JPWO2019044448A1 - 金属アルコキシド化合物、薄膜形成用原料及び薄膜の製造方法 - Google Patents
金属アルコキシド化合物、薄膜形成用原料及び薄膜の製造方法 Download PDFInfo
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- JPWO2019044448A1 JPWO2019044448A1 JP2019539151A JP2019539151A JPWO2019044448A1 JP WO2019044448 A1 JPWO2019044448 A1 JP WO2019044448A1 JP 2019539151 A JP2019539151 A JP 2019539151A JP 2019539151 A JP2019539151 A JP 2019539151A JP WO2019044448 A1 JPWO2019044448 A1 JP WO2019044448A1
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- 239000010409 thin film Substances 0.000 title claims abstract description 166
- 239000002994 raw material Substances 0.000 title claims abstract description 97
- -1 alkoxide compound Chemical class 0.000 title claims abstract description 72
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 66
- 239000002184 metal Substances 0.000 title claims abstract description 66
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- 125000004429 atom Chemical group 0.000 claims abstract description 22
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- 125000000217 alkyl group Chemical group 0.000 claims abstract description 16
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims abstract description 16
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 16
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract description 16
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical group [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 16
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical group [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims abstract description 16
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 claims abstract description 14
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- KJZYNXUDTRRSPN-UHFFFAOYSA-N holmium atom Chemical group [Ho] KJZYNXUDTRRSPN-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000001257 hydrogen Substances 0.000 claims abstract description 10
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- 125000003538 pentan-3-yl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])[H] 0.000 claims abstract description 9
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- 229910052773 Promethium Inorganic materials 0.000 claims abstract description 8
- 229910052772 Samarium Inorganic materials 0.000 claims abstract description 8
- 229910052771 Terbium Inorganic materials 0.000 claims abstract description 8
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- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims abstract description 8
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- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical group [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 claims abstract description 8
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- 239000012298 atmosphere Substances 0.000 claims description 6
- 125000003548 sec-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 6
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- 238000012545 processing Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 76
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- 239000002243 precursor Substances 0.000 description 39
- 238000000231 atomic layer deposition Methods 0.000 description 35
- 238000006243 chemical reaction Methods 0.000 description 27
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 24
- 238000005229 chemical vapour deposition Methods 0.000 description 22
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 20
- 229910052799 carbon Inorganic materials 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 19
- 239000000203 mixture Substances 0.000 description 18
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- 239000010703 silicon Substances 0.000 description 17
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 15
- 229910003443 lutetium oxide Inorganic materials 0.000 description 15
- MPARYNQUYZOBJM-UHFFFAOYSA-N oxo(oxolutetiooxy)lutetium Chemical compound O=[Lu]O[Lu]=O MPARYNQUYZOBJM-UHFFFAOYSA-N 0.000 description 15
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 15
- 239000000463 material Substances 0.000 description 13
- 229910052786 argon Inorganic materials 0.000 description 12
- 239000003921 oil Substances 0.000 description 12
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 11
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- 238000010926 purge Methods 0.000 description 11
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- 229910044991 metal oxide Inorganic materials 0.000 description 10
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- 238000000746 purification Methods 0.000 description 10
- 230000009467 reduction Effects 0.000 description 10
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- 238000004458 analytical method Methods 0.000 description 8
- 238000000921 elemental analysis Methods 0.000 description 8
- 230000001590 oxidative effect Effects 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- 239000000725 suspension Substances 0.000 description 8
- 150000003613 toluenes Chemical class 0.000 description 8
- 239000006227 byproduct Substances 0.000 description 7
- 230000008021 deposition Effects 0.000 description 7
- 239000012535 impurity Substances 0.000 description 7
- 239000012434 nucleophilic reagent Substances 0.000 description 7
- 229910003440 dysprosium oxide Inorganic materials 0.000 description 6
- NLQFUUYNQFMIJW-UHFFFAOYSA-N dysprosium(iii) oxide Chemical compound O=[Dy]O[Dy]=O NLQFUUYNQFMIJW-UHFFFAOYSA-N 0.000 description 6
- FJKOWAMSBRKNAM-UHFFFAOYSA-N 1-(dimethylamino)-3,3-dimethylbutan-2-ol Chemical compound CN(C)CC(O)C(C)(C)C FJKOWAMSBRKNAM-UHFFFAOYSA-N 0.000 description 5
- 238000005160 1H NMR spectroscopy Methods 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 239000013110 organic ligand Substances 0.000 description 5
- UZLYXNNZYFBAQO-UHFFFAOYSA-N oxygen(2-);ytterbium(3+) Chemical compound [O-2].[O-2].[O-2].[Yb+3].[Yb+3] UZLYXNNZYFBAQO-UHFFFAOYSA-N 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 229910003454 ytterbium oxide Inorganic materials 0.000 description 5
- 229940075624 ytterbium oxide Drugs 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
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- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 4
- 229910052783 alkali metal Inorganic materials 0.000 description 4
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical class C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
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- 150000002367 halogens Chemical group 0.000 description 4
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- OWCYYNSBGXMRQN-UHFFFAOYSA-N holmium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ho+3].[Ho+3] OWCYYNSBGXMRQN-UHFFFAOYSA-N 0.000 description 4
- 229910017053 inorganic salt Inorganic materials 0.000 description 4
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- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
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- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 3
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- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 2
- 239000003446 ligand Substances 0.000 description 2
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- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
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- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic System
- C07F5/003—Compounds containing elements of Groups 3 or 13 of the Periodic System without C-Metal linkages
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic System
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C215/00—Compounds containing amino and hydroxy groups bound to the same carbon skeleton
- C07C215/02—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton
- C07C215/04—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being saturated
- C07C215/06—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being saturated and acyclic
- C07C215/08—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being saturated and acyclic with only one hydroxy group and one amino group bound to the carbon skeleton
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/405—Oxides of refractory metals or yttrium
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
Abstract
Description
したがって、本発明の目的は、蒸気圧が高く、融点が低く、CVD法用の薄膜形成用原料として特に適した金属アルコキシド化合物、該化合物を含有してなる薄膜形成用原料および該薄膜形成用原料を用いた金属含有薄膜の製造方法を提供することにある。
すなわち、本発明は、下記一般式(1)で表される金属アルコキシド化合物、これを含有してなる薄膜形成用原料、および該原料を用いて金属含有薄膜を形成する薄膜の製造方法を提供することにある:
、ジエチレントリアミン、トリエチレンテトラミン、テトラエチレンペンタミン、ペンタエチレンヘキサミン、1,1,4,7,7−ペンタメチルジエチレントリアミン、1,1,4,7,10,10−ヘキサメチルトリエチレンテトラミン、トリエトキシトリエチレンアミン等のポリアミン類、サイクラム、サイクレン等の環状ポリアミン類、ピリジン、ピロリジン、ピペリジン、モルホリン、N−メチルピロリジン、N−メチルピペリジン、N−メチルモルホリン、テトラヒドロフラン、テトラヒドロピラン、1,4−ジオキサン、オキサゾール、チアゾール、オキサチオラン等の複素環化合物類、アセト酢酸メチル、アセト酢酸エチル、アセト酢酸−2−メトキシエチル等のβ−ケトエステル類又はアセチルアセトン、2,4−ヘキサンジオン、2,4−ヘプタンジオン、3,5−ヘプタンジオン、ジピバロイルメタン等のβ−ジケトン類が挙げられ、これら求核性試薬の使用量は、プレカーサ全体の量1モルに対して0.1モル〜10モルの範囲が好ましく、より好ましくは1〜4モルである。
また、堆積速度は、原料の供給条件(気化温度、気化圧力)、反応温度、反応圧力によりコントロールすることができる。堆積速度は、大きいと得られる薄膜の特性が悪化する場合があり、小さいと生産性に問題を生じる場合があるので、0.01nm/分〜100nm/分が好ましく、1nm/分〜50nm/分がより好ましい。また、ALD法の場合は、所望の膜厚が得られるようにサイクルの回数でコントロールされる。
[実施例1]化合物No.12の合成
反応フラスコに、イットリウム−トリス−トリメチルシリルアミド2.2gと、脱水トルエン33gを加え、十分に混合した。得られた懸濁液に室温(20℃)にて、1−エチルメチルアミノ−3−メチルブタン−2−オール3.4gを滴下した。室温にて19時間撹拌後、減圧下オイルバス111℃にて脱溶媒を実施した。生成したイットリウム錯体(橙色粘性液体)をフラスコに入れ、クーゲルロール精製装置に接続し、加熱温度260℃、15Paにて蒸留を行い、淡黄色粘性液体1.2gを得た。
(1)常圧TG−DTA
質量50%減少温度:328℃(Ar流量:100ml/分、昇温10℃/分)
(2)減圧TG−DTA
質量50%減少温度:254℃(Ar流量:50ml/分、昇温10℃/分)
(3)1H−NMR(重ベンゼン)
0.82−1.44ppm(10H、multiplet)、1.85−2.68(7H、broad)、3.10−4.30ppm(1H,broad)
(4)元素分析(理論値)
C:54.6%(55.26%)、H:10.2%(10.44%)、Y:16.4%(17.04%)、N:8.9%(8.06%)、O:9.3%(9.20%)
反応フラスコに、イットリウム−トリス−トリメチルシリルアミド2.2gと、脱水トルエン20gを加え、十分に混合した。得られた懸濁液に室温(20℃)にて、1−ジメチルアミノ−3,3−ジメチルブタン−2−オール1.7gを滴下した。オイルバス90℃にて8時間加熱撹拌後、減圧下オイルバス110℃にて脱溶媒を実施した。生成したイットリウム錯体(白色固体)をフラスコに入れ、クーゲルロール精製装置に接続し、加熱温度195℃、30Paにて蒸留を行い、無色透明粘性液体1.0gを得た。
(1)常圧TG−DTA
質量50%減少温度:308℃(Ar流量:100ml/分、昇温10℃/分)
(2)減圧TG−DTA
質量50%減少温度:220℃(Ar流量:50ml/分、昇温10℃/分)
(3)1H−NMR(重ベンゼン)
1.00−1.25ppm(9H、multiplet)、1.90−2.75(8H、broad)、3.00−4.40ppm(1H,broad)
(4)元素分析(理論値)
C:55.3%(55.26%)、H:10.1%(10.44%)、Y:16.5%(17.04%)、N:8.7%(8.06%)、O:9.0%(9.20%)
反応フラスコに、イットリウム−トリス−トリメチルシリルアミド2.0gと、脱水トルエン20gを加え、十分に混合した。得られた懸濁液に室温(20℃)にて、1−エチルメチルアミノ−3,3−ジメチルブタン−2−オール1.7gを滴下した。オイルバス80〜90℃にて12時間加熱撹拌後、減圧下オイルバス110℃にて脱溶媒を実施した。生成したイットリウム錯体(白色固体)をフラスコに入れ、クーゲルロール精製装置に接続し、加熱温度195℃、30Paにて蒸留を行い、無色透明粘性液体1.0gを得た。
(1)常圧TG−DTA
質量50%減少温度:320℃(Ar流量:100ml/分、昇温10℃/分)
(2)減圧TG−DTA
質量50%減少温度:239℃(Ar流量:50ml/分、昇温10℃/分)
(3)1H−NMR(重ベンゼン)
1.00−1.25ppm(12H、multiplet)、2.20−3.30(7H、multiplet)、3.70−4.10ppm(1H,broad)
(4)元素分析(理論値)
C:56.2%(57.53%)、H:10.0%(10.73%)、Y:16.2%(15.77%)、N:7.7%(7.45%)、O:9.0%(8.51%)
反応フラスコに、イッテルビウム−トリス−トリメチルシリルアミド43.35gと、脱水トルエン363.43gを加え、十分に混合した。得られた懸濁液に室温(20℃)にて、1−ジメチルアミノ−3,3−ジメチルブタン−2−オール40.16gを滴下した。室温にて18時間撹拌後、減圧下オイルバス111℃にて脱溶媒を実施した。生成したイッテルビウム錯体(淡黄色固体)をフラスコに入れ、蒸留精製装置に接続し、リボンヒータでオイルバス非加熱部分から回収用フラスコの上部まで覆った。オイルバス178℃リボンヒータ162℃、12Paにて蒸留を行い、淡黄色固体27gを得た。得られた淡黄色固体の融点は56℃であった。
(1)常圧TG−DTA
質量50%減少温度:275℃(Ar流量:100ml/分、昇温10℃/分)
(2)減圧TG−DTA
質量50%減少温度:193℃(Ar流量:50ml/分、昇温10℃/分)
(3)元素分析(理論値)
C:46.2%(47.59%)、H:9.1%(8.99%)、Yb:29.2%(28.57%)、N:6.9%(6.94%)、O:7.6%(7.92%)
反応フラスコに、ルテチウム−トリス−トリメチルシリルアミド2.2gと、脱水トルエン20gを加え、十分に混合した。得られた懸濁液に室温(20℃)にて、1−ジメチルアミノ−3,3−ジメチルブタン−2−オール3.2gを滴下した。終夜撹拌後、減圧下オイルバス90℃にて脱溶媒を実施した。生成したルテチウム錯体(白色粘性液体)をクーゲルロール精製装置に入れ、精製を行った。装置加熱温度190℃、12Paにて精製を行い、白色固体1.4gを得た。得られた白色固体の融点は127℃であった。
(1)常圧TG−DTA
質量50%減少温度:282℃(Ar流量:100ml/分、昇温10℃/分)
(2)減圧TG−DTA
質量50%減少温度:202℃(Ar流量:50ml/分、昇温10℃/分)
(3)1H−NMR(重ベンゼン)
0.91−1.31 ppm(9H、broad)、2.02−2.69(8H、broad)、3.35−3.78ppm(1H,broad)
(4)元素分析(理論値)
C:47.2%(47.44%)、H:8.4%(8.96%)、Lu:27.9%(28.79%)、N:7.2%(6.91%)、O:7.5%(7.90%)
反応フラスコに、ルテチウム−トリス−トリメチルシリルアミド2.0gと、脱水トルエン28gを加え、十分に混合した。得られた懸濁液に室温(20℃)にて、1−エチルメチルアミノ−3,3−ジメチルブタン−2−オール3.2gを滴下した。終夜撹拌後、減圧下オイルバス110℃にて脱溶媒を実施した。生成したルテチウム錯体(白濁色粘性液体)をクーゲルロール精製装置に入れ、精製を行った。装置加熱温度210℃、11Paにて精製を行い、高粘性白色液体を0.40g得た。
(1)常圧TG−DTA
質量50%減少温度:305℃(Ar流量:100ml/分、昇温10℃/分)
(2)減圧TG−DTA
質量50%減少温度:232℃(Ar流量:50ml/分、昇温10℃/分)
(3)1H−NMR(重ベンゼン)
0.78−1.27ppm(12H、multiplet)、2.08−3.40ppm(7H、broad)、3.70−4.20ppm(1H,broad)
(4)元素分析(理論値)
C:48.7%(49.91%)、H:9.1%(9.31%)、Lu:26.7%(26.93%)、N:6.4%(6.47%)、O:7.2%(7.39%)
反応フラスコに、ジスプロシウム−トリス−トリメチルシリルアミド2.2gと、脱水トルエン29gを加え、十分に混合した。得られた懸濁液に室温(20℃)にて、1−ジメチルアミノ−3,3−ジメチルブタン−2−オール2.0gを滴下した。室温にて24時間攪拌後、減圧下オイルバス110℃にて脱溶媒を実施した。生成したジスプロシウム錯体(淡黄色固体)をフラスコに入れ、クーゲルロール精製装置に接続し、加熱温度170℃、35Paにて蒸留を行い、白色固体0.10gを得た。
(1)常圧TG−DTA
質量50%減少温度:294℃(Ar流量:100ml/分、昇温10℃/分)
(2)減圧TG−DTA
質量50%減少温度:205℃(Ar流量:50ml/分、昇温10℃/分)
(3)元素分析(理論値)
C:48.2%(48.43%)、H:9.3%(9.14%)、Dy:27.0%(27.30%)、N:7.4%(7.06%)、O:8.2%(8.06%)
反応フラスコに、ホルミウム−トリス−トリメチルシリルアミド0.55gと、脱水トルエン4.7gを加え、十分に混合した。得られた懸濁液に室温(20℃)にて、1−ジメチルアミノ−3,3−ジメチルブタン−2−オール0.49gを滴下した。室温にて18時間攪拌後、減圧下オイルバス100℃にて脱溶媒を実施した。生成したホルミウム錯体(黄色固体)をフラスコに入れ、クーゲルロール精製装置に接続し、加熱温度170℃、54Paにて蒸留を行い、白色固体を得た。
(1)常圧TG−DTA
質量50%減少温度:306℃(Ar流量:100ml/分、昇温10℃/分)
(2)減圧TG−DTA
質量50%減少温度:219℃(Ar流量:50ml/分、昇温10℃/分)
(3)元素分析(理論値)
C:48.1%(48.23%)、H:9.5%(9.11%)、Ho:27.2%(27.60%)、N:6.8%(7.03%)、O:7.7%(8.03%)
実施例1〜8で得られた本発明の金属アルコキシド化合物No.12、15、16、187、195、196、139および147並びに下記の比較化合物1、2及び3について、TG−DTA測定装置を用いて、減圧雰囲気下(10torr)での加熱によってサンプル重量が50質量%減少した時点の温度(L)を確認した。Lが低いものは蒸気圧が高いことから好ましいと判断することができる。結果を表1に示す。
化合物No.12を原子層堆積法用原料とし、図1に示す装置を用いて以下の条件のALD法により、シリコンウエハ上に酸化イットリウム薄膜を製造した。
得られた薄膜をX線光電子分光法により薄膜組成の確認したところ、得られた薄膜は酸化イットリウム(Y:O=2:3)であり、残留炭素含有量は1.0atom%よりも少なかった。また、X線反射率法による膜厚測定を行い、その平均値を算出したところ、膜厚は平均35nmであり、1サイクル当たりに得られる膜厚は平均0.07nmであった。
基板:シリコンウェハ
反応温度(シリコンウエハ温度):250℃
反応性ガス:H2O
下記(1)〜(4)からなる一連の工程を1サイクルとして、500サイクル繰り返した:;
(1)原料容器温度:130℃、原料容器内圧力:100Paの条件で気化させた原子層堆積法用原料を成膜チャンバーに導入し、系圧力:100Paで30秒間堆積させる;
(2)15秒間のアルゴンパージにより、堆積しなかった原料を除去する;
(3)反応性ガスを成膜チャンバーに導入し、系圧力:100Paで0.2秒間反応させる;
(4)15秒間のアルゴンパージにより、未反応の第一の反応性ガス及び副生ガスを除去する。
原子層堆積法用原料として化合物No.15を用いたこと以外は実施例7と同様の条件で酸化イットリウム薄膜を製造した。得られた薄膜をX線光電子分光法により薄膜組成の確認したところ、得られた薄膜は酸化イットリウム(Y:O=2:3)であり、残留炭素含有量は1.0atom%よりも少なかった。また、X線反射率法による膜厚測定を行い、その平均値を算出したところ、膜厚は平均40nmであり、1サイクル当たりに得られる膜厚は平均0.08nmであった。
原子層堆積法用原料として化合物No.16を用いたこと以外は実施例7と同様の条件で酸化イットリウム薄膜を製造した。得られた薄膜をX線光電子分光法により薄膜組成の確認したところ、得られた薄膜は酸化イットリウム(Y:O=2:3)であり、残留炭素含有量は1.0atom%よりも少なかった。また、X線反射率法による膜厚測定を行い、その平均値を算出したところ、膜厚は平均35nmであり、1サイクル当たりに得られる膜厚は平均0.07nmであった。
原子層堆積法用原料として比較化合物1を用いたこと以外は実施例7と同様の条件で酸化イットリウム薄膜を製造した。得られた薄膜をX線光電子分光法により薄膜組成の確認したところ、得られた薄膜は酸化イットリウム(Y:O=2:3)であり、残留炭素含有量は6.0atom%であった。また、X線反射率法による膜厚測定を行い、その平均値を算出したところ、膜厚は平均10nmであり、1サイクル当たりに得られる膜厚は平均0.02nmであった。FE−SEMを用いた断面観察の結果、薄膜の表面は平滑だった。
化合物No.187を原子層堆積法用原料とし、図1に示す装置を用いて以下の条件のALD法により、シリコンウエハ上に酸化イッテルビウム薄膜を製造した。得られた薄膜をX線光電子分光法により薄膜組成の確認したところ、得られた薄膜は酸化イッテルビウム(Yb:O=2:3)であり、残留炭素含有量は1.0atom%よりも少なかった。また、X線反射率法による膜厚測定を行い、その平均値を算出したところ、膜厚は平均40nmであり、1サイクル当たりに得られる膜厚は平均0.08nmであった。
基板:シリコンウエハ
反応温度(シリコンウエハ温度):250℃
反応性ガス:H2O
下記(1)〜(4)からなる一連の工程を1サイクルとして、500サイクル繰り返した:
(1)原料容器温度:130℃、原料容器内圧力:100Paの条件で気化させた原子層堆積法用原料を成膜チャンバーに導入し、系圧力100Paで30秒間堆積させる;
(2)15秒間のアルゴンパージにより、堆積しなかった原料を除去する;
(3)反応性ガスを成膜チャンバーに導入し、系圧力:100Paで0.2秒間反応させる;
(4)15秒間のアルゴンパージにより、未反応の第一の反応性ガス及び副生ガスを除去する。
化合物No.195を原子層堆積法用原料とし、図1に示す装置を用いて以下の条件のALD法により、シリコンウエハ上に酸化ルテチウム薄膜を製造した。得られた薄膜をX線光電子分光法により薄膜組成の確認したところ、得られた薄膜は酸化ルテチウム(Lu:O=2:3)であり、残留炭素含有量は1.0atom%よりも少なかった。また、X線反射率法による膜厚測定を行い、その平均値を算出したところ、膜厚は平均40nmであり、1サイクル当たりに得られる膜厚は平均0.08nmであった。
基板:シリコンウエハ
反応温度(シリコンウエハ温度):250℃
反応性ガス:H2O
下記(1)〜(4)からなる一連の工程を1サイクルとして、500サイクル繰り返した:
(1)原料容器温度:130℃、原料容器内圧力:100Paの条件で気化させた原子層堆積法用原料を成膜チャンバーに導入し、系圧力:100Paで30秒間堆積させる;
(2)15秒間のアルゴンパージにより、堆積しなかった原料を除去する;
(3)反応性ガスを成膜チャンバーに導入し、系圧力:100Paで0.2秒間反応させる;
(4)15秒間のアルゴンパージにより、未反応の第一の反応性ガス及び副生ガスを除去する。
原子層堆積法用原料として化合物No.196を用いたこと以外は実施例13と同様の条件で酸化ルテチウム薄膜を製造した。得られた薄膜をX線光電子分光法により薄膜組成の確認したところ、得られた薄膜は酸化ルテチウム(Lu:O=2:3)であり、残留炭素含有量は1.0atom%よりも少なかった。また、X線反射率法による膜厚測定を行い、その平均値を算出したところ、膜厚は平均35nmであり、1サイクル当たりに得られる膜厚は平均0.07nmであった。
原子層堆積法用原料として比較化合物2を用いたこと以外は実施例13と同様の条件で酸化ルテチウム薄膜を製造した。得られた薄膜をX線光電子分光法により薄膜組成の確認したところ、得られた薄膜は酸化ルテチウム(Lu:O=2:3)であり、残留炭素含有量は7.0atom%であった。また、X線反射率法による膜厚測定を行い、その平均値を算出したところ、膜厚は平均10nmであり、1サイクル当たりに得られる膜厚は平均0.02nmであった。
原子層堆積法用原料として比較化合物3を用いたこと以外は実施例13と同様の条件で酸化ルテチウム薄膜を製造した。得られた薄膜をX線光電子分光法により薄膜組成の確認したところ、得られた薄膜は酸化ルテチウム(Lu:O=2:3)であり残留炭素含有量は8.0atom%であった。また、X線反射率法による膜厚測定を行い、その平均値を算出したところ、膜厚は平均10nmであり、1サイクル当たりに得られる膜厚は平均0.02nmであった。
化合物No.139を原子層堆積法用原料とし、図1に示す装置を用いて以下の条件のALD法により、シリコンウエハ上に酸化ジスプロシウム薄膜を製造した。得られた薄膜をX線光電子分光法により薄膜組成の確認したところ、得られた薄膜は酸化ジスプロシウム(Dy:O=2:3)であり、残留炭素含有量は1.0atom%よりも少なかった。また、X線反射法による膜厚測定を行い、その平均値を算出したところ、膜厚は平均300nmであり、1サイクル当たりに得られる膜厚は平均0.06nmであった。
基板:シリコンウエハ
反応温度(シリコンウエハ温度):250℃
反応性ガス:H2O
下記(1)〜(4)からなる一連の工程を1サイクルとして、500サイクル繰り返した:
(1)原料容器温度:130℃、原料容器内圧力:100Paの条件で気化させた原子層堆積法用原料を成膜チャンバーに導入し、系圧力:100Paで30秒間堆積させる;
(2)15秒間のアルゴンパージにより、堆積しなかった原料を除去する;
(3)反応性ガスを成膜チャンバーに導入し、系圧力:100Paで0.2秒間反応させる;
(4)15秒間のアルゴンパージにより、未反応の第一の反応性ガス及び副生ガスを除去する。
化合物No.147を原子層堆積法用原料とし、図1に示す装置を用いて以下の条件のALD法により、シリコンウエハ上に酸化ホルミウム薄膜を製造した。得られた薄膜をX線光電子分光法により薄膜組成の確認したところ、得られた薄膜は酸化ホルミウム(Ho:O=2:3)であり、残留炭素含有量は1.0atom%よりも少なかった。また、X線反射率法による膜厚測定を行い、その平均値を算出したところ、膜厚は平均30nmであり、1サイクル当たりに得られる膜厚は平均0.06nmであった。
基板:シリコンウエハ
反応温度(シリコンウエハ温度):250℃
反応性ガス:H2O
下記(1)〜(4)からなる一連の工程を1サイクルとして、500サイクル繰り返した:
(1)原料容器温度:130℃、原料容器内圧力:100Paの条件で気化させた原子層堆積法用原料を成膜チャンバーに導入し、系圧力:100Paで30秒間堆積させる;
(2)15秒間のアルゴンパージにより、堆積しなかった原料を除去する;
(3)反応性ガスを成膜チャンバーに導入し、系圧力:100Paで0.2秒間反応させる;
(4)15秒間のアルゴンパージにより、未反応の第一の反応性ガス及び副生ガスを除去する。
Claims (3)
- 下記一般式(1)で表される金属アルコキシド化合物:
- 請求項1に記載の金属アルコキシド化合物を含有してなる薄膜形成用原料。
- 基体の表面にスカンジウム原子、イットリウム原子、ランタン原子、セリウム原子、プラセオジム原子、ネオジム原子、プロメチウム原子、サマリウム原子、ユウロピウム原子、ガドリニウム原子、テルビウム原子、ジスプロシウム原子、ホルミウム原子、エルビウム原子、ツリウム原子、イッテルビウム原子およびルテチウム原子から選ばれる少なくとも1種の原子を含有する薄膜を製造する方法であって、請求項2に記載の薄膜形成用原料を気化させることにより得られる前記化合物を含有する蒸気を処理雰囲気に導入し、該化合物を分解及び/又は化学反応させて前記基体の表面に堆積させる工程を含む薄膜の製造方法。
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WO2004083479A2 (en) * | 2003-03-17 | 2004-09-30 | Epichem Limited | Alcoholates of rare earth mtals a precursors for metaloxide layers or films |
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CN102199166A (zh) * | 2011-04-11 | 2011-09-28 | 南京航空航天大学 | 官能化烷氧基稀土金属镧配合物及其合成方法与应用 |
JP2013216614A (ja) * | 2012-04-09 | 2013-10-24 | Adeka Corp | コバルトアルコキシド化合物、薄膜形成用原料及び薄膜の製造方法 |
JP6249875B2 (ja) * | 2014-05-14 | 2017-12-20 | 株式会社Adeka | コバルト化合物、薄膜形成用原料及び薄膜の製造方法 |
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IL272276B1 (en) | 2023-09-01 |
EP3677585A4 (en) | 2021-04-28 |
KR20200041870A (ko) | 2020-04-22 |
TW201918491A (zh) | 2019-05-16 |
KR102600214B1 (ko) | 2023-11-08 |
IL272276A (en) | 2020-03-31 |
WO2019044448A1 (ja) | 2019-03-07 |
IL272276B2 (en) | 2024-01-01 |
US20200140463A1 (en) | 2020-05-07 |
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