JPWO2021157720A1 - - Google Patents

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Publication number
JPWO2021157720A1
JPWO2021157720A1 JP2021576196A JP2021576196A JPWO2021157720A1 JP WO2021157720 A1 JPWO2021157720 A1 JP WO2021157720A1 JP 2021576196 A JP2021576196 A JP 2021576196A JP 2021576196 A JP2021576196 A JP 2021576196A JP WO2021157720 A1 JPWO2021157720 A1 JP WO2021157720A1
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JP
Japan
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JP2021576196A
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Japanese (ja)
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JP7807628B2 (ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/60—Schottky-barrier diodes 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/875—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being semiconductor metal oxide, e.g. InGaZnO
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/64—Electrodes comprising a Schottky barrier to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/65—Lateral DMOS [LDMOS] FETs
    • H10D30/657—Lateral DMOS [LDMOS] FETs having substrates comprising insulating layers, e.g. SOI-LDMOS transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/111—Field plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/871—Bond wires and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
JP2021576196A 2020-02-07 2021-02-05 半導体素子および半導体装置 Active JP7807628B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2020019326 2020-02-07
JP2020019326 2020-02-07
JP2020019328 2020-02-07
JP2020019329 2020-02-07
JP2020019328 2020-02-07
JP2020019329 2020-02-07
PCT/JP2021/004412 WO2021157720A1 (ja) 2020-02-07 2021-02-05 半導体素子および半導体装置

Publications (2)

Publication Number Publication Date
JPWO2021157720A1 true JPWO2021157720A1 (https=) 2021-08-12
JP7807628B2 JP7807628B2 (ja) 2026-01-28

Family

ID=77200307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021576196A Active JP7807628B2 (ja) 2020-02-07 2021-02-05 半導体素子および半導体装置

Country Status (6)

Country Link
US (1) US12453108B2 (https=)
JP (1) JP7807628B2 (https=)
KR (1) KR20220136416A (https=)
CN (1) CN115053354A (https=)
TW (1) TW202147529A (https=)
WO (1) WO2021157720A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116982153A (zh) * 2021-03-17 2023-10-31 三菱电机株式会社 半导体装置以及半导体装置的制造方法
CN118743031A (zh) * 2022-01-31 2024-10-01 株式会社Flosfia 层叠结构体、半导体元件和半导体装置
CN118613921A (zh) * 2022-01-31 2024-09-06 株式会社Flosfia 层叠结构体、半导体元件和半导体装置
US12469763B2 (en) * 2022-08-19 2025-11-11 Taiwan Semiconductor Manufacturing Co., Ltd. Package with improved heat dissipation efficiency and method for forming the same
DE102022004377A1 (de) * 2022-11-23 2024-05-23 Azur Space Solar Power Gmbh Diodenanordnung

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008300627A (ja) * 2007-05-31 2008-12-11 Denso Corp 半導体装置
JP2014183310A (ja) * 2013-03-18 2014-09-29 Suretech Technology Co Ltd ウェハー製造工程の切断方法
JP2016082232A (ja) * 2014-10-09 2016-05-16 株式会社Flosfia 導電性積層構造体および半導体装置ならびに剥離方法
JP2017118014A (ja) * 2015-12-25 2017-06-29 出光興産株式会社 積層体、半導体素子及び電気機器
WO2017111173A1 (ja) * 2015-12-25 2017-06-29 出光興産株式会社 積層体
WO2017111174A1 (ja) * 2015-12-25 2017-06-29 出光興産株式会社 積層体
JP2018060992A (ja) * 2015-12-18 2018-04-12 株式会社Flosfia 半導体装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4670034B2 (ja) 2004-03-12 2011-04-13 学校法人早稲田大学 電極を備えたＧａ２Ｏ３系半導体層
JP4631681B2 (ja) 2005-12-05 2011-02-16 日立電線株式会社 窒化物系半導体基板及び半導体装置
CN101978517A (zh) * 2008-03-19 2011-02-16 史泰克公司 金属芯热电冷却和动力产生装置
JP5078039B2 (ja) 2009-01-19 2012-11-21 学校法人早稲田大学 Ｇａ２Ｏ３系半導体素子及びＧａ２Ｏ３系半導体素子の製造方法
CN102473599B (zh) * 2010-05-18 2014-08-20 松下电器产业株式会社 半导体芯片及其制造方法
JP5799354B2 (ja) 2012-08-23 2015-10-21 学校法人早稲田大学 Ｇａ２Ｏ３系半導体素子
CN107068773B (zh) * 2015-12-18 2021-06-01 株式会社Flosfia 半导体装置
CN106997873A (zh) * 2016-10-27 2017-08-01 上海大学 一种封装结构及封装方法
JP7163631B2 (ja) * 2017-07-05 2022-11-01 三菱マテリアル株式会社 熱電変換モジュール、及び、熱電変換モジュールの製造方法
JP7315137B2 (ja) * 2018-12-26 2023-07-26 株式会社Flosfia 結晶性酸化物膜
JP7530615B2 (ja) * 2020-01-10 2024-08-08 株式会社Flosfia 結晶、半導体素子および半導体装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008300627A (ja) * 2007-05-31 2008-12-11 Denso Corp 半導体装置
JP2014183310A (ja) * 2013-03-18 2014-09-29 Suretech Technology Co Ltd ウェハー製造工程の切断方法
JP2016082232A (ja) * 2014-10-09 2016-05-16 株式会社Flosfia 導電性積層構造体および半導体装置ならびに剥離方法
JP2018060992A (ja) * 2015-12-18 2018-04-12 株式会社Flosfia 半導体装置
JP2017118014A (ja) * 2015-12-25 2017-06-29 出光興産株式会社 積層体、半導体素子及び電気機器
WO2017111173A1 (ja) * 2015-12-25 2017-06-29 出光興産株式会社 積層体
WO2017111174A1 (ja) * 2015-12-25 2017-06-29 出光興産株式会社 積層体

Also Published As

Publication number Publication date
TW202147529A (zh) 2021-12-16
US20220384663A1 (en) 2022-12-01
WO2021157720A1 (ja) 2021-08-12
US12453108B2 (en) 2025-10-21
JP7807628B2 (ja) 2026-01-28
CN115053354A (zh) 2022-09-13
KR20220136416A (ko) 2022-10-07

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