JPWO2020189759A5 - - Google Patents
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- Publication number
- JPWO2020189759A5 JPWO2020189759A5 JP2021507418A JP2021507418A JPWO2020189759A5 JP WO2020189759 A5 JPWO2020189759 A5 JP WO2020189759A5 JP 2021507418 A JP2021507418 A JP 2021507418A JP 2021507418 A JP2021507418 A JP 2021507418A JP WO2020189759 A5 JPWO2020189759 A5 JP WO2020189759A5
- Authority
- JP
- Japan
- Prior art keywords
- polyamic acid
- general formula
- composition according
- acid composition
- polyimide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005575 poly(amic acid) Polymers 0.000 claims 23
- 239000000203 mixture Substances 0.000 claims 11
- 229920001721 polyimide Polymers 0.000 claims 11
- 239000010419 fine particle Substances 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 6
- 150000004985 diamines Chemical class 0.000 claims 5
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims 3
- 125000000962 organic group Chemical group 0.000 claims 3
- 239000003960 organic solvent Substances 0.000 claims 3
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims 3
- 239000004642 Polyimide Substances 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000003118 aryl group Chemical group 0.000 claims 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- 125000000732 arylene group Chemical group 0.000 claims 1
- 125000004427 diamine group Chemical group 0.000 claims 1
- 230000009477 glass transition Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- RTWNYYOXLSILQN-UHFFFAOYSA-N methanediamine Chemical compound NCN RTWNYYOXLSILQN-UHFFFAOYSA-N 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 239000011164 primary particle Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 230000004580 weight loss Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019052180 | 2019-03-20 | ||
| JP2019052180 | 2019-03-20 | ||
| PCT/JP2020/012329 WO2020189759A1 (ja) | 2019-03-20 | 2020-03-19 | ポリアミド酸組成物およびその製造方法、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびその製造方法、ならびにフレキシブルデバイスおよびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2020189759A1 JPWO2020189759A1 (https=) | 2020-09-24 |
| JPWO2020189759A5 true JPWO2020189759A5 (https=) | 2023-03-02 |
| JP7539366B2 JP7539366B2 (ja) | 2024-08-23 |
Family
ID=72520194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021507418A Active JP7539366B2 (ja) | 2019-03-20 | 2020-03-19 | ポリアミド酸組成物およびその製造方法、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびその製造方法、ならびにフレキシブルデバイスおよびその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7539366B2 (https=) |
| KR (1) | KR20210138701A (https=) |
| CN (1) | CN113613904A (https=) |
| TW (1) | TW202045592A (https=) |
| WO (1) | WO2020189759A1 (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7640245B2 (ja) * | 2020-10-22 | 2025-03-05 | 株式会社カネカ | ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびフレキシブルデバイス、ならびにポリイミド膜の製造方法 |
| CN116348537B (zh) * | 2020-11-18 | 2025-08-12 | 株式会社Lg化学 | 聚酰亚胺聚合物膜、使用其的用于柔性显示装置的基底和柔性显示装置 |
| CN112876681B (zh) * | 2021-02-04 | 2022-09-23 | 武汉柔显科技股份有限公司 | 一种使用撞击流反应器制备聚酰亚胺前驱体及其薄膜的制备方法 |
| US20240158578A1 (en) * | 2021-02-19 | 2024-05-16 | Ube Corporation | Polyimide precursor composition and polyimide film |
| TW202523736A (zh) * | 2021-04-02 | 2025-06-16 | 日商旭化成股份有限公司 | 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法 |
| KR20230032069A (ko) | 2021-08-30 | 2023-03-07 | 에스케이이노베이션 주식회사 | 폴리이미드 필름 형성용 조성물의 제조방법, 이로부터 제조된 폴리이미드 필름 형성용 조성물 및 이의 용도 |
| KR102692760B1 (ko) * | 2021-10-26 | 2024-08-07 | 피아이첨단소재 주식회사 | 폴리아믹산 조성물 및 이의 제조방법 |
| KR102692756B1 (ko) * | 2021-10-26 | 2024-08-07 | 피아이첨단소재 주식회사 | 폴리아믹산 조성물 및 이의 제조방법 |
| WO2023106571A1 (ko) * | 2021-12-08 | 2023-06-15 | 주식회사 엘지화학 | 폴리이미드계 수지 필름 및 이를 이용한 디스플레이 장치용 기판, 및 광학 장치 |
| KR102679178B1 (ko) * | 2022-06-29 | 2024-06-27 | 피아이첨단소재 주식회사 | 자기 윤활성 폴리이미드 바니쉬 및 이로부터 제조되는 폴리이미드 피복물 |
| CN115558436B (zh) * | 2022-10-18 | 2023-08-01 | 昆山雅森电子材料科技有限公司 | 一种高性能聚酰亚胺屏蔽膜及其制备方法 |
| KR20250031411A (ko) * | 2023-08-28 | 2025-03-07 | 피아이첨단소재 주식회사 | 전압 내구 특성이 우수한 폴리이미드 바니쉬 및 이로부터 제조되는 폴리이미드 피복물 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3972600B2 (ja) | 2000-09-14 | 2007-09-05 | ソニーケミカル＆インフォメーションデバイス株式会社 | ポリイミド前駆体、その製造方法及び感光性樹脂組成物 |
| JP5903789B2 (ja) | 2010-07-22 | 2016-04-13 | 宇部興産株式会社 | 共重合ポリイミド前駆体及び共重合ポリイミド |
| KR101946092B1 (ko) * | 2011-09-29 | 2019-02-08 | 제이에스알 가부시끼가이샤 | 수지 조성물 및 그것을 이용한 막 형성 방법 |
| KR102213304B1 (ko) | 2012-12-21 | 2021-02-05 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | 폴리이미드 전구체 및 그것을 함유하는 수지 조성물 |
| JPWO2014148441A1 (ja) | 2013-03-18 | 2017-02-16 | 旭化成株式会社 | 樹脂前駆体及びそれを含有する樹脂組成物、樹脂フィルム及びその製造方法、並びに、積層体及びその製造方法 |
| EP3187559B1 (en) * | 2014-08-08 | 2021-02-17 | Toray Industries, Inc. | Adhesive for temporary bonding, adhesive layer, method for manufacturing wafer work piece and semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition |
| US10798826B2 (en) * | 2015-03-31 | 2020-10-06 | Kaneka Corporation | Polyimide laminate film, method for manufacturing polyimide laminate film, method for manufacturing thermoplastic polyimide, and method for manufacturing flexible metal-clad laminate |
| SG11201802076PA (en) * | 2015-09-30 | 2018-04-27 | Toray Industries | Negative photosensitive resin composition, cured film, element and display device each provided with cured film, and method for manufacturing display device |
| SG11201805612PA (en) * | 2016-02-08 | 2018-07-30 | Toray Industries | Resin Composition, Resin Layer, Permanent Adhesive, Adhesive For Temporary Bonding, Laminated Film, Processed Wafer, And Method For Manufacturing Electronic Component Or Semiconductor Device |
| CN105906813A (zh) * | 2016-06-05 | 2016-08-31 | 吉林大学 | 一种规整嵌段共聚聚酰亚胺硅氧烷单层膜的制备方法 |
| JP7292260B2 (ja) * | 2018-03-30 | 2023-06-16 | 株式会社カネカ | ポリアミド酸およびその製造方法、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびその製造方法、ならびにフレキシブルデバイスおよびその製造方法 |
-
2020
- 2020-03-19 CN CN202080022551.1A patent/CN113613904A/zh active Pending
- 2020-03-19 JP JP2021507418A patent/JP7539366B2/ja active Active
- 2020-03-19 WO PCT/JP2020/012329 patent/WO2020189759A1/ja not_active Ceased
- 2020-03-19 KR KR1020217033315A patent/KR20210138701A/ko active Pending
- 2020-03-20 TW TW109109391A patent/TW202045592A/zh unknown
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