KR20210138701A - 폴리아미드산 조성물 및 그의 제조 방법, 폴리아미드산 용액, 폴리이미드, 폴리이미드막, 적층체 및 그의 제조 방법, 그리고 플렉시블 디바이스 및 그의 제조 방법 - Google Patents

폴리아미드산 조성물 및 그의 제조 방법, 폴리아미드산 용액, 폴리이미드, 폴리이미드막, 적층체 및 그의 제조 방법, 그리고 플렉시블 디바이스 및 그의 제조 방법 Download PDF

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KR20210138701A
KR20210138701A KR1020217033315A KR20217033315A KR20210138701A KR 20210138701 A KR20210138701 A KR 20210138701A KR 1020217033315 A KR1020217033315 A KR 1020217033315A KR 20217033315 A KR20217033315 A KR 20217033315A KR 20210138701 A KR20210138701 A KR 20210138701A
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polyamic acid
diamine
polyimide film
polyimide
group
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Korean (ko)
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히로후미 나카야마
마리 우노
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가부시키가이샤 가네카
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020217033315A 2019-03-20 2020-03-19 폴리아미드산 조성물 및 그의 제조 방법, 폴리아미드산 용액, 폴리이미드, 폴리이미드막, 적층체 및 그의 제조 방법, 그리고 플렉시블 디바이스 및 그의 제조 방법 Pending KR20210138701A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019052180 2019-03-20
JPJP-P-2019-052180 2019-03-20
PCT/JP2020/012329 WO2020189759A1 (ja) 2019-03-20 2020-03-19 ポリアミド酸組成物およびその製造方法、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびその製造方法、ならびにフレキシブルデバイスおよびその製造方法

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KR20210138701A true KR20210138701A (ko) 2021-11-19

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JP (1) JP7539366B2 (https=)
KR (1) KR20210138701A (https=)
CN (1) CN113613904A (https=)
TW (1) TW202045592A (https=)
WO (1) WO2020189759A1 (https=)

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JP7640245B2 (ja) * 2020-10-22 2025-03-05 株式会社カネカ ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびフレキシブルデバイス、ならびにポリイミド膜の製造方法
CN116348537B (zh) * 2020-11-18 2025-08-12 株式会社Lg化学 聚酰亚胺聚合物膜、使用其的用于柔性显示装置的基底和柔性显示装置
CN112876681B (zh) * 2021-02-04 2022-09-23 武汉柔显科技股份有限公司 一种使用撞击流反应器制备聚酰亚胺前驱体及其薄膜的制备方法
US20240158578A1 (en) * 2021-02-19 2024-05-16 Ube Corporation Polyimide precursor composition and polyimide film
TW202523736A (zh) * 2021-04-02 2025-06-16 日商旭化成股份有限公司 聚醯亞胺、樹脂組合物、聚醯亞胺膜及其製造方法
KR20230032069A (ko) 2021-08-30 2023-03-07 에스케이이노베이션 주식회사 폴리이미드 필름 형성용 조성물의 제조방법, 이로부터 제조된 폴리이미드 필름 형성용 조성물 및 이의 용도
KR102692760B1 (ko) * 2021-10-26 2024-08-07 피아이첨단소재 주식회사 폴리아믹산 조성물 및 이의 제조방법
KR102692756B1 (ko) * 2021-10-26 2024-08-07 피아이첨단소재 주식회사 폴리아믹산 조성물 및 이의 제조방법
WO2023106571A1 (ko) * 2021-12-08 2023-06-15 주식회사 엘지화학 폴리이미드계 수지 필름 및 이를 이용한 디스플레이 장치용 기판, 및 광학 장치
KR102679178B1 (ko) * 2022-06-29 2024-06-27 피아이첨단소재 주식회사 자기 윤활성 폴리이미드 바니쉬 및 이로부터 제조되는 폴리이미드 피복물
CN115558436B (zh) * 2022-10-18 2023-08-01 昆山雅森电子材料科技有限公司 一种高性能聚酰亚胺屏蔽膜及其制备方法
KR20250031411A (ko) * 2023-08-28 2025-03-07 피아이첨단소재 주식회사 전압 내구 특성이 우수한 폴리이미드 바니쉬 및 이로부터 제조되는 폴리이미드 피복물

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JP2012041530A (ja) 2010-07-22 2012-03-01 Ube Industries Ltd 共重合ポリイミド前駆体及び共重合ポリイミド
JP5948545B2 (ja) 2012-12-21 2016-07-06 旭化成株式会社 ポリイミド前駆体及びそれを含有する樹脂組成物
JP2017226847A (ja) 2013-03-18 2017-12-28 旭化成株式会社 樹脂前駆体及びそれを含有する樹脂組成物、樹脂フィルム及びその製造方法、並びに、積層体及びその製造方法

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JP2002161136A (ja) 2000-09-14 2002-06-04 Sony Chem Corp ポリイミド前駆体、その製造方法及び感光性樹脂組成物
JP2012041530A (ja) 2010-07-22 2012-03-01 Ube Industries Ltd 共重合ポリイミド前駆体及び共重合ポリイミド
JP5948545B2 (ja) 2012-12-21 2016-07-06 旭化成株式会社 ポリイミド前駆体及びそれを含有する樹脂組成物
JP2017226847A (ja) 2013-03-18 2017-12-28 旭化成株式会社 樹脂前駆体及びそれを含有する樹脂組成物、樹脂フィルム及びその製造方法、並びに、積層体及びその製造方法

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JP7539366B2 (ja) 2024-08-23
CN113613904A (zh) 2021-11-05
TW202045592A (zh) 2020-12-16

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