JP7305044B2 - 電力回路装置 - Google Patents
電力回路装置 Download PDFInfo
- Publication number
- JP7305044B2 JP7305044B2 JP2022524408A JP2022524408A JP7305044B2 JP 7305044 B2 JP7305044 B2 JP 7305044B2 JP 2022524408 A JP2022524408 A JP 2022524408A JP 2022524408 A JP2022524408 A JP 2022524408A JP 7305044 B2 JP7305044 B2 JP 7305044B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- power circuit
- circuit device
- transformer
- transformers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F30/00—Fixed transformers not covered by group H01F19/00
- H01F30/06—Fixed transformers not covered by group H01F19/00 characterised by the structure
- H01F30/10—Single-phase transformers
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of DC power input into DC power output
- H02M3/22—Conversion of DC power input into DC power output with intermediate conversion into AC
- H02M3/24—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters
- H02M3/28—Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Dc-Dc Converters (AREA)
- Transformer Cooling (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020088546 | 2020-05-21 | ||
| JP2020088546 | 2020-05-21 | ||
| PCT/JP2021/018016 WO2021235288A1 (ja) | 2020-05-21 | 2021-05-12 | 電力回路装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021235288A1 JPWO2021235288A1 (https=) | 2021-11-25 |
| JPWO2021235288A5 JPWO2021235288A5 (https=) | 2022-08-10 |
| JP7305044B2 true JP7305044B2 (ja) | 2023-07-07 |
Family
ID=78707865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022524408A Active JP7305044B2 (ja) | 2020-05-21 | 2021-05-12 | 電力回路装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7305044B2 (https=) |
| WO (1) | WO2021235288A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002049106A1 (fr) | 2000-12-11 | 2002-06-20 | Fujitsu Limited | Module électronique |
| US20030183909A1 (en) | 2002-03-27 | 2003-10-02 | Chia-Pin Chiu | Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device |
| JP2008125249A (ja) | 2006-11-13 | 2008-05-29 | Densei Lambda Kk | 電源装置 |
| JP2008187136A (ja) | 2007-01-31 | 2008-08-14 | Densei Lambda Kk | 放熱構造 |
| JP2013051258A (ja) | 2011-08-30 | 2013-03-14 | Shindengen Electric Mfg Co Ltd | トランス装置 |
| WO2018202439A1 (de) | 2017-05-02 | 2018-11-08 | Siemens Aktiengesellschaft | Elektronische baugruppe mit einem zwischen zwei substraten eingebauten bauelement und verfahren zu dessen herstellung |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07106732A (ja) * | 1993-10-05 | 1995-04-21 | Fujitsu Ltd | コンデンサの実装構造 |
| US8498124B1 (en) * | 2009-12-10 | 2013-07-30 | Universal Lighting Technologies, Inc. | Magnetic circuit board stacking component |
| US8659895B1 (en) * | 2011-05-13 | 2014-02-25 | Google Inc. | Air-cooled data center rows |
-
2021
- 2021-05-12 WO PCT/JP2021/018016 patent/WO2021235288A1/ja not_active Ceased
- 2021-05-12 JP JP2022524408A patent/JP7305044B2/ja active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002049106A1 (fr) | 2000-12-11 | 2002-06-20 | Fujitsu Limited | Module électronique |
| US20030183909A1 (en) | 2002-03-27 | 2003-10-02 | Chia-Pin Chiu | Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device |
| JP2008125249A (ja) | 2006-11-13 | 2008-05-29 | Densei Lambda Kk | 電源装置 |
| JP2008187136A (ja) | 2007-01-31 | 2008-08-14 | Densei Lambda Kk | 放熱構造 |
| JP2013051258A (ja) | 2011-08-30 | 2013-03-14 | Shindengen Electric Mfg Co Ltd | トランス装置 |
| WO2018202439A1 (de) | 2017-05-02 | 2018-11-08 | Siemens Aktiengesellschaft | Elektronische baugruppe mit einem zwischen zwei substraten eingebauten bauelement und verfahren zu dessen herstellung |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021235288A1 (ja) | 2021-11-25 |
| JPWO2021235288A1 (https=) | 2021-11-25 |
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