JPWO2019163978A1 - 熱交換器、冷凍機および焼結体 - Google Patents
熱交換器、冷凍機および焼結体 Download PDFInfo
- Publication number
- JPWO2019163978A1 JPWO2019163978A1 JP2020501078A JP2020501078A JPWO2019163978A1 JP WO2019163978 A1 JPWO2019163978 A1 JP WO2019163978A1 JP 2020501078 A JP2020501078 A JP 2020501078A JP 2020501078 A JP2020501078 A JP 2020501078A JP WO2019163978 A1 JPWO2019163978 A1 JP WO2019163978A1
- Authority
- JP
- Japan
- Prior art keywords
- side flow
- temperature side
- flow path
- porous body
- heat exchanger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims abstract description 69
- 229910052751 metal Inorganic materials 0.000 claims abstract description 53
- 239000002184 metal Substances 0.000 claims abstract description 53
- 229910052734 helium Inorganic materials 0.000 claims abstract description 46
- 239000001307 helium Substances 0.000 claims abstract description 46
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000011148 porous material Substances 0.000 claims abstract description 42
- 239000010419 fine particle Substances 0.000 claims abstract description 31
- 239000002105 nanoparticle Substances 0.000 claims abstract description 10
- 238000005192 partition Methods 0.000 claims abstract description 6
- 239000002245 particle Substances 0.000 claims description 20
- 238000001816 cooling Methods 0.000 claims description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 238000010790 dilution Methods 0.000 description 22
- 239000012895 dilution Substances 0.000 description 22
- 230000009467 reduction Effects 0.000 description 10
- 239000007787 solid Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000007783 nanoporous material Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005194 fractionation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
- F25B9/12—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using 3He-4He dilution
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/0031—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
- F28D9/0037—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the conduits for the other heat-exchange medium also being formed by paired plates touching each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/20—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes with nanostructures
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
Description
本実施の形態に係る希釈冷凍機は、100mK以下の極低温を実現する代表的な冷凍機である。図1は、本実施の形態に係る希釈冷凍機の概略構成を示す模式図である。希釈冷凍機10は、内部に3He希薄相(以下、適宜「希薄相」と称する。)12と3He濃厚相(以下、適宜「濃厚相」と称する。)14とが形成される混合室16と、混合室16に流入する3He液体と混合室16から流出する3He液体および4He液体の混合液とが熱交換する熱交換器18と、3Heおよび4Heの混合液から3Heを蒸気として選択的に分離する分溜室20と、1K液体ヘリウムが貯留されている1K貯溜室22と、を備える。分溜室20は、低温側流路32を流れる混合液が流入する流入路20bを有している。混合室16、熱交換器18、分溜室20および1K貯溜室22は、真空断熱されたクライオスタット24内に配置されている。
本発明者らは、このような希釈冷凍機の性能に大きな影響を与える構成の一つである熱交換器に着目し、特に、高温側流路30から低温側流路32への熱伝導を向上するための、新たな技術を考案した。
図3は、本実施の形態に係る熱抵抗低減部40の要部を示す模式図である。図3では、一つのナノ多孔体を中心とした構成を図示しているが、熱抵抗低減部40には、ナノ多孔体や金属微粒子が多数存在していることは言うまでもない。
図4は、本実施の形態に係る多孔体42の概略構成を模式的に示す模式図である。多孔体42は、シリケート等からなるナノ多孔体(メソポーラスシリカ)であり、ナノサイズの複数の細孔42aが規則的に形成されている。そのため、銀等の金属微粒子の比面積(約1m2/g)と比較して、多孔体42は、比面積が600〜1300m2/gであり、3桁以上大きい。カピッツァ効果による熱抵抗は界面面積に反比例して減少するため、多孔体42を介して金属部材38と液体ヘリウムとの熱伝導を行うことで、金属部材38と液体ヘリウムとの界面でのカピッツァ抵抗を低減できる。また、小さい熱伝導部36でも十分な界面面積を確保することができるため、装置の小型化が可能である。
上記のナノ多孔体と銀の焼結構造は、ナノ多孔体に吸着した4Heと3Heの超低温比熱測定で評価を行った。比熱測定は準断熱ヒートパルス法で行い、比熱容器にはヒータと温度計が取り付けてある。そして、ヒートパルスを加えたあとの容器温度の時間変化を解析することにより、吸着ヘリウムと容器が同じ温度になるまでの緩和時間を測定した。その結果、温度が26mKまでは、温度計の応答時間約5秒よりも短い緩和時間であり、熱抵抗が十分に小さいことが確認された。
Claims (11)
- 低温の液体ヘリウムが流れる低温側流路と、
高温の液体ヘリウムが流れる高温側流路と、
前記高温側流路から前記低温側流路へ熱を伝導する熱伝導部と、を備え、
前記熱伝導部は、
前記高温側流路と前記低温側流路とを隔てる隔壁部材と、
前記隔壁部材と前記液体ヘリウムとの熱抵抗を低減する熱抵抗低減部と、を有し、
前記熱抵抗低減部は、ナノサイズの細孔を有する多孔体と、前記多孔体よりも熱伝導率の高い金属微粒子と、を有することを特徴とする熱交換器。 - 前記熱抵抗低減部は、前記多孔体と前記金属微粒子との焼結体であることを特徴とする請求項1に記載の熱交換器。
- 前記熱抵抗低減部は、厚みが1〜1000μmの範囲であることを特徴とする請求項1または2に記載の熱交換器。
- 前記多孔体は、前記細孔として表面に貫通孔が形成されている粒子であることを特徴とする請求項1乃至3のいずれか1項に記載の熱交換器。
- 前記貫通孔は、内部においてヘリウムが液体で存在できる直径を有していることを特徴とする請求項4に記載の熱交換器。
- 前記多孔体は、平均細孔径が2〜30nmの範囲であることを特徴とする請求項1乃至5のいずれか1項に記載の熱交換器。
- 前記多孔体は、平均粒径が50〜20000nmの範囲にあるシリケート粒子であることを特徴とする請求項1乃至6のいずれか1項に記載の熱交換器。
- 前記多孔体は、比面積が600m2/g以上であることを特徴とする請求項1乃至7のいずれか1項に記載の熱交換器。
- 前記金属微粒子は、平均粒径が50〜100000nmの範囲にある銀微粒子であることを特徴とする請求項1乃至8のいずれか1項に記載の熱交換器。
- 請求項1乃至9のいずれか1項に記載の熱交換器と、
内部に3He希薄相と3He濃厚相とが形成されており、前記高温側流路から前記3He濃厚相に3He液体が流入する流入路と、前記3He希薄相から前記低温側流路へ3He液体が流出する流出路と、を有する混合室と、
前記低温側流路を流れる3He液体が流入する流入路を有し、4He液体と3He液体との混合液から3Heを蒸気として選択的に分離する分溜室と、
前記分溜室で分離された前記3Heを液化して前記高温側流路へ戻す冷却経路と、
を備えることを特徴とする冷凍機。 - ナノサイズの細孔を有する多孔体と、前記多孔体よりも熱伝導率の高い金属微粒子との焼結体であって、
前記細孔の内部には4Heと3Heとが吸着されていることを特徴とする焼結体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018032417 | 2018-02-26 | ||
JP2018032417 | 2018-02-26 | ||
PCT/JP2019/006960 WO2019163978A1 (ja) | 2018-02-26 | 2019-02-25 | 熱交換器、冷凍機および焼結体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019163978A1 true JPWO2019163978A1 (ja) | 2021-01-07 |
JP7128544B2 JP7128544B2 (ja) | 2022-08-31 |
Family
ID=67687265
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020501078A Active JP7128544B2 (ja) | 2018-02-26 | 2019-02-25 | 熱交換器、冷凍機および焼結体 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11796228B2 (ja) |
JP (1) | JP7128544B2 (ja) |
CN (1) | CN111771090A (ja) |
WO (1) | WO2019163978A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3910276A1 (en) | 2020-05-13 | 2021-11-17 | Bluefors Oy | Heat exchanger material and heat exchanger for cryogenic cooling systems, and a system |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11796228B2 (en) * | 2018-02-26 | 2023-10-24 | National University Corporation Tokai National Higher Education And Research System | Heat exchanger, refrigerating machine and sintered body |
WO2021211657A1 (en) | 2020-04-15 | 2021-10-21 | Google Llc | Interleaved cryogenic cooling system for quantum computing applications |
GB2605183B (en) * | 2021-03-25 | 2023-03-29 | Oxford Instruments Nanotechnology Tools Ltd | Heat exchanger for cryogenic cooling apparatus |
WO2024129565A2 (en) * | 2022-12-13 | 2024-06-20 | The Regents Of The University Of California | Microfluidic dilution refrigerator on a chip |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58124196A (ja) * | 1982-01-20 | 1983-07-23 | Mitsubishi Electric Corp | 全熱交換素子 |
JPH01266495A (ja) * | 1988-04-18 | 1989-10-24 | Sekisui Chem Co Ltd | 全熱交換器 |
JPH07260266A (ja) * | 1994-03-24 | 1995-10-13 | Sumitomo Heavy Ind Ltd | 極低温冷凍機 |
JPH08283009A (ja) * | 1995-04-07 | 1996-10-29 | Nippon Steel Corp | ヘリウム3クライオスタット |
JPH10330528A (ja) * | 1997-05-29 | 1998-12-15 | Res Dev Corp Of Japan | 金属・有機ポリマー複合体 |
JP2001118891A (ja) * | 1999-08-10 | 2001-04-27 | Ibiden Co Ltd | ウエハプローバおよびウエハプローバに使用されるセラミック基板 |
JP2002110260A (ja) * | 2000-09-29 | 2002-04-12 | Toyota Central Res & Dev Lab Inc | 光エネルギー変換材料及び光エネルギー変換方法 |
WO2005040067A1 (ja) * | 2003-10-29 | 2005-05-06 | Sumitomo Precision Products Co., Ltd. | カーボンナノチューブ分散複合材料とその製造方法並びにその適用物 |
JP2005139376A (ja) * | 2003-11-10 | 2005-06-02 | Hitachi Ltd | ナノ粒子分散材料、シート、積層体、及びその製造方法 |
JP2005187575A (ja) * | 2003-12-25 | 2005-07-14 | Teijin Ltd | 金属/ポリマー複合多孔材料の製造方法 |
JP2009074774A (ja) * | 2007-09-25 | 2009-04-09 | Kyushu Univ | 無冷媒冷凍機及び機能性熱結合体 |
JP2009198416A (ja) * | 2008-02-25 | 2009-09-03 | Panasonic Corp | 生体物質測定チップ及びそれを用いた発光測定装置 |
JP2012214315A (ja) * | 2011-03-31 | 2012-11-08 | Toho Zinc Co Ltd | 多結晶シリコン焼結体の製造方法 |
WO2014129626A1 (ja) * | 2013-02-22 | 2014-08-28 | 古河電気工業株式会社 | 接続構造体、及び半導体装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1501291A1 (de) * | 1966-12-24 | 1969-12-04 | Max Planck Gesellschaft | Vorrichtung zur Nachfuellung eines Heliumbades bei Temperaturen bis unterhalb des ?-Punktes und Betriebsverfahren hierzu |
US4127424A (en) * | 1976-12-06 | 1978-11-28 | Ses, Incorporated | Photovoltaic cell array |
IL61466A (en) * | 1980-11-12 | 1984-11-30 | Univ Ramot | Heat-exchanger particularly useful for low temperature applications,and method and apparatus for making same |
JP2001513697A (ja) * | 1997-02-24 | 2001-09-04 | スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー | エアロゾル法及び装置、粒子製品、並びに該粒子製品から製造される電子装置 |
JP2002071297A (ja) * | 2000-08-30 | 2002-03-08 | Matsushita Electric Ind Co Ltd | 光触媒熱交換器 |
FR2827854B1 (fr) * | 2001-07-25 | 2003-09-19 | Saint Gobain Rech | Substrat revetu d'un film composite, procede de fabrication et applications |
US7045205B1 (en) * | 2004-02-19 | 2006-05-16 | Nanosolar, Inc. | Device based on coated nanoporous structure |
US8383872B2 (en) * | 2004-11-16 | 2013-02-26 | Velocys, Inc. | Multiphase reaction process using microchannel technology |
JP2006220326A (ja) * | 2005-02-08 | 2006-08-24 | Mitsubishi Electric Corp | 熱交換システム |
US7927406B2 (en) * | 2007-06-01 | 2011-04-19 | Denso Corporation | Water droplet generating system and method for generating water droplet |
US9375710B2 (en) * | 2007-09-19 | 2016-06-28 | General Electric Company | Catalyst and method of manufacture |
TWI353269B (en) * | 2007-12-07 | 2011-12-01 | Nat Univ Tsing Hua | Process for preparing aldehyde or ketone by oxidat |
FR2942622B1 (fr) * | 2009-02-27 | 2011-05-13 | Commissariat Energie Atomique | Procede de preparation de particules de silice poreuses, lesdites particules et leurs utilisations |
KR101155431B1 (ko) * | 2011-03-03 | 2012-06-15 | 주식회사 지오스 | 실리카 에어로겔 분말의 제조방법 |
US20130258595A1 (en) * | 2012-03-27 | 2013-10-03 | Microsoft Corporation | Heat Transfer For Superconducting Integrated Circuits At Millikelvin Temperatures |
JP6011499B2 (ja) * | 2013-09-13 | 2016-10-19 | 株式会社デンソー | 吸着器 |
JP6436557B2 (ja) * | 2013-12-18 | 2018-12-12 | 株式会社デンソー | 吸着式冷凍機 |
KR20160084715A (ko) * | 2015-01-06 | 2016-07-14 | 연세대학교 산학협력단 | 투명전극 및 그의 제조방법 |
US11168276B2 (en) * | 2015-08-28 | 2021-11-09 | Battelle Memorial Institute | Reinforced composites with repellent and slippery properties |
JP6794732B2 (ja) * | 2015-09-28 | 2020-12-02 | 三菱マテリアル株式会社 | 熱電変換モジュール及び熱電変換装置 |
US10590529B2 (en) * | 2015-11-20 | 2020-03-17 | Fourté International, Sdn. Bhd | Metal foams and methods of manufacture |
US20180112928A1 (en) * | 2016-10-25 | 2018-04-26 | Honeywell International Inc. | Ultra-low temperature heat exchangers |
US11796228B2 (en) * | 2018-02-26 | 2023-10-24 | National University Corporation Tokai National Higher Education And Research System | Heat exchanger, refrigerating machine and sintered body |
-
2019
- 2019-02-25 US US16/975,511 patent/US11796228B2/en active Active
- 2019-02-25 WO PCT/JP2019/006960 patent/WO2019163978A1/ja active Application Filing
- 2019-02-25 JP JP2020501078A patent/JP7128544B2/ja active Active
- 2019-02-25 CN CN201980015009.0A patent/CN111771090A/zh active Pending
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58124196A (ja) * | 1982-01-20 | 1983-07-23 | Mitsubishi Electric Corp | 全熱交換素子 |
JPH01266495A (ja) * | 1988-04-18 | 1989-10-24 | Sekisui Chem Co Ltd | 全熱交換器 |
JPH07260266A (ja) * | 1994-03-24 | 1995-10-13 | Sumitomo Heavy Ind Ltd | 極低温冷凍機 |
JPH08283009A (ja) * | 1995-04-07 | 1996-10-29 | Nippon Steel Corp | ヘリウム3クライオスタット |
JPH10330528A (ja) * | 1997-05-29 | 1998-12-15 | Res Dev Corp Of Japan | 金属・有機ポリマー複合体 |
JP2001118891A (ja) * | 1999-08-10 | 2001-04-27 | Ibiden Co Ltd | ウエハプローバおよびウエハプローバに使用されるセラミック基板 |
JP2002110260A (ja) * | 2000-09-29 | 2002-04-12 | Toyota Central Res & Dev Lab Inc | 光エネルギー変換材料及び光エネルギー変換方法 |
WO2005040067A1 (ja) * | 2003-10-29 | 2005-05-06 | Sumitomo Precision Products Co., Ltd. | カーボンナノチューブ分散複合材料とその製造方法並びにその適用物 |
JP2005139376A (ja) * | 2003-11-10 | 2005-06-02 | Hitachi Ltd | ナノ粒子分散材料、シート、積層体、及びその製造方法 |
JP2005187575A (ja) * | 2003-12-25 | 2005-07-14 | Teijin Ltd | 金属/ポリマー複合多孔材料の製造方法 |
JP2009074774A (ja) * | 2007-09-25 | 2009-04-09 | Kyushu Univ | 無冷媒冷凍機及び機能性熱結合体 |
JP2009198416A (ja) * | 2008-02-25 | 2009-09-03 | Panasonic Corp | 生体物質測定チップ及びそれを用いた発光測定装置 |
JP2012214315A (ja) * | 2011-03-31 | 2012-11-08 | Toho Zinc Co Ltd | 多結晶シリコン焼結体の製造方法 |
WO2014129626A1 (ja) * | 2013-02-22 | 2014-08-28 | 古河電気工業株式会社 | 接続構造体、及び半導体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3910276A1 (en) | 2020-05-13 | 2021-11-17 | Bluefors Oy | Heat exchanger material and heat exchanger for cryogenic cooling systems, and a system |
Also Published As
Publication number | Publication date |
---|---|
JP7128544B2 (ja) | 2022-08-31 |
US20210033312A1 (en) | 2021-02-04 |
US11796228B2 (en) | 2023-10-24 |
CN111771090A (zh) | 2020-10-13 |
WO2019163978A1 (ja) | 2019-08-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPWO2019163978A1 (ja) | 熱交換器、冷凍機および焼結体 | |
Frossati | Obtaining ultralow temperatures by dilution of 3He into 4He | |
Pulko et al. | Epoxy-bonded La–Fe–Co–Si magnetocaloric plates | |
Alawi et al. | Fluid flow and heat transfer characteristics of nanofluids in heat pipes: a review | |
JP4950918B2 (ja) | 磁気冷凍装置用磁性材料、熱交換容器および磁気冷凍装置 | |
Chen et al. | Experimental investigation of loop heat pipe with flat evaporator using biporous wick | |
TW201314159A (zh) | 迴路熱管及電子設備 | |
IL49091A (en) | Thermal bearing panel with heat pipe for cooling electronic circuit boards | |
JP2009250810A (ja) | 電子部品の温度制御装置およびハンドラ装置 | |
Zhu et al. | Operation characteristics of a new-type loop heat pipe (LHP) with wick separated from heating surface in the evaporator | |
Choi et al. | Enhanced miniature loop heat pipe cooling system for high power density electronics | |
Lu et al. | Application of Cu-water and Cu-ethanol nanofluids in a small flat capillary pumped loop | |
US20240206131A1 (en) | Cooling apparatus, system and method of manufacture | |
US20050284612A1 (en) | Piezo pumped heat pipe | |
CN112325498B (zh) | 一种稀释制冷系统及方法 | |
Manova et al. | Comparison on the heat transfer performance and entropy analysis on miniature loop thermosyphon with screen mesh wick and metal foam | |
Yun et al. | Vapor chamber with phase change material-based wick | |
Liang et al. | Characterization of freeze-cast micro-channel monoliths as active and passive regenerators | |
JP6459771B2 (ja) | 熱遷移流ヒートポンプ | |
Barreto et al. | 80 K vibration-free cooler for potential future Earth observation missions | |
Kwon et al. | Experimental investigation on acceleration of working fluid of heat pipe under bypass line operation | |
Chen et al. | Heat capacity characterization of a 4 K regenerator with non-rare earth material | |
Bakthavatchalam et al. | Thermoelectric air conditioners for tropical countries | |
US20230329111A1 (en) | Device of Application of a Cold Surface of Thermoelectric Cooling Chip | |
Lertsatitthanakorn et al. | Improvement of cooling performance of a thermoelectric air cooling system using a vapor chamber heat sink |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200720 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210518 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20211130 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20220119 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220726 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220812 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7128544 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |