JPWO2021062349A5 - - Google Patents
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- JPWO2021062349A5 JPWO2021062349A5 JP2022518258A JP2022518258A JPWO2021062349A5 JP WO2021062349 A5 JPWO2021062349 A5 JP WO2021062349A5 JP 2022518258 A JP2022518258 A JP 2022518258A JP 2022518258 A JP2022518258 A JP 2022518258A JP WO2021062349 A5 JPWO2021062349 A5 JP WO2021062349A5
- Authority
- JP
- Japan
- Prior art keywords
- coating
- materials
- layer
- range
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000463 material Substances 0.000 claims description 57
- 239000011248 coating agent Substances 0.000 claims description 42
- 238000000576 coating method Methods 0.000 claims description 42
- 238000000151 deposition Methods 0.000 claims description 22
- 239000000376 reactant Substances 0.000 claims description 19
- 230000008021 deposition Effects 0.000 claims description 18
- 239000002243 precursor Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- 229910052726 zirconium Inorganic materials 0.000 claims 6
- 238000000231 atomic layer deposition Methods 0.000 claims 4
- 229910017061 Fe Co Inorganic materials 0.000 claims 3
- 229910003023 Mg-Al Inorganic materials 0.000 claims 3
- 229910045601 alloy Inorganic materials 0.000 claims 3
- 239000000956 alloy Substances 0.000 claims 3
- 229910052782 aluminium Inorganic materials 0.000 claims 3
- 238000005229 chemical vapour deposition Methods 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 claims 3
- 229910052738 indium Inorganic materials 0.000 claims 3
- 229910052742 iron Inorganic materials 0.000 claims 3
- 229910052748 manganese Inorganic materials 0.000 claims 3
- 229910001092 metal group alloy Inorganic materials 0.000 claims 3
- 229910052759 nickel Inorganic materials 0.000 claims 3
- 229910052758 niobium Inorganic materials 0.000 claims 3
- 229910052761 rare earth metal Inorganic materials 0.000 claims 3
- 150000002910 rare earth metals Chemical class 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 229910052718 tin Inorganic materials 0.000 claims 3
- 229910052723 transition metal Inorganic materials 0.000 claims 3
- 150000003624 transition metals Chemical class 0.000 claims 3
- 229910052720 vanadium Inorganic materials 0.000 claims 3
- 229910052727 yttrium Inorganic materials 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 238000001451 molecular beam epitaxy Methods 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000010453 quartz Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 238000005382 thermal cycling Methods 0.000 claims 1
- 239000012636 effector Substances 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023143438A JP7715772B2 (ja) | 2019-09-26 | 2023-09-05 | 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング |
| JP2025061658A JP2025121899A (ja) | 2019-09-26 | 2025-04-03 | 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング |
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IN201941038863 | 2019-09-26 | ||
| IN201941038863 | 2019-09-26 | ||
| US16/890,336 | 2020-06-02 | ||
| US16/890,346 | 2020-06-02 | ||
| US16/890,336 US11540432B2 (en) | 2019-09-26 | 2020-06-02 | Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools |
| US16/890,346 US11547030B2 (en) | 2019-09-26 | 2020-06-02 | Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools |
| PCT/US2020/053036 WO2021062349A1 (en) | 2019-09-26 | 2020-09-28 | Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023143438A Division JP7715772B2 (ja) | 2019-09-26 | 2023-09-05 | 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング |
| JP2025061658A Division JP2025121899A (ja) | 2019-09-26 | 2025-04-03 | 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2022548981A JP2022548981A (ja) | 2022-11-22 |
| JP2022548981A5 JP2022548981A5 (https=) | 2024-03-14 |
| JPWO2021062349A5 true JPWO2021062349A5 (https=) | 2024-03-14 |
| JP7662619B2 JP7662619B2 (ja) | 2025-04-15 |
Family
ID=75162433
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022518258A Active JP7662619B2 (ja) | 2019-09-26 | 2020-09-28 | 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング |
| JP2023143438A Active JP7715772B2 (ja) | 2019-09-26 | 2023-09-05 | 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング |
| JP2025061658A Pending JP2025121899A (ja) | 2019-09-26 | 2025-04-03 | 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023143438A Active JP7715772B2 (ja) | 2019-09-26 | 2023-09-05 | 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング |
| JP2025061658A Pending JP2025121899A (ja) | 2019-09-26 | 2025-04-03 | 半導体プロセスツールにおける静電気散逸用の超薄型共形コーティング |
Country Status (6)
| Country | Link |
|---|---|
| US (4) | US11540432B2 (https=) |
| JP (3) | JP7662619B2 (https=) |
| KR (2) | KR20250113524A (https=) |
| CN (2) | CN114424676B (https=) |
| TW (3) | TW202446985A (https=) |
| WO (1) | WO2021062349A1 (https=) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11540432B2 (en) | 2019-09-26 | 2022-12-27 | Applied Materials, Inc. | Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools |
| WO2022269429A1 (en) * | 2021-06-25 | 2022-12-29 | Advanced Potash Technologies, Ltd. | Multi-step methods of making a high temperature multi-phase material and related materials, compositions and methods of use |
| US12557595B2 (en) * | 2022-01-26 | 2026-02-17 | Applied Materials, Inc. | Methods for electrostatic chuck ceramic surfacing |
| TW202346240A (zh) * | 2022-02-26 | 2023-12-01 | 日商Ｔｏｔｏ股份有限公司 | 複合結構物及具備複合結構物之半導體製造裝置 |
| JP2023124886A (ja) * | 2022-02-26 | 2023-09-07 | Toto株式会社 | 複合構造物および複合構造物を備えた半導体製造装置 |
| JP2023124885A (ja) * | 2022-02-26 | 2023-09-07 | Toto株式会社 | 複合構造物および複合構造物を備えた半導体製造装置 |
| KR102705799B1 (ko) * | 2022-03-29 | 2024-09-12 | 세메스 주식회사 | 로봇 암 및 이를 포함하는 기판처리장치 |
| JP2025522592A (ja) * | 2022-06-28 | 2025-07-15 | インテグリス・インコーポレーテッド | 送達システムのためのモジュールおよび関連方法 |
| KR20250029243A (ko) * | 2022-07-05 | 2025-03-04 | 램 리써치 코포레이션 | 엔드 이펙터 |
| KR102652284B1 (ko) * | 2022-07-11 | 2024-03-28 | 한국생산기술연구원 | 기판 이송용 핸드 |
| US12588463B2 (en) * | 2023-04-21 | 2026-03-24 | STATS ChipPAC Pte. Ltd. | Semiconductor device and methods of making and using an enhanced carrier to reduce electrostatic discharge |
| CN116891131A (zh) * | 2023-06-01 | 2023-10-17 | 张组 | 一种铺砖路面用地砖的终端转运设备 |
| JP2025047784A (ja) * | 2023-09-21 | 2025-04-03 | キヤノントッキ株式会社 | 成膜装置及び成膜方法 |
| JP2025047786A (ja) * | 2023-09-21 | 2025-04-03 | キヤノントッキ株式会社 | 成膜装置及び成膜方法 |
| JP2025047785A (ja) * | 2023-09-21 | 2025-04-03 | キヤノントッキ株式会社 | 成膜装置及び成膜方法 |
| WO2025079541A1 (ja) * | 2023-10-12 | 2025-04-17 | セントラル硝子株式会社 | 成膜方法、半導体デバイスの製造方法、及び成膜システム |
| US20250149373A1 (en) * | 2023-11-06 | 2025-05-08 | Applied Materials, Inc. | Soft touch coating materials for substrate handling |
| US20250226258A1 (en) * | 2024-01-10 | 2025-07-10 | Applied Materials, Inc. | Compact faceplate loading platform |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2031098A1 (en) * | 1990-01-16 | 1991-07-17 | William F. Banholzer | Cvd diamond coated annulus components and method of their fabrication |
| US5756222A (en) * | 1994-08-15 | 1998-05-26 | Applied Materials, Inc. | Corrosion-resistant aluminum article for semiconductor processing equipment |
| US5955858A (en) | 1997-02-14 | 1999-09-21 | Applied Materials, Inc. | Mechanically clamping robot wrist |
| US6641939B1 (en) | 1998-07-01 | 2003-11-04 | The Morgan Crucible Company Plc | Transition metal oxide doped alumina and methods of making and using |
| TW543079B (en) * | 1999-06-03 | 2003-07-21 | Applied Materials Inc | Robot blade for semiconductor processing equipment |
| US6290859B1 (en) * | 1999-11-12 | 2001-09-18 | Sandia Corporation | Tungsten coating for improved wear resistance and reliability of microelectromechanical devices |
| US6316734B1 (en) * | 2000-03-07 | 2001-11-13 | 3M Innovative Properties Company | Flexible circuits with static discharge protection and process for manufacture |
| JP2002292920A (ja) * | 2001-04-02 | 2002-10-09 | Matsushita Electric Ind Co Ltd | 電極構造体およびその製造方法ならびに電極構造体を用いる画像形成装置 |
| US20080213496A1 (en) | 2002-02-14 | 2008-09-04 | Applied Materials, Inc. | Method of coating semiconductor processing apparatus with protective yttrium-containing coatings |
| US20040183135A1 (en) * | 2003-03-19 | 2004-09-23 | Oh-Hun Kwon | ESD dissipative structural components |
| JP4895635B2 (ja) * | 2006-02-20 | 2012-03-14 | セイコーインスツル株式会社 | 搬送装置 |
| US9204525B2 (en) | 2006-07-07 | 2015-12-01 | Cocoon Inc. | Protective covers |
| KR101119075B1 (ko) * | 2007-03-12 | 2012-03-15 | 주식회사 코미코 | 웨이퍼 이송 장치 |
| KR100825418B1 (ko) | 2007-10-15 | 2008-04-29 | (주)쓰리나인 | 케이스 외관의 정전기 방지용 박막 및 그 제조방법 |
| FI20095947A0 (fi) * | 2009-09-14 | 2009-09-14 | Beneq Oy | Monikerrospinnoite, menetelmä monikerrospinnoitteen valmistamiseksi, ja sen käyttötapoja |
| WO2012088172A2 (en) | 2010-12-20 | 2012-06-28 | Entegris, Inc. | Front opening large substrate container |
| US9105379B2 (en) | 2011-01-21 | 2015-08-11 | Uchicago Argonne, Llc | Tunable resistance coatings |
| KR101387387B1 (ko) | 2011-12-21 | 2014-04-30 | (주)탑나노시스 | 대전방지용 시트 및 이를 포함하여 대전방지된 작업 스테이지 |
| US20150311043A1 (en) * | 2014-04-25 | 2015-10-29 | Applied Materials, Inc. | Chamber component with fluorinated thin film coating |
| US20150334812A1 (en) * | 2014-05-16 | 2015-11-19 | John Mazzocco | Design to manage charge and discharge of wafers and wafer carrier rings |
| TWI676227B (zh) * | 2015-01-23 | 2019-11-01 | 美商應用材料股份有限公司 | 半導體工藝設備 |
| US9881820B2 (en) | 2015-10-22 | 2018-01-30 | Lam Research Corporation | Front opening ring pod |
| US20170140902A1 (en) | 2015-11-16 | 2017-05-18 | Coorstek, Inc. | Corrosion-resistant components and methods of making |
| CN108292588B (zh) | 2015-12-04 | 2022-02-18 | 应用材料公司 | 用以防止hdp-cvd腔室电弧放电的先进涂层方法及材料 |
| US9850573B1 (en) * | 2016-06-23 | 2017-12-26 | Applied Materials, Inc. | Non-line of sight deposition of erbium based plasma resistant ceramic coating |
| US20180016678A1 (en) * | 2016-07-15 | 2018-01-18 | Applied Materials, Inc. | Multi-layer coating with diffusion barrier layer and erosion resistant layer |
| JP2018142597A (ja) * | 2017-02-27 | 2018-09-13 | 三菱ケミカル株式会社 | 太陽電池モジュール |
| JP7019529B2 (ja) * | 2018-07-30 | 2022-02-15 | 京セラ株式会社 | 試料搬送部材 |
| US11540432B2 (en) | 2019-09-26 | 2022-12-27 | Applied Materials, Inc. | Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools |
-
2020
- 2020-06-02 US US16/890,336 patent/US11540432B2/en active Active
- 2020-06-02 US US16/890,346 patent/US11547030B2/en active Active
- 2020-09-25 TW TW113127127A patent/TW202446985A/zh unknown
- 2020-09-25 TW TW109133277A patent/TWI853096B/zh active
- 2020-09-25 TW TW113127123A patent/TWI887047B/zh active
- 2020-09-28 JP JP2022518258A patent/JP7662619B2/ja active Active
- 2020-09-28 KR KR1020257023475A patent/KR20250113524A/ko active Pending
- 2020-09-28 KR KR1020227013686A patent/KR102836195B1/ko active Active
- 2020-09-28 CN CN202080066006.2A patent/CN114424676B/zh active Active
- 2020-09-28 WO PCT/US2020/053036 patent/WO2021062349A1/en not_active Ceased
- 2020-09-28 CN CN202511027140.2A patent/CN121023476A/zh active Pending
-
2022
- 2022-11-10 US US17/985,065 patent/US12004337B2/en active Active
-
2023
- 2023-09-05 JP JP2023143438A patent/JP7715772B2/ja active Active
-
2024
- 2024-04-26 US US18/648,278 patent/US12564012B2/en active Active
-
2025
- 2025-04-03 JP JP2025061658A patent/JP2025121899A/ja active Pending
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