JP7305044B2 - 電力回路装置 - Google Patents

電力回路装置 Download PDF

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Publication number
JP7305044B2
JP7305044B2 JP2022524408A JP2022524408A JP7305044B2 JP 7305044 B2 JP7305044 B2 JP 7305044B2 JP 2022524408 A JP2022524408 A JP 2022524408A JP 2022524408 A JP2022524408 A JP 2022524408A JP 7305044 B2 JP7305044 B2 JP 7305044B2
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JP
Japan
Prior art keywords
substrate
power circuit
circuit device
transformer
transformers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022524408A
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English (en)
Japanese (ja)
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JPWO2021235288A5 (https=
JPWO2021235288A1 (https=
Inventor
直樹 瀧川
隆 熊谷
健太 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2021235288A1 publication Critical patent/JPWO2021235288A1/ja
Publication of JPWO2021235288A5 publication Critical patent/JPWO2021235288A5/ja
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/08Cooling; Ventilating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F30/00Fixed transformers not covered by group H01F19/00
    • H01F30/06Fixed transformers not covered by group H01F19/00 characterised by the structure
    • H01F30/10Single-phase transformers
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00Conversion of DC power input into DC power output
    • H02M3/22Conversion of DC power input into DC power output with intermediate conversion into AC
    • H02M3/24Conversion of DC power input into DC power output with intermediate conversion into AC by static converters
    • H02M3/28Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Dc-Dc Converters (AREA)
  • Transformer Cooling (AREA)
JP2022524408A 2020-05-21 2021-05-12 電力回路装置 Active JP7305044B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020088546 2020-05-21
JP2020088546 2020-05-21
PCT/JP2021/018016 WO2021235288A1 (ja) 2020-05-21 2021-05-12 電力回路装置

Publications (3)

Publication Number Publication Date
JPWO2021235288A1 JPWO2021235288A1 (https=) 2021-11-25
JPWO2021235288A5 JPWO2021235288A5 (https=) 2022-08-10
JP7305044B2 true JP7305044B2 (ja) 2023-07-07

Family

ID=78707865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022524408A Active JP7305044B2 (ja) 2020-05-21 2021-05-12 電力回路装置

Country Status (2)

Country Link
JP (1) JP7305044B2 (https=)
WO (1) WO2021235288A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002049106A1 (fr) 2000-12-11 2002-06-20 Fujitsu Limited Module électronique
US20030183909A1 (en) 2002-03-27 2003-10-02 Chia-Pin Chiu Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device
JP2008125249A (ja) 2006-11-13 2008-05-29 Densei Lambda Kk 電源装置
JP2008187136A (ja) 2007-01-31 2008-08-14 Densei Lambda Kk 放熱構造
JP2013051258A (ja) 2011-08-30 2013-03-14 Shindengen Electric Mfg Co Ltd トランス装置
WO2018202439A1 (de) 2017-05-02 2018-11-08 Siemens Aktiengesellschaft Elektronische baugruppe mit einem zwischen zwei substraten eingebauten bauelement und verfahren zu dessen herstellung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07106732A (ja) * 1993-10-05 1995-04-21 Fujitsu Ltd コンデンサの実装構造
US8498124B1 (en) * 2009-12-10 2013-07-30 Universal Lighting Technologies, Inc. Magnetic circuit board stacking component
US8659895B1 (en) * 2011-05-13 2014-02-25 Google Inc. Air-cooled data center rows

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002049106A1 (fr) 2000-12-11 2002-06-20 Fujitsu Limited Module électronique
US20030183909A1 (en) 2002-03-27 2003-10-02 Chia-Pin Chiu Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device
JP2008125249A (ja) 2006-11-13 2008-05-29 Densei Lambda Kk 電源装置
JP2008187136A (ja) 2007-01-31 2008-08-14 Densei Lambda Kk 放熱構造
JP2013051258A (ja) 2011-08-30 2013-03-14 Shindengen Electric Mfg Co Ltd トランス装置
WO2018202439A1 (de) 2017-05-02 2018-11-08 Siemens Aktiengesellschaft Elektronische baugruppe mit einem zwischen zwei substraten eingebauten bauelement und verfahren zu dessen herstellung

Also Published As

Publication number Publication date
WO2021235288A1 (ja) 2021-11-25
JPWO2021235288A1 (https=) 2021-11-25

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