JPWO2019147493A5 - - Google Patents

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Publication number
JPWO2019147493A5
JPWO2019147493A5 JP2020562069A JP2020562069A JPWO2019147493A5 JP WO2019147493 A5 JPWO2019147493 A5 JP WO2019147493A5 JP 2020562069 A JP2020562069 A JP 2020562069A JP 2020562069 A JP2020562069 A JP 2020562069A JP WO2019147493 A5 JPWO2019147493 A5 JP WO2019147493A5
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JP
Japan
Prior art keywords
shield
substrate support
sloping
process kit
covering
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JP2020562069A
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English (en)
Japanese (ja)
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JP7466460B2 (ja
JP2021511443A5 (https=
JP2021511443A (ja
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Priority claimed from PCT/US2019/014207 external-priority patent/WO2019147493A1/en
Publication of JP2021511443A publication Critical patent/JP2021511443A/ja
Publication of JPWO2019147493A5 publication Critical patent/JPWO2019147493A5/ja
Publication of JP2021511443A5 publication Critical patent/JP2021511443A5/ja
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Publication of JP7466460B2 publication Critical patent/JP7466460B2/ja
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JP2020562069A 2018-01-29 2019-01-18 Ｐｖｄプロセスにおける粒子低減のためのプロセスキットの形状寸法 Active JP7466460B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862623081P 2018-01-29 2018-01-29
US62/623,081 2018-01-29
PCT/US2019/014207 WO2019147493A1 (en) 2018-01-29 2019-01-18 Process kit geometry for particle reduction in pvd processes

Publications (4)

Publication Number Publication Date
JP2021511443A JP2021511443A (ja) 2021-05-06
JPWO2019147493A5 true JPWO2019147493A5 (https=) 2022-01-26
JP2021511443A5 JP2021511443A5 (https=) 2022-01-26
JP7466460B2 JP7466460B2 (ja) 2024-04-12

Family

ID=67393674

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020562069A Active JP7466460B2 (ja) 2018-01-29 2019-01-18 Ｐｖｄプロセスにおける粒子低減のためのプロセスキットの形状寸法

Country Status (6)

Country Link
US (1) US11935732B2 (https=)
JP (1) JP7466460B2 (https=)
KR (1) KR102717559B1 (https=)
CN (1) CN111602235B (https=)
TW (1) TWI808120B (https=)
WO (1) WO2019147493A1 (https=)

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US20210375650A1 (en) * 2020-06-01 2021-12-02 Applied Materials, Inc. High temperature and vacuum isolation processing mini-environments
US11492697B2 (en) * 2020-06-22 2022-11-08 Applied Materials, Inc. Apparatus for improved anode-cathode ratio for rf chambers
CN112011759B (zh) * 2020-08-24 2022-06-21 宁波中骏森驰汽车零部件股份有限公司 一种pvd真空镀膜机
TWI834028B (zh) * 2021-03-11 2024-03-01 台灣積體電路製造股份有限公司 物理氣相沉積裝置、沉積薄膜的方法和形成半導體結構的方法
CN113445017B (zh) * 2021-06-01 2022-12-09 北京北方华创微电子装备有限公司 半导体腔室及半导体工艺设备
JP2023146567A (ja) * 2022-03-29 2023-10-12 ラピスセミコンダクタ株式会社 基板処理装置及びカバーリングアセンブリ
CN116288182A (zh) * 2022-11-25 2023-06-23 宁波江丰电子材料股份有限公司 一种溅射用防护圈及其应用
CN115747733A (zh) * 2022-11-25 2023-03-07 宁波江丰电子材料股份有限公司 一种溅射用沉积环及其应用
US12392023B1 (en) * 2024-05-03 2025-08-19 Applied Materials, Inc. Methods and apparatus for depositing amorphous indium tin oxide film

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US5846332A (en) * 1996-07-12 1998-12-08 Applied Materials, Inc. Thermally floating pedestal collar in a chemical vapor deposition chamber
US6364949B1 (en) * 1999-10-19 2002-04-02 Applied Materials, Inc. 300 mm CVD chamber design for metal-organic thin film deposition
US6673198B1 (en) * 1999-12-22 2004-01-06 Lam Research Corporation Semiconductor processing equipment having improved process drift control
KR101084553B1 (ko) * 2003-10-17 2011-11-17 토소가부시키가이샤 진공장치용 부품과 그 제조방법 및 그것을 이용한 장치
US20070074741A1 (en) * 2005-09-30 2007-04-05 Tokyo Electron Limited Method for dry cleaning nickel deposits from a processing system
US9127362B2 (en) * 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
JP2007277649A (ja) * 2006-04-07 2007-10-25 Nec Electronics Corp 真空処理装置
US7981262B2 (en) * 2007-01-29 2011-07-19 Applied Materials, Inc. Process kit for substrate processing chamber
US20080257263A1 (en) * 2007-04-23 2008-10-23 Applied Materials, Inc. Cooling shield for substrate processing chamber
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KR200455917Y1 (ko) * 2007-09-28 2011-09-30 어플라이드 머티어리얼스, 인코포레이티드 원자층 증착 챔버 및 부품들
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CN102017077B (zh) * 2008-05-02 2012-09-19 应用材料公司 用于射频物理气相沉积的处理套组
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JP5611350B2 (ja) * 2009-08-11 2014-10-22 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Ｒｆ物理気相堆積用のプロセスキット
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US10546733B2 (en) 2014-12-31 2020-01-28 Applied Materials, Inc. One-piece process kit shield
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US11114289B2 (en) 2016-04-27 2021-09-07 Applied Materials, Inc. Non-disappearing anode for use with dielectric deposition

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