CN114746536B - 分解清洗组合物的制造方法 - Google Patents

分解清洗组合物的制造方法 Download PDF

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Publication number
CN114746536B
CN114746536B CN202080081816.5A CN202080081816A CN114746536B CN 114746536 B CN114746536 B CN 114746536B CN 202080081816 A CN202080081816 A CN 202080081816A CN 114746536 B CN114746536 B CN 114746536B
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Prior art keywords
cleaning composition
producing
composition according
decomposition cleaning
ether
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CN202080081816.5A
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Chinese (zh)
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CN114746536A (zh
Inventor
中崎晋
宫原邦明
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Resonac Holdings Corp
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Resonac Corp
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    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/32—Amides; Substituted amides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3263—Amides or imides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66—Non-ionic compounds
    • C11D1/72—Ethers of polyoxyalkylene glycols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/30—Amines; Substituted amines ; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/28—Organic compounds containing halogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/18—Glass; Plastics
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Detergent Compositions (AREA)
CN202080081816.5A 2019-11-25 2020-10-23 分解清洗组合物的制造方法 Active CN114746536B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019212251 2019-11-25
JP2019-212251 2019-11-25
PCT/JP2020/039997 WO2021106460A1 (ja) 2019-11-25 2020-10-23 分解洗浄組成物の製造方法

Publications (2)

Publication Number Publication Date
CN114746536A CN114746536A (zh) 2022-07-12
CN114746536B true CN114746536B (zh) 2024-01-09

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CN202080081816.5A Active CN114746536B (zh) 2019-11-25 2020-10-23 分解清洗组合物的制造方法

Country Status (6)

Country Link
US (1) US12545862B2 (https=)
JP (1) JP7619277B2 (https=)
KR (1) KR102772597B1 (https=)
CN (1) CN114746536B (https=)
TW (1) TWI776264B (https=)
WO (1) WO2021106460A1 (https=)

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KR102804998B1 (ko) * 2020-03-23 2025-05-09 닛산 가가쿠 가부시키가이샤 반도체 기판의 세정 방법, 가공된 반도체 기판의 제조 방법 및 박리용 조성물
TW202504983A (zh) * 2021-09-16 2025-02-01 日商日產化學股份有限公司 半導體基板之洗淨方法、加工後之半導體基板之製造方法、以及剝離及溶解用組成物
JPWO2023120322A1 (https=) * 2021-12-24 2023-06-29
US20260022313A1 (en) * 2022-09-13 2026-01-22 Nissan Chemical Corporation Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and releasing and dissolving composition
JPWO2024058025A1 (https=) * 2022-09-13 2024-03-21
TW202500734A (zh) * 2023-02-20 2025-01-01 日商日產化學股份有限公司 半導體基板之製造方法、及加工後之半導體基板之製造方法、以及剝離及溶解用組成物

Citations (4)

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CN101857825A (zh) * 2004-07-01 2010-10-13 气体产品与化学公司 用于清除和清洗的组合物及其用途
JP2011252071A (ja) * 2010-06-01 2011-12-15 Idemitsu Kosan Co Ltd 洗浄剤組成物及びそれを用いたエアゾール組成物
EP2497844A1 (en) * 2011-03-10 2012-09-12 Kao Corporation, S.A. Quaternary ammonium esters (Esterquats) containing composition for inhibiting corrosion of metal surface
WO2017099121A1 (ja) * 2015-12-11 2017-06-15 富士フイルム株式会社 半導体デバイス用処理液の保管方法、処理液収容体

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US3673099A (en) 1970-10-19 1972-06-27 Bell Telephone Labor Inc Process and composition for stripping cured resins from substrates
US4428871A (en) 1981-09-23 1984-01-31 J. T. Baker Chemical Company Stripping compositions and methods of stripping resists
US4744834A (en) 1986-04-30 1988-05-17 Noor Haq Photoresist stripper comprising a pyrrolidinone, a diethylene glycol ether, a polyglycol and a quaternary ammonium hydroxide
US20040084060A1 (en) * 1999-05-28 2004-05-06 Peter Zhu Method and kit for removing aldehyde-based stains
US6576734B1 (en) * 1999-12-16 2003-06-10 Chisso Corporation Modified polyorganosiloxane and method for producing it
US6475292B1 (en) * 2000-07-31 2002-11-05 Shipley Company, L.L.C. Photoresist stripping method
WO2004094581A1 (en) 2003-04-18 2004-11-04 Ekc Technology, Inc. Aqueous fluoride compositions for cleaning semiconductor devices
US7632796B2 (en) * 2005-10-28 2009-12-15 Dynaloy, Llc Dynamic multi-purpose composition for the removal of photoresists and method for its use
JP6165665B2 (ja) 2013-05-30 2017-07-19 信越化学工業株式会社 基板の洗浄方法
CN107034028B (zh) * 2015-12-04 2021-05-25 三星电子株式会社 用于除去有机硅树脂的组合物、使用其薄化基材和制造半导体封装体的方法及使用其的系统
CN111033697B (zh) 2017-08-31 2023-10-10 富士胶片株式会社 处理液、试剂盒、基板的清洗方法
KR102861859B1 (ko) * 2018-12-21 2025-09-22 다우 실리콘즈 코포레이션 다작용성 유기실록산의 제조 방법 및 이를 함유하는 조성물
US11866676B2 (en) * 2019-02-15 2024-01-09 Nissan Chemical Corporation Cleaning agent composition and cleaning method
WO2020179819A1 (ja) * 2019-03-05 2020-09-10 日産化学株式会社 洗浄剤組成物及び洗浄方法
WO2021100651A1 (ja) * 2019-11-20 2021-05-27 日産化学株式会社 洗浄剤組成物及び洗浄方法

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Publication number Priority date Publication date Assignee Title
CN101857825A (zh) * 2004-07-01 2010-10-13 气体产品与化学公司 用于清除和清洗的组合物及其用途
JP2011252071A (ja) * 2010-06-01 2011-12-15 Idemitsu Kosan Co Ltd 洗浄剤組成物及びそれを用いたエアゾール組成物
EP2497844A1 (en) * 2011-03-10 2012-09-12 Kao Corporation, S.A. Quaternary ammonium esters (Esterquats) containing composition for inhibiting corrosion of metal surface
WO2017099121A1 (ja) * 2015-12-11 2017-06-15 富士フイルム株式会社 半導体デバイス用処理液の保管方法、処理液収容体

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Determination of Factors Infl uencing the Wet Etching of Polydimethylsiloxane Using Tetra- n -butylammonium Fluoride;Dr. M. Kleiman, K. A. Ryu, Prof. A. P. Esser-Kahn;Macromolecular Chemistry and Physics;第217卷;284-291 *
Making Honeycomb Microcomposites by Soft Lithography;Prof. G. M. Whitesides, Dr. B. Xu, Dr. F. Arias;<Adanced Materials>;第11卷(第6期);492-495 *
Topographical Micropatterning of Poly(dimethylsiloxane) Using Laminar Flows of Liquids in Capillaries;Prof. G. M. Whitesides, Dr. S. Takayama, E. Ostuni, Dr. X. Qian, J. C. McDonald, X. Jiang, M.-H. Wu;Advanced Matetials;第13卷(第8期);570-574 *

Also Published As

Publication number Publication date
JP7619277B2 (ja) 2025-01-22
TW202124698A (zh) 2021-07-01
KR20220047592A (ko) 2022-04-18
TWI776264B (zh) 2022-09-01
JPWO2021106460A1 (https=) 2021-06-03
CN114746536A (zh) 2022-07-12
WO2021106460A1 (ja) 2021-06-03
US20220380704A1 (en) 2022-12-01
KR102772597B1 (ko) 2025-02-26
US12545862B2 (en) 2026-02-10

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