JPWO2021065072A1 - - Google Patents
Info
- Publication number
- JPWO2021065072A1 JPWO2021065072A1 JP2021551130A JP2021551130A JPWO2021065072A1 JP WO2021065072 A1 JPWO2021065072 A1 JP WO2021065072A1 JP 2021551130 A JP2021551130 A JP 2021551130A JP 2021551130 A JP2021551130 A JP 2021551130A JP WO2021065072 A1 JPWO2021065072 A1 JP WO2021065072A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Plasma & Fusion (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019183566 | 2019-10-04 | ||
PCT/JP2020/020329 WO2021065072A1 (fr) | 2019-10-04 | 2020-05-22 | Feuille adhésive |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021065072A1 true JPWO2021065072A1 (fr) | 2021-04-08 |
Family
ID=75337973
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021551130A Pending JPWO2021065072A1 (fr) | 2019-10-04 | 2020-05-22 | |
JP2021551132A Pending JPWO2021065074A1 (fr) | 2019-10-04 | 2020-05-22 | |
JP2021551129A Pending JPWO2021065071A1 (fr) | 2019-10-04 | 2020-05-22 | |
JP2021551131A Pending JPWO2021065073A1 (fr) | 2019-10-04 | 2020-05-22 | |
JP2021551128A Pending JPWO2021065070A1 (fr) | 2019-10-04 | 2020-05-22 |
Family Applications After (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021551132A Pending JPWO2021065074A1 (fr) | 2019-10-04 | 2020-05-22 | |
JP2021551129A Pending JPWO2021065071A1 (fr) | 2019-10-04 | 2020-05-22 | |
JP2021551131A Pending JPWO2021065073A1 (fr) | 2019-10-04 | 2020-05-22 | |
JP2021551128A Pending JPWO2021065070A1 (fr) | 2019-10-04 | 2020-05-22 |
Country Status (5)
Country | Link |
---|---|
JP (5) | JPWO2021065072A1 (fr) |
KR (3) | KR20220080093A (fr) |
CN (3) | CN114514295B (fr) |
TW (3) | TW202116947A (fr) |
WO (5) | WO2021065072A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023047592A1 (fr) * | 2021-09-27 | 2023-03-30 | 株式会社レゾナック | Procédé de fabrication de dispositif à semi-conducteur |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3723278B2 (ja) * | 1996-05-21 | 2005-12-07 | 日東電工株式会社 | レジスト除去用接着シ―ト類とレジスト除去方法 |
JP2006152072A (ja) * | 2004-11-26 | 2006-06-15 | Teijin Chem Ltd | 半導体製造用帯電防止性フィルムおよびその製造方法 |
JP2009064975A (ja) * | 2007-09-06 | 2009-03-26 | Nitto Denko Corp | ダイシング用粘着シート及びダイシング方法 |
JP5069662B2 (ja) * | 2007-11-12 | 2012-11-07 | リンテック株式会社 | 粘着シート |
WO2010058646A1 (fr) | 2008-11-21 | 2010-05-27 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Boîtier de semi-conducteur et son procédé de fabrication |
JP2010229342A (ja) * | 2009-03-27 | 2010-10-14 | Lintec Corp | 光学用粘着剤、光学用粘着シート及び粘着剤付き光学部材 |
WO2012124389A1 (fr) * | 2011-03-17 | 2012-09-20 | リンテック株式会社 | Agent adhésif durcissable par rayonnement d'énergie et feuille adhésive |
JP2014043548A (ja) * | 2012-07-31 | 2014-03-13 | Nitto Denko Corp | 粘着剤組成物、粘着剤層、粘着シート及び光学フィルム |
JP6207192B2 (ja) * | 2013-03-25 | 2017-10-04 | リンテック株式会社 | 半導体加工用粘着シート |
JP6377322B2 (ja) * | 2013-05-30 | 2018-08-22 | 住友化学株式会社 | 光学フィルム積層体及びそれを用いた複合偏光板 |
SG11201600047XA (en) * | 2013-07-05 | 2016-02-26 | Lintec Corp | Dicing sheet |
DE112015001075T5 (de) * | 2014-03-03 | 2016-11-24 | Lintec Corporation | Verarbeitungsfolie für ein halbleiterbezogenes Element und Verfahren zur Herstellung von Chips unter Verwendung der Folie |
JP6156443B2 (ja) * | 2014-08-13 | 2017-07-05 | Jsr株式会社 | 積層体および基材の処理方法 |
KR102449502B1 (ko) * | 2015-03-03 | 2022-09-30 | 린텍 가부시키가이샤 | 반도체 가공용 시트 |
JPWO2018003312A1 (ja) | 2016-06-30 | 2019-04-18 | リンテック株式会社 | 半導体加工用シート |
CN114085624B (zh) * | 2016-12-07 | 2023-11-17 | 三菱化学株式会社 | 粘合片及其制造方法 |
JP6791792B2 (ja) * | 2017-03-23 | 2020-11-25 | リンテック株式会社 | 粘着フィルムおよびその製造方法 |
WO2018181511A1 (fr) * | 2017-03-31 | 2018-10-04 | リンテック株式会社 | Procédé de délaminage d'une feuille adhésive |
JP6350845B1 (ja) * | 2018-01-29 | 2018-07-04 | サイデン化学株式会社 | 粘着剤組成物、粘着シート、及び粘着剤の製造方法 |
JP7256787B2 (ja) * | 2018-03-07 | 2023-04-12 | リンテック株式会社 | 粘着シート |
JP2018115333A (ja) * | 2018-03-20 | 2018-07-26 | リンテック株式会社 | 粘着テープおよび半導体装置の製造方法 |
JP2018115331A (ja) * | 2018-03-20 | 2018-07-26 | リンテック株式会社 | 粘着テープおよび半導体装置の製造方法 |
-
2020
- 2020-05-22 JP JP2021551130A patent/JPWO2021065072A1/ja active Pending
- 2020-05-22 WO PCT/JP2020/020329 patent/WO2021065072A1/fr active Application Filing
- 2020-05-22 WO PCT/JP2020/020328 patent/WO2021065071A1/fr active Application Filing
- 2020-05-22 JP JP2021551132A patent/JPWO2021065074A1/ja active Pending
- 2020-05-22 WO PCT/JP2020/020327 patent/WO2021065070A1/fr active Application Filing
- 2020-05-22 KR KR1020227011333A patent/KR20220080093A/ko unknown
- 2020-05-22 JP JP2021551129A patent/JPWO2021065071A1/ja active Pending
- 2020-05-22 CN CN202080070016.3A patent/CN114514295B/zh active Active
- 2020-05-22 CN CN202080070084.XA patent/CN114514296B/zh active Active
- 2020-05-22 KR KR1020227011324A patent/KR20220080092A/ko unknown
- 2020-05-22 CN CN202080069927.4A patent/CN114502679A/zh active Pending
- 2020-05-22 WO PCT/JP2020/020331 patent/WO2021065074A1/fr active Application Filing
- 2020-05-22 JP JP2021551131A patent/JPWO2021065073A1/ja active Pending
- 2020-05-22 KR KR1020227011032A patent/KR20220075341A/ko unknown
- 2020-05-22 JP JP2021551128A patent/JPWO2021065070A1/ja active Pending
- 2020-05-22 WO PCT/JP2020/020330 patent/WO2021065073A1/fr active Application Filing
- 2020-06-10 TW TW109119402A patent/TW202116947A/zh unknown
- 2020-06-10 TW TW109119403A patent/TW202122532A/zh unknown
- 2020-06-10 TW TW109119420A patent/TW202122533A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW202122533A (zh) | 2021-06-16 |
KR20220080093A (ko) | 2022-06-14 |
WO2021065072A1 (fr) | 2021-04-08 |
TW202122532A (zh) | 2021-06-16 |
TW202122534A (zh) | 2021-06-16 |
JPWO2021065070A1 (fr) | 2021-04-08 |
KR20220075341A (ko) | 2022-06-08 |
WO2021065074A1 (fr) | 2021-04-08 |
WO2021065070A1 (fr) | 2021-04-08 |
CN114514296A (zh) | 2022-05-17 |
CN114514295A (zh) | 2022-05-17 |
CN114514296B (zh) | 2024-03-29 |
JPWO2021065073A1 (fr) | 2021-04-08 |
CN114514295B (zh) | 2024-02-06 |
WO2021065073A1 (fr) | 2021-04-08 |
TW202115214A (zh) | 2021-04-16 |
KR20220080092A (ko) | 2022-06-14 |
CN114502679A (zh) | 2022-05-13 |
TW202116947A (zh) | 2021-05-01 |
JPWO2021065071A1 (fr) | 2021-04-08 |
WO2021065071A1 (fr) | 2021-04-08 |
JPWO2021065074A1 (fr) | 2021-04-08 |
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A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230309 |
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