JPWO2019151188A1 - 導電性接着剤組成物 - Google Patents
導電性接着剤組成物 Download PDFInfo
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- JPWO2019151188A1 JPWO2019151188A1 JP2019569097A JP2019569097A JPWO2019151188A1 JP WO2019151188 A1 JPWO2019151188 A1 JP WO2019151188A1 JP 2019569097 A JP2019569097 A JP 2019569097A JP 2019569097 A JP2019569097 A JP 2019569097A JP WO2019151188 A1 JPWO2019151188 A1 JP WO2019151188A1
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- conductive adhesive
- adhesive composition
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- thermoplastic resin
- resin
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- 239000000853 adhesive Substances 0.000 title claims abstract description 41
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 41
- 239000000203 mixture Substances 0.000 title claims abstract description 37
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 42
- 229920001225 polyester resin Polymers 0.000 claims abstract description 19
- 239000004645 polyester resin Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 19
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 17
- 239000011231 conductive filler Substances 0.000 claims abstract description 15
- 238000002844 melting Methods 0.000 claims abstract description 10
- 230000008018 melting Effects 0.000 claims abstract description 10
- 210000001787 dendrite Anatomy 0.000 claims abstract description 5
- 239000002245 particle Substances 0.000 claims description 50
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 31
- 229910052709 silver Inorganic materials 0.000 claims description 31
- 239000004332 silver Substances 0.000 claims description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- 229920000728 polyester Polymers 0.000 claims description 13
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 9
- 230000009477 glass transition Effects 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010408 film Substances 0.000 description 34
- 239000002313 adhesive film Substances 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 10
- 229920006038 crystalline resin Polymers 0.000 description 7
- -1 polyethylene Polymers 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229920006127 amorphous resin Polymers 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
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- 239000004697 Polyetherimide Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000000113 differential scanning calorimetry Methods 0.000 description 3
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 229920001601 polyetherimide Polymers 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical group C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004128 high performance liquid chromatography Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
Description
・結晶性熱可塑性樹脂1:結晶性ポリエステル、Tm=120℃、Mn=22000
・結晶性熱可塑性樹脂2:結晶性ポリエステル、Tm=95℃、Mn=20000
・非晶性熱可塑性樹脂:非晶性ポリエステル、Tg=65℃、Mn=16000
・カルボキシル基変性ポリエステル樹脂:Tg=15℃、Mn=16000、酸価=18mgKOH/g
・導電性フィラー1:デンドライト形状の銀被覆銅粒子、平均粒子径5μm、銀被覆量10質量%
・導電性フィラー2:球状、銀被覆銅粒子、平均粒子径5μm
・ウレタンビーズ:大日精化工業(株)製「ダイナミックビーズ UCN−5050クリヤー」
・シリカ:富士シリシア化学(株)製「サイロホービック200」
2・・・・サンプル
3・・・・サンプル
10・・・PETフィルム
11・・・両面テープ
12・・・銅箔
13・・・アルミ蒸着フィルム
14・・・導電性接着フィルム
15・・・ガラスエポキシ基板
16・・・アルミ蒸着層
17・・・アルミ蒸着フィルム
18・・・離型フィルム
A,B,C,D・・・電極
Claims (7)
- (A)融点が100℃以上の結晶性熱可塑性樹脂と(B)非晶性熱可塑性樹脂と(C)カルボキシル基変性ポリエステル樹脂とを少なくとも含有する樹脂成分100質量部に対して、デンドライト形状の導電性フィラーを50〜300質量部含有する、導電性接着剤組成物。
- 前記結晶性熱可塑性樹脂(A)が結晶性ポリエステルであり、前記非晶性熱可塑性樹脂(B)が非晶性ポリエステルである、請求項1に記載の導電性接着剤組成物。
- 導電性フィラーが、銅粒子、銀粒子、金粒子、ニッケル粒子、銀被覆銅粒子、銀被覆銅合金粒子、及び銀被覆ニッケル粒子からなる群より選択される1種又は2種以上である、請求項1又は2に記載の導電性接着剤組成物。
- 上記カルボキシル基変性ポリエステル樹脂(C)のガラス転移点が10〜30℃である、請求項1〜3のいずれか1項に記載の導電性接着剤組成物。
- 前記非晶性熱可塑性樹脂(B)のガラス転移点が50〜120℃である、請求項1〜4のいずれか1項に記載の導電性接着剤組成物。
- 前記結晶性熱可塑性樹脂(A)と前記非晶性熱可塑性樹脂(B)との含有割合((A)/(B))が、質量比で60/40〜90/10である、請求項1〜5のいずれか1項に記載の導電性接着剤組成物。
- 樹脂成分100質量部中、前記カルボキシル基変性ポリエステル樹脂(C)の含有量が15〜35質量部である、請求項1〜6のいずれか1項に記載の導電性接着剤組成物。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018014062 | 2018-01-30 | ||
JP2018014062 | 2018-01-30 | ||
PCT/JP2019/002763 WO2019151188A1 (ja) | 2018-01-30 | 2019-01-28 | 導電性接着剤組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019151188A1 true JPWO2019151188A1 (ja) | 2021-02-12 |
JP7225505B2 JP7225505B2 (ja) | 2023-02-21 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019569097A Active JP7225505B2 (ja) | 2018-01-30 | 2019-01-28 | 導電性接着剤組成物 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7225505B2 (ja) |
KR (1) | KR102580259B1 (ja) |
CN (1) | CN111448279B (ja) |
TW (1) | TWI784126B (ja) |
WO (1) | WO2019151188A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW202043407A (zh) * | 2019-03-04 | 2020-12-01 | 日商拓自達電線股份有限公司 | 導電性接著劑組成物 |
JP7513430B2 (ja) * | 2020-06-05 | 2024-07-09 | デクセリアルズ株式会社 | 接合体の製造方法、接合体、及び導電粒子含有ホットメルト接着シート |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03131679A (ja) * | 1989-10-17 | 1991-06-05 | Fujikura Ltd | 導電性接着剤 |
US5837119A (en) * | 1995-03-31 | 1998-11-17 | International Business Machines Corporation | Methods of fabricating dendritic powder materials for high conductivity paste applications |
JPH1112552A (ja) * | 1997-06-25 | 1999-01-19 | Matsushita Electric Ind Co Ltd | 導電性粒子 |
JP2007031602A (ja) * | 2005-07-28 | 2007-02-08 | Mitsubishi Plastics Ind Ltd | 電気資材用接着剤付積層フィルム |
JP2014060025A (ja) * | 2012-09-18 | 2014-04-03 | Dexerials Corp | 異方性導電フィルム、接続方法、及び接合体 |
JP2015521214A (ja) * | 2012-05-04 | 2015-07-27 | テーザ・ソシエタス・ヨーロピア | 三次元の導電性接着フィルム |
EP3236479A1 (en) * | 2016-04-21 | 2017-10-25 | Henkel AG & Co. KGaA | An electrically conductive, hot-melt adhesive or moulding composition |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1277807B1 (en) | 2001-07-18 | 2007-05-02 | Mitsubishi Engineering-Plastics Corporation | Thermoplastic resin composition |
JP4673116B2 (ja) * | 2004-11-01 | 2011-04-20 | タツタ電線株式会社 | 異方導電性接着剤及びこれを用いて形成された電子機器 |
KR101240009B1 (ko) | 2007-09-19 | 2013-03-06 | 히타치가세이가부시끼가이샤 | 접착제 조성물 및 접합체 |
JP2014102943A (ja) | 2012-11-19 | 2014-06-05 | Dexerials Corp | 異方性導電フィルム、接続方法、及び接合体 |
JP6293524B2 (ja) * | 2014-03-11 | 2018-03-14 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法、並びに、接続方法及び接合体 |
JP6271048B2 (ja) * | 2017-01-11 | 2018-01-31 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
-
2019
- 2019-01-28 WO PCT/JP2019/002763 patent/WO2019151188A1/ja active Application Filing
- 2019-01-28 KR KR1020207010207A patent/KR102580259B1/ko active IP Right Grant
- 2019-01-28 JP JP2019569097A patent/JP7225505B2/ja active Active
- 2019-01-28 CN CN201980006537.XA patent/CN111448279B/zh active Active
- 2019-01-29 TW TW108103297A patent/TWI784126B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03131679A (ja) * | 1989-10-17 | 1991-06-05 | Fujikura Ltd | 導電性接着剤 |
US5837119A (en) * | 1995-03-31 | 1998-11-17 | International Business Machines Corporation | Methods of fabricating dendritic powder materials for high conductivity paste applications |
JPH1112552A (ja) * | 1997-06-25 | 1999-01-19 | Matsushita Electric Ind Co Ltd | 導電性粒子 |
JP2007031602A (ja) * | 2005-07-28 | 2007-02-08 | Mitsubishi Plastics Ind Ltd | 電気資材用接着剤付積層フィルム |
JP2015521214A (ja) * | 2012-05-04 | 2015-07-27 | テーザ・ソシエタス・ヨーロピア | 三次元の導電性接着フィルム |
JP2014060025A (ja) * | 2012-09-18 | 2014-04-03 | Dexerials Corp | 異方性導電フィルム、接続方法、及び接合体 |
EP3236479A1 (en) * | 2016-04-21 | 2017-10-25 | Henkel AG & Co. KGaA | An electrically conductive, hot-melt adhesive or moulding composition |
Also Published As
Publication number | Publication date |
---|---|
KR102580259B1 (ko) | 2023-09-19 |
CN111448279A (zh) | 2020-07-24 |
TW201936845A (zh) | 2019-09-16 |
WO2019151188A1 (ja) | 2019-08-08 |
TWI784126B (zh) | 2022-11-21 |
KR20200111667A (ko) | 2020-09-29 |
JP7225505B2 (ja) | 2023-02-21 |
CN111448279B (zh) | 2021-08-10 |
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