JP7619277B2 - 分解洗浄組成物の製造方法 - Google Patents
分解洗浄組成物の製造方法 Download PDFInfo
- Publication number
- JP7619277B2 JP7619277B2 JP2021561230A JP2021561230A JP7619277B2 JP 7619277 B2 JP7619277 B2 JP 7619277B2 JP 2021561230 A JP2021561230 A JP 2021561230A JP 2021561230 A JP2021561230 A JP 2021561230A JP 7619277 B2 JP7619277 B2 JP 7619277B2
- Authority
- JP
- Japan
- Prior art keywords
- cleaning composition
- decomposition
- producing
- group
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/32—Amides; Substituted amides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/28—Organic compounds containing halogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3263—Amides or imides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/20—Cleaning during device manufacture
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/18—Glass; Plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019212251 | 2019-11-25 | ||
| JP2019212251 | 2019-11-25 | ||
| PCT/JP2020/039997 WO2021106460A1 (ja) | 2019-11-25 | 2020-10-23 | 分解洗浄組成物の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021106460A1 JPWO2021106460A1 (https=) | 2021-06-03 |
| JPWO2021106460A5 JPWO2021106460A5 (https=) | 2022-07-21 |
| JP7619277B2 true JP7619277B2 (ja) | 2025-01-22 |
Family
ID=76129504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021561230A Active JP7619277B2 (ja) | 2019-11-25 | 2020-10-23 | 分解洗浄組成物の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12545862B2 (https=) |
| JP (1) | JP7619277B2 (https=) |
| KR (1) | KR102772597B1 (https=) |
| CN (1) | CN114746536B (https=) |
| TW (1) | TWI776264B (https=) |
| WO (1) | WO2021106460A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115315788B (zh) * | 2020-03-23 | 2026-03-20 | 日产化学株式会社 | 半导体基板的清洗方法、经加工的半导体基板的制造方法以及剥离用组合物 |
| CN116507683B (zh) * | 2021-09-16 | 2025-03-28 | 日产化学株式会社 | 半导体基板的清洗方法、经加工的半导体基板的制造方法以及剥离和溶解用组合物 |
| KR20240036038A (ko) * | 2021-12-24 | 2024-03-19 | 가부시끼가이샤 레조낙 | 분해 세정 조성물 및 그 제조 방법 |
| JPWO2024058018A1 (https=) * | 2022-09-13 | 2024-03-21 | ||
| EP4571819A4 (en) * | 2022-09-13 | 2025-12-31 | Nissan Chemical Corp | METHOD FOR CLEANING A SEMICONDUCTIVE SUBSTRATE, METHOD FOR PRODUCING A TREATMENTED SEMICONDUCTIVE SUBSTRATE, AND PEEL AND DISSOLUTION COMPOSITION |
| JPWO2024176810A1 (https=) * | 2023-02-20 | 2024-08-29 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170158888A1 (en) | 2015-12-04 | 2017-06-08 | Dongwoo Fine-Chem Co., Ltd. | Composition for removing silicone resins and method of thinning substrate by using the same |
| WO2017099121A1 (ja) | 2015-12-11 | 2017-06-15 | 富士フイルム株式会社 | 半導体デバイス用処理液の保管方法、処理液収容体 |
| WO2020166702A1 (ja) | 2019-02-15 | 2020-08-20 | 日産化学株式会社 | 洗浄剤組成物及び洗浄方法 |
| WO2021100651A1 (ja) | 2019-11-20 | 2021-05-27 | 日産化学株式会社 | 洗浄剤組成物及び洗浄方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL95122C (https=) * | 1954-11-22 | |||
| US3673099A (en) | 1970-10-19 | 1972-06-27 | Bell Telephone Labor Inc | Process and composition for stripping cured resins from substrates |
| US4428871A (en) | 1981-09-23 | 1984-01-31 | J. T. Baker Chemical Company | Stripping compositions and methods of stripping resists |
| US4744834A (en) | 1986-04-30 | 1988-05-17 | Noor Haq | Photoresist stripper comprising a pyrrolidinone, a diethylene glycol ether, a polyglycol and a quaternary ammonium hydroxide |
| US20040084060A1 (en) * | 1999-05-28 | 2004-05-06 | Peter Zhu | Method and kit for removing aldehyde-based stains |
| US6576734B1 (en) * | 1999-12-16 | 2003-06-10 | Chisso Corporation | Modified polyorganosiloxane and method for producing it |
| US6475292B1 (en) * | 2000-07-31 | 2002-11-05 | Shipley Company, L.L.C. | Photoresist stripping method |
| WO2004094581A1 (en) | 2003-04-18 | 2004-11-04 | Ekc Technology, Inc. | Aqueous fluoride compositions for cleaning semiconductor devices |
| US8030263B2 (en) * | 2004-07-01 | 2011-10-04 | Air Products And Chemicals, Inc. | Composition for stripping and cleaning and use thereof |
| US7632796B2 (en) * | 2005-10-28 | 2009-12-15 | Dynaloy, Llc | Dynamic multi-purpose composition for the removal of photoresists and method for its use |
| JP5513994B2 (ja) * | 2010-06-01 | 2014-06-04 | 出光興産株式会社 | 洗浄剤組成物及びそれを用いたエアゾール組成物 |
| EP2497844A1 (en) * | 2011-03-10 | 2012-09-12 | Kao Corporation, S.A. | Quaternary ammonium esters (Esterquats) containing composition for inhibiting corrosion of metal surface |
| JP6165665B2 (ja) | 2013-05-30 | 2017-07-19 | 信越化学工業株式会社 | 基板の洗浄方法 |
| KR102295991B1 (ko) | 2017-08-31 | 2021-09-01 | 후지필름 가부시키가이샤 | 처리액, 키트, 기판의 세정 방법 |
| US11787908B2 (en) * | 2018-12-21 | 2023-10-17 | Dow Silicones Corporation | Methods for making polyfunctional organosiloxanes and compositions containing same |
| WO2020179819A1 (ja) * | 2019-03-05 | 2020-09-10 | 日産化学株式会社 | 洗浄剤組成物及び洗浄方法 |
-
2020
- 2020-10-23 KR KR1020227007935A patent/KR102772597B1/ko active Active
- 2020-10-23 CN CN202080081816.5A patent/CN114746536B/zh active Active
- 2020-10-23 WO PCT/JP2020/039997 patent/WO2021106460A1/ja not_active Ceased
- 2020-10-23 JP JP2021561230A patent/JP7619277B2/ja active Active
- 2020-10-23 US US17/774,025 patent/US12545862B2/en active Active
- 2020-11-03 TW TW109138151A patent/TWI776264B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170158888A1 (en) | 2015-12-04 | 2017-06-08 | Dongwoo Fine-Chem Co., Ltd. | Composition for removing silicone resins and method of thinning substrate by using the same |
| WO2017099121A1 (ja) | 2015-12-11 | 2017-06-15 | 富士フイルム株式会社 | 半導体デバイス用処理液の保管方法、処理液収容体 |
| WO2020166702A1 (ja) | 2019-02-15 | 2020-08-20 | 日産化学株式会社 | 洗浄剤組成物及び洗浄方法 |
| WO2021100651A1 (ja) | 2019-11-20 | 2021-05-27 | 日産化学株式会社 | 洗浄剤組成物及び洗浄方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20220380704A1 (en) | 2022-12-01 |
| TWI776264B (zh) | 2022-09-01 |
| KR102772597B1 (ko) | 2025-02-26 |
| WO2021106460A1 (ja) | 2021-06-03 |
| US12545862B2 (en) | 2026-02-10 |
| JPWO2021106460A1 (https=) | 2021-06-03 |
| CN114746536A (zh) | 2022-07-12 |
| CN114746536B (zh) | 2024-01-09 |
| KR20220047592A (ko) | 2022-04-18 |
| TW202124698A (zh) | 2021-07-01 |
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