TWI776264B - 分解洗淨組成物之製造方法 - Google Patents

分解洗淨組成物之製造方法 Download PDF

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Publication number
TWI776264B
TWI776264B TW109138151A TW109138151A TWI776264B TW I776264 B TWI776264 B TW I776264B TW 109138151 A TW109138151 A TW 109138151A TW 109138151 A TW109138151 A TW 109138151A TW I776264 B TWI776264 B TW I776264B
Authority
TW
Taiwan
Prior art keywords
cleaning composition
decomposing
producing
mass
ether
Prior art date
Application number
TW109138151A
Other languages
English (en)
Chinese (zh)
Other versions
TW202124698A (zh
Inventor
中崎晋
宮原邦明
Original Assignee
日商昭和電工股份有限公司
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Publication date
Application filed by 日商昭和電工股份有限公司 filed Critical 日商昭和電工股份有限公司
Publication of TW202124698A publication Critical patent/TW202124698A/zh
Application granted granted Critical
Publication of TWI776264B publication Critical patent/TWI776264B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/32—Amides; Substituted amides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3263—Amides or imides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66—Non-ionic compounds
    • C11D1/72—Ethers of polyoxyalkylene glycols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/30—Amines; Substituted amines ; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/28—Organic compounds containing halogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/18—Glass; Plastics
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Detergent Compositions (AREA)
TW109138151A 2019-11-25 2020-11-03 分解洗淨組成物之製造方法 TWI776264B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019212251 2019-11-25
JP2019-212251 2019-11-25

Publications (2)

Publication Number Publication Date
TW202124698A TW202124698A (zh) 2021-07-01
TWI776264B true TWI776264B (zh) 2022-09-01

Family

ID=76129504

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109138151A TWI776264B (zh) 2019-11-25 2020-11-03 分解洗淨組成物之製造方法

Country Status (6)

Country Link
US (1) US12545862B2 (https=)
JP (1) JP7619277B2 (https=)
KR (1) KR102772597B1 (https=)
CN (1) CN114746536B (https=)
TW (1) TWI776264B (https=)
WO (1) WO2021106460A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102804998B1 (ko) * 2020-03-23 2025-05-09 닛산 가가쿠 가부시키가이샤 반도체 기판의 세정 방법, 가공된 반도체 기판의 제조 방법 및 박리용 조성물
TW202504983A (zh) * 2021-09-16 2025-02-01 日商日產化學股份有限公司 半導體基板之洗淨方法、加工後之半導體基板之製造方法、以及剝離及溶解用組成物
JPWO2023120322A1 (https=) * 2021-12-24 2023-06-29
US20260022313A1 (en) * 2022-09-13 2026-01-22 Nissan Chemical Corporation Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and releasing and dissolving composition
JPWO2024058025A1 (https=) * 2022-09-13 2024-03-21
TW202500734A (zh) * 2023-02-20 2025-01-01 日商日產化學股份有限公司 半導體基板之製造方法、及加工後之半導體基板之製造方法、以及剝離及溶解用組成物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201912776A (zh) * 2017-08-31 2019-04-01 日商富士軟片股份有限公司 處理液、套組及基板的洗淨方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL95122C (https=) * 1954-11-22
US3673099A (en) 1970-10-19 1972-06-27 Bell Telephone Labor Inc Process and composition for stripping cured resins from substrates
US4428871A (en) 1981-09-23 1984-01-31 J. T. Baker Chemical Company Stripping compositions and methods of stripping resists
US4744834A (en) 1986-04-30 1988-05-17 Noor Haq Photoresist stripper comprising a pyrrolidinone, a diethylene glycol ether, a polyglycol and a quaternary ammonium hydroxide
US20040084060A1 (en) * 1999-05-28 2004-05-06 Peter Zhu Method and kit for removing aldehyde-based stains
US6576734B1 (en) * 1999-12-16 2003-06-10 Chisso Corporation Modified polyorganosiloxane and method for producing it
US6475292B1 (en) * 2000-07-31 2002-11-05 Shipley Company, L.L.C. Photoresist stripping method
WO2004094581A1 (en) 2003-04-18 2004-11-04 Ekc Technology, Inc. Aqueous fluoride compositions for cleaning semiconductor devices
US8030263B2 (en) * 2004-07-01 2011-10-04 Air Products And Chemicals, Inc. Composition for stripping and cleaning and use thereof
US7632796B2 (en) * 2005-10-28 2009-12-15 Dynaloy, Llc Dynamic multi-purpose composition for the removal of photoresists and method for its use
JP5513994B2 (ja) * 2010-06-01 2014-06-04 出光興産株式会社 洗浄剤組成物及びそれを用いたエアゾール組成物
EP2497844A1 (en) * 2011-03-10 2012-09-12 Kao Corporation, S.A. Quaternary ammonium esters (Esterquats) containing composition for inhibiting corrosion of metal surface
JP6165665B2 (ja) 2013-05-30 2017-07-19 信越化学工業株式会社 基板の洗浄方法
CN107034028B (zh) * 2015-12-04 2021-05-25 三星电子株式会社 用于除去有机硅树脂的组合物、使用其薄化基材和制造半导体封装体的方法及使用其的系统
KR102067444B1 (ko) * 2015-12-11 2020-01-17 후지필름 가부시키가이샤 반도체 디바이스용 처리액의 보관 방법, 처리액 수용체
KR102861859B1 (ko) * 2018-12-21 2025-09-22 다우 실리콘즈 코포레이션 다작용성 유기실록산의 제조 방법 및 이를 함유하는 조성물
US11866676B2 (en) * 2019-02-15 2024-01-09 Nissan Chemical Corporation Cleaning agent composition and cleaning method
WO2020179819A1 (ja) * 2019-03-05 2020-09-10 日産化学株式会社 洗浄剤組成物及び洗浄方法
WO2021100651A1 (ja) * 2019-11-20 2021-05-27 日産化学株式会社 洗浄剤組成物及び洗浄方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201912776A (zh) * 2017-08-31 2019-04-01 日商富士軟片股份有限公司 處理液、套組及基板的洗淨方法

Also Published As

Publication number Publication date
CN114746536B (zh) 2024-01-09
JP7619277B2 (ja) 2025-01-22
TW202124698A (zh) 2021-07-01
KR20220047592A (ko) 2022-04-18
JPWO2021106460A1 (https=) 2021-06-03
CN114746536A (zh) 2022-07-12
WO2021106460A1 (ja) 2021-06-03
US20220380704A1 (en) 2022-12-01
KR102772597B1 (ko) 2025-02-26
US12545862B2 (en) 2026-02-10

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