JPWO2021048948A1 - - Google Patents

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Publication number
JPWO2021048948A1
JPWO2021048948A1 JP2021545029A JP2021545029A JPWO2021048948A1 JP WO2021048948 A1 JPWO2021048948 A1 JP WO2021048948A1 JP 2021545029 A JP2021545029 A JP 2021545029A JP 2021545029 A JP2021545029 A JP 2021545029A JP WO2021048948 A1 JPWO2021048948 A1 JP WO2021048948A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021545029A
Other versions
JP7261309B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021048948A1 publication Critical patent/JPWO2021048948A1/ja
Application granted granted Critical
Publication of JP7261309B2 publication Critical patent/JP7261309B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/086—Supply management, e.g. supply of components or of substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/0882—Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021545029A 2019-09-11 2019-09-11 部品実装機 Active JP7261309B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/035665 WO2021048948A1 (ja) 2019-09-11 2019-09-11 部品実装機

Publications (2)

Publication Number Publication Date
JPWO2021048948A1 true JPWO2021048948A1 (ja) 2021-03-18
JP7261309B2 JP7261309B2 (ja) 2023-04-19

Family

ID=74866249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021545029A Active JP7261309B2 (ja) 2019-09-11 2019-09-11 部品実装機

Country Status (5)

Country Link
US (1) US20220312659A1 (ja)
EP (1) EP4030884A4 (ja)
JP (1) JP7261309B2 (ja)
CN (1) CN114303451B (ja)
WO (1) WO2021048948A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024063527A1 (ko) * 2022-09-20 2024-03-28 주식회사 고영테크놀러지 기판 처리 공정을 제어하는 장치, 방법 및 기록 매체

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011066041A (ja) * 2009-09-15 2011-03-31 Juki Corp 電子部品実装装置
JP6301635B2 (ja) * 2013-11-13 2018-03-28 富士機械製造株式会社 基板検査方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002111299A (ja) 2000-09-29 2002-04-12 Matsushita Electric Ind Co Ltd 部品装着方法及び装置
JP2005045018A (ja) * 2003-07-22 2005-02-17 Yamagata Casio Co Ltd 部品搭載装置及びその異常状態早期検出方法
JP4674220B2 (ja) * 2007-03-05 2011-04-20 ヤマハ発動機株式会社 部品移載装置、表面実装機、及び電子部品検査装置
DE112008001382T5 (de) * 2007-05-24 2010-04-08 Panasonic Corporation Bauelement-Montageverfahren, Bauelement-Montagevorrichtung, Verfahren zum Bestimmen von Montagebedingungen sowie Vorrichtung und Programm zum Bestimmen von Montagebedingungen
JP2009037428A (ja) * 2007-08-01 2009-02-19 Yazaki Corp 警報器及び警報器の点検方法
JP4923212B2 (ja) * 2007-11-22 2012-04-25 キリンテクノシステム株式会社 表面検査装置の検査システム
JP5155217B2 (ja) * 2009-02-26 2013-03-06 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP2010258115A (ja) * 2009-04-23 2010-11-11 Hitachi High-Tech Instruments Co Ltd 電子部品装着方法
JP2011035081A (ja) * 2009-07-30 2011-02-17 Hitachi High-Tech Instruments Co Ltd 電子部品の装着方法及び電子部品の装着装置
JP2011040792A (ja) * 2010-11-22 2011-02-24 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
JP5776605B2 (ja) * 2012-03-30 2015-09-09 オムロン株式会社 基板検査結果の分析作業支援用の情報表示システムおよび分析作業の支援方法
KR20150023205A (ko) * 2013-08-23 2015-03-05 주식회사 고영테크놀러지 기판 검사방법 및 이를 이용한 기판 검사시스템
JP6413246B2 (ja) * 2014-01-29 2018-10-31 オムロン株式会社 品質管理装置および品質管理装置の制御方法
WO2015121918A1 (ja) * 2014-02-12 2015-08-20 富士機械製造株式会社 基板生産ラインの生産管理装置
EP3236729B1 (en) * 2014-12-16 2021-03-03 FUJI Corporation Component mounting device and component mounting system
CN107211568B (zh) * 2015-01-20 2019-08-02 株式会社富士 检查辅助装置及检查辅助方法
WO2017085865A1 (ja) * 2015-11-20 2017-05-26 富士機械製造株式会社 部品実装機の制御装置
JP7005930B2 (ja) * 2017-04-21 2022-01-24 オムロン株式会社 シート検査装置及び検査システム
JP6988499B2 (ja) * 2018-01-16 2022-01-05 オムロン株式会社 検査管理システム、検査管理装置、検査管理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011066041A (ja) * 2009-09-15 2011-03-31 Juki Corp 電子部品実装装置
JP6301635B2 (ja) * 2013-11-13 2018-03-28 富士機械製造株式会社 基板検査方法

Also Published As

Publication number Publication date
US20220312659A1 (en) 2022-09-29
WO2021048948A1 (ja) 2021-03-18
EP4030884A1 (en) 2022-07-20
CN114303451B (zh) 2024-01-30
CN114303451A (zh) 2022-04-08
EP4030884A4 (en) 2022-09-14
JP7261309B2 (ja) 2023-04-19

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