JP2021511443A5 - - Google Patents
Info
- Publication number
- JP2021511443A5 JP2021511443A5 JP2020562069A JP2020562069A JP2021511443A5 JP 2021511443 A5 JP2021511443 A5 JP 2021511443A5 JP 2020562069 A JP2020562069 A JP 2020562069A JP 2020562069 A JP2020562069 A JP 2020562069A JP 2021511443 A5 JP2021511443 A5 JP 2021511443A5
- Authority
- JP
- Japan
- Prior art keywords
- shield
- substrate support
- top surface
- covering
- process kit
- Prior art date
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862623081P | 2018-01-29 | 2018-01-29 | |
| US62/623,081 | 2018-01-29 | ||
| PCT/US2019/014207 WO2019147493A1 (en) | 2018-01-29 | 2019-01-18 | Process kit geometry for particle reduction in pvd processes |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2021511443A JP2021511443A (ja) | 2021-05-06 |
| JPWO2019147493A5 JPWO2019147493A5 (https=) | 2022-01-26 |
| JP2021511443A5 true JP2021511443A5 (https=) | 2022-01-26 |
| JP7466460B2 JP7466460B2 (ja) | 2024-04-12 |
Family
ID=67393674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020562069A Active JP7466460B2 (ja) | 2018-01-29 | 2019-01-18 | Ｐｖｄプロセスにおける粒子低減のためのプロセスキットの形状寸法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11935732B2 (https=) |
| JP (1) | JP7466460B2 (https=) |
| KR (1) | KR102717559B1 (https=) |
| CN (1) | CN111602235B (https=) |
| TW (1) | TWI808120B (https=) |
| WO (1) | WO2019147493A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210375650A1 (en) * | 2020-06-01 | 2021-12-02 | Applied Materials, Inc. | High temperature and vacuum isolation processing mini-environments |
| US11492697B2 (en) * | 2020-06-22 | 2022-11-08 | Applied Materials, Inc. | Apparatus for improved anode-cathode ratio for rf chambers |
| CN112011759B (zh) * | 2020-08-24 | 2022-06-21 | 宁波中骏森驰汽车零部件股份有限公司 | 一种pvd真空镀膜机 |
| TWI834028B (zh) * | 2021-03-11 | 2024-03-01 | 台灣積體電路製造股份有限公司 | 物理氣相沉積裝置、沉積薄膜的方法和形成半導體結構的方法 |
| CN113445017B (zh) * | 2021-06-01 | 2022-12-09 | 北京北方华创微电子装备有限公司 | 半导体腔室及半导体工艺设备 |
| JP2023146567A (ja) * | 2022-03-29 | 2023-10-12 | ラピスセミコンダクタ株式会社 | 基板処理装置及びカバーリングアセンブリ |
| CN116288182A (zh) * | 2022-11-25 | 2023-06-23 | 宁波江丰电子材料股份有限公司 | 一种溅射用防护圈及其应用 |
| CN115747733A (zh) * | 2022-11-25 | 2023-03-07 | 宁波江丰电子材料股份有限公司 | 一种溅射用沉积环及其应用 |
| US12392023B1 (en) * | 2024-05-03 | 2025-08-19 | Applied Materials, Inc. | Methods and apparatus for depositing amorphous indium tin oxide film |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5846332A (en) * | 1996-07-12 | 1998-12-08 | Applied Materials, Inc. | Thermally floating pedestal collar in a chemical vapor deposition chamber |
| US6364949B1 (en) * | 1999-10-19 | 2002-04-02 | Applied Materials, Inc. | 300 mm CVD chamber design for metal-organic thin film deposition |
| US6673198B1 (en) * | 1999-12-22 | 2004-01-06 | Lam Research Corporation | Semiconductor processing equipment having improved process drift control |
| KR101084553B1 (ko) * | 2003-10-17 | 2011-11-17 | 토소가부시키가이샤 | 진공장치용 부품과 그 제조방법 및 그것을 이용한 장치 |
| US20070074741A1 (en) * | 2005-09-30 | 2007-04-05 | Tokyo Electron Limited | Method for dry cleaning nickel deposits from a processing system |
| US9127362B2 (en) * | 2005-10-31 | 2015-09-08 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
| JP2007277649A (ja) * | 2006-04-07 | 2007-10-25 | Nec Electronics Corp | 真空処理装置 |
| US7981262B2 (en) * | 2007-01-29 | 2011-07-19 | Applied Materials, Inc. | Process kit for substrate processing chamber |
| US20080257263A1 (en) * | 2007-04-23 | 2008-10-23 | Applied Materials, Inc. | Cooling shield for substrate processing chamber |
| US8435379B2 (en) | 2007-05-08 | 2013-05-07 | Applied Materials, Inc. | Substrate cleaning chamber and cleaning and conditioning methods |
| KR200455917Y1 (ko) * | 2007-09-28 | 2011-09-30 | 어플라이드 머티어리얼스, 인코포레이티드 | 원자층 증착 챔버 및 부품들 |
| CN102007572B (zh) * | 2008-04-16 | 2013-01-16 | 应用材料公司 | 晶圆处理沉积屏蔽构件 |
| CN102017077B (zh) * | 2008-05-02 | 2012-09-19 | 应用材料公司 | 用于射频物理气相沉积的处理套组 |
| WO2010013476A1 (ja) | 2008-07-31 | 2010-02-04 | キヤノンアネルバ株式会社 | プラズマ処理装置および電子デバイスの製造方法 |
| JP5611350B2 (ja) * | 2009-08-11 | 2014-10-22 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Ｒｆ物理気相堆積用のプロセスキット |
| US9834840B2 (en) | 2010-05-14 | 2017-12-05 | Applied Materials, Inc. | Process kit shield for improved particle reduction |
| US8647485B2 (en) | 2012-03-30 | 2014-02-11 | Applied Materials, Inc. | Process kit shield for plasma enhanced processing chamber |
| US20130277203A1 (en) * | 2012-04-24 | 2013-10-24 | Applied Materials, Inc. | Process kit shield and physical vapor deposition chamber having same |
| US9768043B2 (en) * | 2013-01-16 | 2017-09-19 | Applied Materials, Inc. | Quartz upper and lower domes |
| WO2015026491A1 (en) * | 2013-08-19 | 2015-02-26 | Applied Materials, Inc. | Apparatus for impurity layered epitaxy |
| US10546733B2 (en) | 2014-12-31 | 2020-01-28 | Applied Materials, Inc. | One-piece process kit shield |
| US9953812B2 (en) | 2015-10-06 | 2018-04-24 | Applied Materials, Inc. | Integrated process kit for a substrate processing chamber |
| SG11201804420UA (en) | 2015-11-24 | 2018-06-28 | Applied Materials Inc | Pre-coated shield for use in vhf-rf pvd chambers |
| US11114289B2 (en) | 2016-04-27 | 2021-09-07 | Applied Materials, Inc. | Non-disappearing anode for use with dielectric deposition |
-
2019
- 2019-01-18 CN CN201980008457.8A patent/CN111602235B/zh active Active
- 2019-01-18 US US16/251,716 patent/US11935732B2/en active Active
- 2019-01-18 JP JP2020562069A patent/JP7466460B2/ja active Active
- 2019-01-18 KR KR1020207024374A patent/KR102717559B1/ko active Active
- 2019-01-18 WO PCT/US2019/014207 patent/WO2019147493A1/en not_active Ceased
- 2019-01-28 TW TW108103042A patent/TWI808120B/zh active
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