JPWO2020189759A1 - - Google Patents

Info

Publication number
JPWO2020189759A1
JPWO2020189759A1 JP2021507418A JP2021507418A JPWO2020189759A1 JP WO2020189759 A1 JPWO2020189759 A1 JP WO2020189759A1 JP 2021507418 A JP2021507418 A JP 2021507418A JP 2021507418 A JP2021507418 A JP 2021507418A JP WO2020189759 A1 JPWO2020189759 A1 JP WO2020189759A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021507418A
Other languages
Japanese (ja)
Other versions
JPWO2020189759A5 (https=
JP7539366B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020189759A1 publication Critical patent/JPWO2020189759A1/ja
Publication of JPWO2020189759A5 publication Critical patent/JPWO2020189759A5/ja
Application granted granted Critical
Publication of JP7539366B2 publication Critical patent/JP7539366B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021507418A 2019-03-20 2020-03-19 ポリアミド酸組成物およびその製造方法、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびその製造方法、ならびにフレキシブルデバイスおよびその製造方法 Active JP7539366B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019052180 2019-03-20
JP2019052180 2019-03-20
PCT/JP2020/012329 WO2020189759A1 (ja) 2019-03-20 2020-03-19 ポリアミド酸組成物およびその製造方法、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびその製造方法、ならびにフレキシブルデバイスおよびその製造方法

Publications (3)

Publication Number Publication Date
JPWO2020189759A1 true JPWO2020189759A1 (https=) 2020-09-24
JPWO2020189759A5 JPWO2020189759A5 (https=) 2023-03-02
JP7539366B2 JP7539366B2 (ja) 2024-08-23

Family

ID=72520194

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021507418A Active JP7539366B2 (ja) 2019-03-20 2020-03-19 ポリアミド酸組成物およびその製造方法、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびその製造方法、ならびにフレキシブルデバイスおよびその製造方法

Country Status (5)

Country Link
JP (1) JP7539366B2 (https=)
KR (1) KR20210138701A (https=)
CN (1) CN113613904A (https=)
TW (1) TW202045592A (https=)
WO (1) WO2020189759A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7640245B2 (ja) * 2020-10-22 2025-03-05 株式会社カネカ ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびフレキシブルデバイス、ならびにポリイミド膜の製造方法
CN116348537B (zh) * 2020-11-18 2025-08-12 株式会社Lg化学 聚酰亚胺聚合物膜、使用其的用于柔性显示装置的基底和柔性显示装置
CN112876681B (zh) * 2021-02-04 2022-09-23 武汉柔显科技股份有限公司 一种使用撞击流反应器制备聚酰亚胺前驱体及其薄膜的制备方法
US20240158578A1 (en) * 2021-02-19 2024-05-16 Ube Corporation Polyimide precursor composition and polyimide film
TW202523736A (zh) * 2021-04-02 2025-06-16 日商旭化成股份有限公司 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法
KR20230032069A (ko) 2021-08-30 2023-03-07 에스케이이노베이션 주식회사 폴리이미드 필름 형성용 조성물의 제조방법, 이로부터 제조된 폴리이미드 필름 형성용 조성물 및 이의 용도
KR102692760B1 (ko) * 2021-10-26 2024-08-07 피아이첨단소재 주식회사 폴리아믹산 조성물 및 이의 제조방법
KR102692756B1 (ko) * 2021-10-26 2024-08-07 피아이첨단소재 주식회사 폴리아믹산 조성물 및 이의 제조방법
WO2023106571A1 (ko) * 2021-12-08 2023-06-15 주식회사 엘지화학 폴리이미드계 수지 필름 및 이를 이용한 디스플레이 장치용 기판, 및 광학 장치
KR102679178B1 (ko) * 2022-06-29 2024-06-27 피아이첨단소재 주식회사 자기 윤활성 폴리이미드 바니쉬 및 이로부터 제조되는 폴리이미드 피복물
CN115558436B (zh) * 2022-10-18 2023-08-01 昆山雅森电子材料科技有限公司 一种高性能聚酰亚胺屏蔽膜及其制备方法
KR20250031411A (ko) * 2023-08-28 2025-03-07 피아이첨단소재 주식회사 전압 내구 특성이 우수한 폴리이미드 바니쉬 및 이로부터 제조되는 폴리이미드 피복물

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016021646A1 (ja) * 2014-08-08 2016-02-11 東レ株式会社 仮貼り用接着剤、接着剤層、ウエハ加工体およびこれを用いた半導体装置の製造方法、リワーク溶剤、ポリイミド共重合体、ポリイミド混合樹脂、ならびに樹脂組成物
WO2017057281A1 (ja) * 2015-09-30 2017-04-06 東レ株式会社 ネガ型感光性樹脂組成物、硬化膜、硬化膜を具備する素子及び表示装置、並びにその製造方法
WO2017138447A1 (ja) * 2016-02-08 2017-08-17 東レ株式会社 樹脂組成物、樹脂層、永久接着剤、仮貼り接着剤、積層フィルム、ウエハ加工体および電子部品または半導体装置の製造方法
JP7292260B2 (ja) * 2018-03-30 2023-06-16 株式会社カネカ ポリアミド酸およびその製造方法、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびその製造方法、ならびにフレキシブルデバイスおよびその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3972600B2 (ja) 2000-09-14 2007-09-05 ソニーケミカル＆インフォメーションデバイス株式会社 ポリイミド前駆体、その製造方法及び感光性樹脂組成物
JP5903789B2 (ja) 2010-07-22 2016-04-13 宇部興産株式会社 共重合ポリイミド前駆体及び共重合ポリイミド
KR101946092B1 (ko) * 2011-09-29 2019-02-08 제이에스알 가부시끼가이샤 수지 조성물 및 그것을 이용한 막 형성 방법
KR102213304B1 (ko) 2012-12-21 2021-02-05 아사히 가세이 이-매터리얼즈 가부시키가이샤 폴리이미드 전구체 및 그것을 함유하는 수지 조성물
JPWO2014148441A1 (ja) 2013-03-18 2017-02-16 旭化成株式会社 樹脂前駆体及びそれを含有する樹脂組成物、樹脂フィルム及びその製造方法、並びに、積層体及びその製造方法
US10798826B2 (en) * 2015-03-31 2020-10-06 Kaneka Corporation Polyimide laminate film, method for manufacturing polyimide laminate film, method for manufacturing thermoplastic polyimide, and method for manufacturing flexible metal-clad laminate
CN105906813A (zh) * 2016-06-05 2016-08-31 吉林大学 一种规整嵌段共聚聚酰亚胺硅氧烷单层膜的制备方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016021646A1 (ja) * 2014-08-08 2016-02-11 東レ株式会社 仮貼り用接着剤、接着剤層、ウエハ加工体およびこれを用いた半導体装置の製造方法、リワーク溶剤、ポリイミド共重合体、ポリイミド混合樹脂、ならびに樹脂組成物
WO2017057281A1 (ja) * 2015-09-30 2017-04-06 東レ株式会社 ネガ型感光性樹脂組成物、硬化膜、硬化膜を具備する素子及び表示装置、並びにその製造方法
WO2017138447A1 (ja) * 2016-02-08 2017-08-17 東レ株式会社 樹脂組成物、樹脂層、永久接着剤、仮貼り接着剤、積層フィルム、ウエハ加工体および電子部品または半導体装置の製造方法
JP7292260B2 (ja) * 2018-03-30 2023-06-16 株式会社カネカ ポリアミド酸およびその製造方法、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびその製造方法、ならびにフレキシブルデバイスおよびその製造方法

Also Published As

Publication number Publication date
KR20210138701A (ko) 2021-11-19
WO2020189759A1 (ja) 2020-09-24
JP7539366B2 (ja) 2024-08-23
CN113613904A (zh) 2021-11-05
TW202045592A (zh) 2020-12-16

Similar Documents

Publication Publication Date Title
BR112019017762A2 (https=)
BR112021018450A2 (https=)
BR112021017637A2 (https=)
JPWO2020189759A1 (https=)
BR112021017892A2 (https=)
BR112021017782A2 (https=)
BR112021016821A2 (https=)
BR112021017939A2 (https=)
BR112021017738A2 (https=)
BR112021016996A2 (https=)
BR112021008711A2 (https=)
BR112021017728A2 (https=)
BR112021018452A2 (https=)
BR112021017703A2 (https=)
BR112021018102A2 (https=)
BR112021017732A2 (https=)
BR112021017234A2 (https=)
BR112021017355A2 (https=)
BR112021018168A2 (https=)
BR112021018093A2 (https=)
BR112021017173A2 (https=)
BR112021017083A2 (https=)
BR112021012348A2 (https=)
BR112021018250A2 (https=)
BR112021018584A2 (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230221

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230221

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240326

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240415

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240723

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240813

R150 Certificate of patent or registration of utility model

Ref document number: 7539366

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150