JPWO2021106460A5 - - Google Patents

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Publication number
JPWO2021106460A5
JPWO2021106460A5 JP2021561230A JP2021561230A JPWO2021106460A5 JP WO2021106460 A5 JPWO2021106460 A5 JP WO2021106460A5 JP 2021561230 A JP2021561230 A JP 2021561230A JP 2021561230 A JP2021561230 A JP 2021561230A JP WO2021106460 A5 JPWO2021106460 A5 JP WO2021106460A5
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JP
Japan
Prior art keywords
mass
alkylammonium fluoride
content
quaternary alkylammonium
cleaning composition
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JP2021561230A
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English (en)
Japanese (ja)
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JP7619277B2 (ja
JPWO2021106460A1 (https=
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Priority claimed from PCT/JP2020/039997 external-priority patent/WO2021106460A1/ja
Publication of JPWO2021106460A1 publication Critical patent/JPWO2021106460A1/ja
Publication of JPWO2021106460A5 publication Critical patent/JPWO2021106460A5/ja
Application granted granted Critical
Publication of JP7619277B2 publication Critical patent/JP7619277B2/ja
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JP2021561230A 2019-11-25 2020-10-23 分解洗浄組成物の製造方法 Active JP7619277B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019212251 2019-11-25
JP2019212251 2019-11-25
PCT/JP2020/039997 WO2021106460A1 (ja) 2019-11-25 2020-10-23 分解洗浄組成物の製造方法

Publications (3)

Publication Number Publication Date
JPWO2021106460A1 JPWO2021106460A1 (https=) 2021-06-03
JPWO2021106460A5 true JPWO2021106460A5 (https=) 2022-07-21
JP7619277B2 JP7619277B2 (ja) 2025-01-22

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ID=76129504

Family Applications (1)

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JP2021561230A Active JP7619277B2 (ja) 2019-11-25 2020-10-23 分解洗浄組成物の製造方法

Country Status (6)

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US (1) US12545862B2 (https=)
JP (1) JP7619277B2 (https=)
KR (1) KR102772597B1 (https=)
CN (1) CN114746536B (https=)
TW (1) TWI776264B (https=)
WO (1) WO2021106460A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102804998B1 (ko) * 2020-03-23 2025-05-09 닛산 가가쿠 가부시키가이샤 반도체 기판의 세정 방법, 가공된 반도체 기판의 제조 방법 및 박리용 조성물
TW202504983A (zh) * 2021-09-16 2025-02-01 日商日產化學股份有限公司 半導體基板之洗淨方法、加工後之半導體基板之製造方法、以及剝離及溶解用組成物
JPWO2023120322A1 (https=) * 2021-12-24 2023-06-29
US20260022313A1 (en) * 2022-09-13 2026-01-22 Nissan Chemical Corporation Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and releasing and dissolving composition
JPWO2024058025A1 (https=) * 2022-09-13 2024-03-21
TW202500734A (zh) * 2023-02-20 2025-01-01 日商日產化學股份有限公司 半導體基板之製造方法、及加工後之半導體基板之製造方法、以及剝離及溶解用組成物

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Publication number Priority date Publication date Assignee Title
NL95122C (https=) * 1954-11-22
US3673099A (en) 1970-10-19 1972-06-27 Bell Telephone Labor Inc Process and composition for stripping cured resins from substrates
US4428871A (en) 1981-09-23 1984-01-31 J. T. Baker Chemical Company Stripping compositions and methods of stripping resists
US4744834A (en) 1986-04-30 1988-05-17 Noor Haq Photoresist stripper comprising a pyrrolidinone, a diethylene glycol ether, a polyglycol and a quaternary ammonium hydroxide
US20040084060A1 (en) * 1999-05-28 2004-05-06 Peter Zhu Method and kit for removing aldehyde-based stains
US6576734B1 (en) * 1999-12-16 2003-06-10 Chisso Corporation Modified polyorganosiloxane and method for producing it
US6475292B1 (en) * 2000-07-31 2002-11-05 Shipley Company, L.L.C. Photoresist stripping method
WO2004094581A1 (en) 2003-04-18 2004-11-04 Ekc Technology, Inc. Aqueous fluoride compositions for cleaning semiconductor devices
US8030263B2 (en) * 2004-07-01 2011-10-04 Air Products And Chemicals, Inc. Composition for stripping and cleaning and use thereof
US7632796B2 (en) * 2005-10-28 2009-12-15 Dynaloy, Llc Dynamic multi-purpose composition for the removal of photoresists and method for its use
JP5513994B2 (ja) * 2010-06-01 2014-06-04 出光興産株式会社 洗浄剤組成物及びそれを用いたエアゾール組成物
EP2497844A1 (en) * 2011-03-10 2012-09-12 Kao Corporation, S.A. Quaternary ammonium esters (Esterquats) containing composition for inhibiting corrosion of metal surface
JP6165665B2 (ja) 2013-05-30 2017-07-19 信越化学工業株式会社 基板の洗浄方法
CN107034028B (zh) * 2015-12-04 2021-05-25 三星电子株式会社 用于除去有机硅树脂的组合物、使用其薄化基材和制造半导体封装体的方法及使用其的系统
KR102067444B1 (ko) * 2015-12-11 2020-01-17 후지필름 가부시키가이샤 반도체 디바이스용 처리액의 보관 방법, 처리액 수용체
CN111033697B (zh) 2017-08-31 2023-10-10 富士胶片株式会社 处理液、试剂盒、基板的清洗方法
KR102861859B1 (ko) * 2018-12-21 2025-09-22 다우 실리콘즈 코포레이션 다작용성 유기실록산의 제조 방법 및 이를 함유하는 조성물
US11866676B2 (en) * 2019-02-15 2024-01-09 Nissan Chemical Corporation Cleaning agent composition and cleaning method
WO2020179819A1 (ja) * 2019-03-05 2020-09-10 日産化学株式会社 洗浄剤組成物及び洗浄方法
WO2021100651A1 (ja) * 2019-11-20 2021-05-27 日産化学株式会社 洗浄剤組成物及び洗浄方法

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