JP2021511443A5 - - Google Patents
Info
- Publication number
- JP2021511443A5 JP2021511443A5 JP2020562069A JP2020562069A JP2021511443A5 JP 2021511443 A5 JP2021511443 A5 JP 2021511443A5 JP 2020562069 A JP2020562069 A JP 2020562069A JP 2020562069 A JP2020562069 A JP 2020562069A JP 2021511443 A5 JP2021511443 A5 JP 2021511443A5
- Authority
- JP
- Japan
- Prior art keywords
- shield
- substrate support
- top surface
- covering
- process kit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862623081P | 2018-01-29 | 2018-01-29 | |
| US62/623,081 | 2018-01-29 | ||
| PCT/US2019/014207 WO2019147493A1 (en) | 2018-01-29 | 2019-01-18 | Process kit geometry for particle reduction in pvd processes |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021511443A JP2021511443A (ja) | 2021-05-06 |
| JP2021511443A5 true JP2021511443A5 (https=) | 2022-01-26 |
| JP7466460B2 JP7466460B2 (ja) | 2024-04-12 |
Family
ID=67393674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020562069A Active JP7466460B2 (ja) | 2018-01-29 | 2019-01-18 | Pvdプロセスにおける粒子低減のためのプロセスキットの形状寸法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11935732B2 (https=) |
| JP (1) | JP7466460B2 (https=) |
| KR (1) | KR102717559B1 (https=) |
| CN (1) | CN111602235B (https=) |
| TW (1) | TWI808120B (https=) |
| WO (1) | WO2019147493A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210375650A1 (en) * | 2020-06-01 | 2021-12-02 | Applied Materials, Inc. | High temperature and vacuum isolation processing mini-environments |
| US11492697B2 (en) * | 2020-06-22 | 2022-11-08 | Applied Materials, Inc. | Apparatus for improved anode-cathode ratio for rf chambers |
| CN112011759B (zh) * | 2020-08-24 | 2022-06-21 | 宁波中骏森驰汽车零部件股份有限公司 | 一种pvd真空镀膜机 |
| TWI834028B (zh) * | 2021-03-11 | 2024-03-01 | 台灣積體電路製造股份有限公司 | 物理氣相沉積裝置、沉積薄膜的方法和形成半導體結構的方法 |
| CN113445017B (zh) * | 2021-06-01 | 2022-12-09 | 北京北方华创微电子装备有限公司 | 半导体腔室及半导体工艺设备 |
| JP2023146567A (ja) * | 2022-03-29 | 2023-10-12 | ラピスセミコンダクタ株式会社 | 基板処理装置及びカバーリングアセンブリ |
| CN116288182A (zh) * | 2022-11-25 | 2023-06-23 | 宁波江丰电子材料股份有限公司 | 一种溅射用防护圈及其应用 |
| CN115747733A (zh) * | 2022-11-25 | 2023-03-07 | 宁波江丰电子材料股份有限公司 | 一种溅射用沉积环及其应用 |
| US12392023B1 (en) * | 2024-05-03 | 2025-08-19 | Applied Materials, Inc. | Methods and apparatus for depositing amorphous indium tin oxide film |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5846332A (en) * | 1996-07-12 | 1998-12-08 | Applied Materials, Inc. | Thermally floating pedestal collar in a chemical vapor deposition chamber |
| US6364949B1 (en) * | 1999-10-19 | 2002-04-02 | Applied Materials, Inc. | 300 mm CVD chamber design for metal-organic thin film deposition |
| US6673198B1 (en) | 1999-12-22 | 2004-01-06 | Lam Research Corporation | Semiconductor processing equipment having improved process drift control |
| EP1524682B1 (en) * | 2003-10-17 | 2011-10-05 | Tosoh Corporation | Component for vacuum apparatus, production method thereof and apparatus using the same |
| US20070074741A1 (en) * | 2005-09-30 | 2007-04-05 | Tokyo Electron Limited | Method for dry cleaning nickel deposits from a processing system |
| US9127362B2 (en) * | 2005-10-31 | 2015-09-08 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
| JP2007277649A (ja) * | 2006-04-07 | 2007-10-25 | Nec Electronics Corp | 真空処理装置 |
| US7981262B2 (en) * | 2007-01-29 | 2011-07-19 | Applied Materials, Inc. | Process kit for substrate processing chamber |
| US20080257263A1 (en) * | 2007-04-23 | 2008-10-23 | Applied Materials, Inc. | Cooling shield for substrate processing chamber |
| US8435379B2 (en) | 2007-05-08 | 2013-05-07 | Applied Materials, Inc. | Substrate cleaning chamber and cleaning and conditioning methods |
| KR200455917Y1 (ko) * | 2007-09-28 | 2011-09-30 | 어플라이드 머티어리얼스, 인코포레이티드 | 원자층 증착 챔버 및 부품들 |
| JP5916384B2 (ja) | 2008-04-16 | 2016-05-11 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | ウェハ処理堆積物遮蔽構成材 |
| US9123511B2 (en) * | 2008-05-02 | 2015-09-01 | Applied Materials, Inc. | Process kit for RF physical vapor deposition |
| WO2010013476A1 (ja) | 2008-07-31 | 2010-02-04 | キヤノンアネルバ株式会社 | プラズマ処理装置および電子デバイスの製造方法 |
| US20110036709A1 (en) * | 2009-08-11 | 2011-02-17 | Applied Materials, Inc. | Process kit for rf physical vapor deposition |
| US9834840B2 (en) | 2010-05-14 | 2017-12-05 | Applied Materials, Inc. | Process kit shield for improved particle reduction |
| US8647485B2 (en) | 2012-03-30 | 2014-02-11 | Applied Materials, Inc. | Process kit shield for plasma enhanced processing chamber |
| US20130277203A1 (en) | 2012-04-24 | 2013-10-24 | Applied Materials, Inc. | Process kit shield and physical vapor deposition chamber having same |
| JP6388876B2 (ja) * | 2013-01-16 | 2018-09-12 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 石英の上部ドーム及び下部ドーム |
| WO2015026491A1 (en) * | 2013-08-19 | 2015-02-26 | Applied Materials, Inc. | Apparatus for impurity layered epitaxy |
| US10546733B2 (en) | 2014-12-31 | 2020-01-28 | Applied Materials, Inc. | One-piece process kit shield |
| US9953812B2 (en) * | 2015-10-06 | 2018-04-24 | Applied Materials, Inc. | Integrated process kit for a substrate processing chamber |
| JP2018535324A (ja) | 2015-11-24 | 2018-11-29 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Vhf−rf pvdチャンバで使用するためのプレコートされたシールド |
| US11114289B2 (en) * | 2016-04-27 | 2021-09-07 | Applied Materials, Inc. | Non-disappearing anode for use with dielectric deposition |
-
2019
- 2019-01-18 CN CN201980008457.8A patent/CN111602235B/zh active Active
- 2019-01-18 US US16/251,716 patent/US11935732B2/en active Active
- 2019-01-18 KR KR1020207024374A patent/KR102717559B1/ko active Active
- 2019-01-18 WO PCT/US2019/014207 patent/WO2019147493A1/en not_active Ceased
- 2019-01-18 JP JP2020562069A patent/JP7466460B2/ja active Active
- 2019-01-28 TW TW108103042A patent/TWI808120B/zh active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2021511443A5 (https=) | ||
| JP2011520034A5 (https=) | ||
| US11049761B2 (en) | Shutter disk for physical vapor deposition chamber | |
| TWD210892S (zh) | 用於基板處理腔室的沉積環 | |
| JP2014070249A5 (https=) | ||
| CN107112189A (zh) | 高传导处理配件 | |
| WO2011143527A3 (en) | Process kit shield for improved particle reduction | |
| JP2016219803A5 (https=) | ||
| TWM575910U (zh) | 用於多陰極處理腔室的處理套組 | |
| JP2016517167A5 (https=) | ||
| WO2009154853A3 (en) | Wafer processing deposition shielding components | |
| EP1154040A3 (en) | Reduction of plasma edge effect on plasma enhanced CVD processes | |
| TW201601245A (zh) | 舉升銷組件 | |
| TWI839941B (zh) | 半導體腔室 | |
| TW201307596A (zh) | 鍍膜裝置 | |
| JP2021511443A (ja) | Pvdプロセスにおける粒子低減のためのプロセスキットの形状寸法 | |
| JP7345625B2 (ja) | エピタキシチャンバのための熱シールドアセンブリ | |
| JP2014109274A5 (https=) | ||
| TW201615887A (zh) | 電漿體加工設備 | |
| TW201606844A (zh) | 擋板及包含該擋板之基板處理裝置 | |
| JPH11310875A (ja) | 基板の被覆のための装置 | |
| US20080264340A1 (en) | Moving interleaved sputter chamber shields | |
| TWI616550B (zh) | 用於物理氣相沉積之濺射系統的靶材 | |
| US9799497B2 (en) | Patterned processing kits for material processing | |
| JP2016530911A5 (https=) |