围过孔的距离可确保每个电源管脚放置滤波电容，从而提高滤波电容的设置密度，保证电源的完整性。
附图说明
图1为现有的封装芯片的正面示意图。
图2为现有的封装芯片的背面示意图。
图3为本实用新型较佳实施例的封装芯片的背面示意图。
图4为本实用新型较佳实施例的封装芯片的正面示意图。
主要元件符号说明
封装芯片            10、20
管脚                11、21
过孔                12、22
焊盘                13、23
正方形区域          231
扇形区域            232
直线边缘            233
弧线边缘            234
具体实施方式
请参阅图3及图4，本实用新型较佳实施例的焊盘23设置于封装芯片20的背面，以装贴滤波电容，装贴于该焊盘23的滤波电容通过过孔22与电源管脚21相连。该焊盘23将现有焊盘与周围过孔22产生干涉的部分切割掉，以确保其边缘与周围过孔22的距离可贴装滤波电容。
在本较佳实施例中，该焊盘23由一正方形区域231在四角处分别切割掉四个扇形区域232而形成。该焊盘23具有二组相对的直线边缘233及二组相对的弧线边缘234，该等直线边缘233与弧线边缘234间隔相连。其中，每一弧线边缘234朝向一相邻的过孔22，该弧线边缘234与该相邻过孔22的距离确保贴装滤波电容。该直线边缘233的长度为0.22mm，该焊盘23的高度为1mm。二相邻的焊盘23的中心距离为1mm。
可以理解，该焊盘23的尺寸大小不限于上述数值，可以根据制造工艺要求调整，只要其弧线边缘234与相邻的过孔22的距离可确保每个电源管脚21上都有足够空间连接至少一滤波电容即可。
本实用新型焊盘23将会与邻近过孔22产生干涉的部分切除，使焊盘23与周围过孔22的距离可确保每个电源管脚上都有足够空间连接至少一放置滤波电容，以提高滤波电容的设置密度，保证电源的完整性。
另外，本领域技术人员还可在本实用新型权利要求公开的范围和精神内做其它形式和细节上的各种修改、添加和替换。当然，这些依据本实用新型精神所做的各种修改、添加和替换等变化，都应包含在本实用新型所要求保护的范围之内。

Claims (10)

1.一种焊盘，用以贴装滤波电容，其特征在于：该焊盘为一四角处分别切割掉四个扇形区域的正方形区域。
2.如权利要求1所述的焊盘，其特征在于：该焊盘包括二组具有二相对设置的直线边缘及二组具有二相对设置的弧线边缘，该等直线边缘与弧线边缘间隔相连。
3.如权利要求2所述的焊盘，其特征在于：该直线边缘的长度为0.22mm。
4.如权利要求1所述的焊盘，其特征在于：该焊盘的高度为0.55mm。
5.一种封装芯片，该封装芯片的每个管脚通过一过孔与背面的滤波电容相连，其特征在于：该滤波电容的焊盘为一四角处分别切割掉四个扇形区域的正方形区域。
6.如权利要求5所述的封装芯片，其特征在于：该焊盘包括二组具有二相对设置的直线边缘及二组具有二相对设置的弧线边缘。
7.如权利要求6所述的封装芯片，其特征在于：每一该弧形边缘与相邻过孔的距离可确保贴装一滤波电容。
8.如权利要求6所述的封装芯片，其特征在于：该直线边缘的长度为0.22mm。
9.如权利要求6所述的封装芯片，其特征在于：该焊盘的高度为0.55mm。
10.如权利要求6所述的封装芯片，其特征在于：每相邻的二焊盘的中心距离为1mm。
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CN110402022A (zh) * 2019-06-27 2019-11-01 苏州浪潮智能科技有限公司 一种pcb板及终端

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US7081679B2 (en) * 2003-12-10 2006-07-25 Taiwan Semiconductor Manufacturing Co., Ltd. Structure and method for reinforcing a bond pad on a chip

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