JPWO2021132389A5 - - Google Patents
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- Publication number
- JPWO2021132389A5 JPWO2021132389A5 JP2021567574A JP2021567574A JPWO2021132389A5 JP WO2021132389 A5 JPWO2021132389 A5 JP WO2021132389A5 JP 2021567574 A JP2021567574 A JP 2021567574A JP 2021567574 A JP2021567574 A JP 2021567574A JP WO2021132389 A5 JPWO2021132389 A5 JP WO2021132389A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- resin layer
- photosensitive resin
- conductive
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 20
- 239000011347 resin Substances 0.000 claims 16
- 229920005989 resin Polymers 0.000 claims 16
- 125000000217 alkyl group Chemical group 0.000 claims 11
- 125000003118 aryl group Chemical group 0.000 claims 10
- 238000004519 manufacturing process Methods 0.000 claims 8
- 239000000203 mixture Substances 0.000 claims 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 5
- 238000000034 method Methods 0.000 claims 5
- 239000002253 acid Substances 0.000 claims 4
- 125000006239 protecting group Chemical group 0.000 claims 4
- 150000004292 cyclic ethers Chemical class 0.000 claims 3
- 229920000642 polymer Polymers 0.000 claims 3
- 125000005647 linker group Chemical group 0.000 claims 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 2
- 239000002105 nanoparticle Substances 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 2
- 239000011342 resin composition Substances 0.000 claims 2
- 238000005245 sintering Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 claims 1
- 125000004036 acetal group Chemical group 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000004453 alkoxycarbonyl group Chemical group 0.000 claims 1
- 125000003710 aryl alkyl group Chemical group 0.000 claims 1
- 125000005129 aryl carbonyl group Chemical group 0.000 claims 1
- 125000005161 aryl oxy carbonyl group Chemical group 0.000 claims 1
- 229920001940 conductive polymer Polymers 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- 125000001424 substituent group Chemical group 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019235023 | 2019-12-25 | ||
| PCT/JP2020/048269 WO2021132389A1 (ja) | 2019-12-25 | 2020-12-23 | 導電性基板の製造方法、導電性基板、タッチセンサー、アンテナ、電磁波シールド材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021132389A1 JPWO2021132389A1 (https=) | 2021-07-01 |
| JPWO2021132389A5 true JPWO2021132389A5 (https=) | 2022-08-12 |
Family
ID=76574298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021567574A Pending JPWO2021132389A1 (https=) | 2019-12-25 | 2020-12-23 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20220342303A1 (https=) |
| JP (1) | JPWO2021132389A1 (https=) |
| KR (1) | KR20220107003A (https=) |
| CN (1) | CN114930990A (https=) |
| TW (1) | TWI881009B (https=) |
| WO (1) | WO2021132389A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114038984B (zh) * | 2021-12-02 | 2023-03-31 | 业成科技（成都）有限公司 | 微发光二极体显示器和其形成方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05273408A (ja) * | 1992-03-30 | 1993-10-22 | Toray Ind Inc | 液晶表示素子用カラ−フィルタの遮光層の作製法 |
| JPH0794848A (ja) | 1993-09-27 | 1995-04-07 | Sumitomo Kinzoku Ceramics:Kk | 導体層パターンの形成方法 |
| JP4409319B2 (ja) * | 2003-09-19 | 2010-02-03 | Ｊｓｒ株式会社 | 造形物の製造方法 |
| JP5062533B2 (ja) * | 2008-08-01 | 2012-10-31 | 新光電気工業株式会社 | 配線基板の製造方法 |
| JP2011114286A (ja) * | 2009-11-30 | 2011-06-09 | Asahi Glass Co Ltd | 導電性パターン付き基板の製造方法 |
| JP5971642B2 (ja) * | 2011-11-28 | 2016-08-17 | 学校法人日本大学 | 微細金属構造体の製造方法 |
| JP6284849B2 (ja) * | 2013-08-23 | 2018-02-28 | 富士フイルム株式会社 | 積層体 |
| JP6821046B2 (ja) * | 2017-09-29 | 2021-01-27 | 富士フイルム株式会社 | 回路配線の製造方法及びタッチパネルの製造方法 |
| JP6995873B2 (ja) * | 2017-10-19 | 2022-01-17 | 富士フイルム株式会社 | 回路基板の製造方法及びタッチパネルの製造方法 |
| CN111684359A (zh) * | 2018-02-05 | 2020-09-18 | 富士胶片株式会社 | 感光性转印材料、电路布线的制造方法及触摸面板的制造方法 |
| JP6985974B2 (ja) * | 2018-04-27 | 2021-12-22 | 富士フイルム株式会社 | 感光性転写材料、レジストパターンの製造方法、回路配線の製造方法 |
| JPWO2019225363A1 (ja) * | 2018-05-22 | 2021-04-22 | 富士フイルム株式会社 | 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、及び、タッチパネルの製造方法 |
-
2020
- 2020-12-23 WO PCT/JP2020/048269 patent/WO2021132389A1/ja not_active Ceased
- 2020-12-23 KR KR1020227021231A patent/KR20220107003A/ko not_active Ceased
- 2020-12-23 JP JP2021567574A patent/JPWO2021132389A1/ja active Pending
- 2020-12-23 CN CN202080090308.3A patent/CN114930990A/zh active Pending
- 2020-12-24 TW TW109146047A patent/TWI881009B/zh active
-
2022
- 2022-06-24 US US17/849,124 patent/US20220342303A1/en active Pending
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