JPWO2019031458A1 - 低誘電率熱伝導性放熱部材 - Google Patents
低誘電率熱伝導性放熱部材 Download PDFInfo
- Publication number
- JPWO2019031458A1 JPWO2019031458A1 JP2019535653A JP2019535653A JPWO2019031458A1 JP WO2019031458 A1 JPWO2019031458 A1 JP WO2019031458A1 JP 2019535653 A JP2019535653 A JP 2019535653A JP 2019535653 A JP2019535653 A JP 2019535653A JP WO2019031458 A1 JPWO2019031458 A1 JP WO2019031458A1
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- powder
- dissipation member
- boron nitride
- average particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/024—Woven fabric
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/107—Ceramic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Textile Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
Abstract
Description
前記樹脂組成物が、
平均粒子径10〜20μm、下記で定義された配向性指数が2〜20の六方晶窒化ホウ素の凝集粉末と、平均粒子径3〜7μmの酸化アルミニウム粉末とを含んだ熱伝導性フィラー60〜70体積%と、
シリコーン樹脂30〜40体積%と
を含有し、
配向性指数は、粉末X線回折法による(002)面の回折線の強度I002と(100)面の回折線の強度I100との比(I002/I100)である。
配向性指数=(I002/I100)
熱伝導性粉末として表1に示される凝集六方晶窒化ホウ素粉末6種類及び酸化アルミニウム粉末5種類、付加反応型液状シリコーンとして表2、3に示されるELASTOSIL LR3303/20/A液1種類(白金触媒を含有したビニル基を有するオルガノポリシロキサン)、ELASTOSIL LR3303/20/B液1種類(H−Si基を有するオルガノポリシロキサン及びビニル基を有するオルガノポリシロキサン)、を室温下で表2〜3に示す配合比(体積%)で、自転・公転ミキサーであるシンキー社製「あわとり練太郎」を用いて、回転速度2000rpmで10分混合して樹脂組成物を製造した。
実施例1の樹脂組成物を、スリット(0.1mm×100mm、及び0.1mm×10mm)付きダイスの固定されたシリンダー構造金型内に100g充填し、ピストンで5MPaの圧力をかけながらスリットから押し出して樹脂組成物のグリーンシートに成型した後、ガラスクロス(ユニチカ社製「H25 F104」)の両面に積層した状態で面圧15MPaをかけ、150℃で1時間加熱して厚さ0.2mmのシートを製造した。このシートは実施例1のシートに比べ誘電特性がさらに良好であった。
Claims (3)
- 樹脂組成物を含んだ、厚さ0.1〜0.5mmのシート状の放熱部材であって、
前記樹脂組成物が、
平均粒子径10〜20μm、下記で定義された配向性指数が2〜20の六方晶窒化ホウ素の凝集粉末と、平均粒子径3〜7μmの酸化アルミニウム粉末とを含む熱伝導性フィラー60〜70体積%と、
シリコーン樹脂30〜40体積%と
を含有し、
配向性指数は、粉末X線回折法による(002)面の回折線の強度I002と(100)面の回折線の強度I100との比(I002/I100)である。 - 前記熱伝導性フィラー中の、前記六方晶窒化ホウ素の凝集粉末と前記酸化アルミニウム粉末との配合比が、体積比として4:1〜1:4の範囲である、請求項1記載の放熱部材。
- ガラスクロスに請求項1または2に記載の放熱部材を積層した放熱部材。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017155535 | 2017-08-10 | ||
JP2017155535 | 2017-08-10 | ||
PCT/JP2018/029456 WO2019031458A1 (ja) | 2017-08-10 | 2018-08-06 | 低誘電率熱伝導性放熱部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019031458A1 true JPWO2019031458A1 (ja) | 2020-07-09 |
JP7220150B2 JP7220150B2 (ja) | 2023-02-09 |
Family
ID=65272271
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019535653A Active JP7220150B2 (ja) | 2017-08-10 | 2018-08-06 | 低誘電率熱伝導性放熱部材 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3667718B1 (ja) |
JP (1) | JP7220150B2 (ja) |
CN (1) | CN110959190B (ja) |
WO (1) | WO2019031458A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111793361B (zh) * | 2019-04-02 | 2023-03-24 | 四川大学 | 低介电常数硅橡胶复合薄膜及其制备方法、应用 |
CN114207044A (zh) * | 2020-05-15 | 2022-03-18 | 迪睿合株式会社 | 导热性片和导热性片的制造方法 |
JP6987941B1 (ja) * | 2020-09-11 | 2022-01-05 | デクセリアルズ株式会社 | 熱伝導性シート及び熱伝導性シートの製造方法 |
JP7235708B2 (ja) * | 2020-10-14 | 2023-03-08 | 矢崎総業株式会社 | 熱伝導シートの製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1126661A (ja) * | 1997-07-01 | 1999-01-29 | Denki Kagaku Kogyo Kk | 放熱スペーサー |
JP2011144234A (ja) * | 2010-01-13 | 2011-07-28 | Denki Kagaku Kogyo Kk | 熱伝導性樹脂組成物 |
JP2011184507A (ja) * | 2010-03-05 | 2011-09-22 | Denki Kagaku Kogyo Kk | 高熱伝導性フィラー |
JP2014172768A (ja) * | 2013-03-07 | 2014-09-22 | Denki Kagaku Kogyo Kk | 窒化ホウ素複合粉末及びそれを用いた熱硬化性樹脂組成物 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3461651B2 (ja) | 1996-01-24 | 2003-10-27 | 電気化学工業株式会社 | 六方晶窒化ほう素粉末及びその用途 |
JPH1160216A (ja) | 1997-08-04 | 1999-03-02 | Shin Etsu Chem Co Ltd | 熱伝導性窒化ホウ素フィラー及び絶縁放熱シート |
JP2003060134A (ja) | 2001-08-17 | 2003-02-28 | Polymatech Co Ltd | 熱伝導性シート |
JP5115029B2 (ja) | 2007-05-28 | 2013-01-09 | トヨタ自動車株式会社 | 高熱伝導絶縁材と絶縁紙、コイルボビンおよび電動機 |
JP2009024126A (ja) | 2007-07-23 | 2009-02-05 | Nitto Denko Corp | ポリマー組成物、熱伝導性シート、金属箔付高熱伝導接着シート、金属板付高熱伝導接着シート、金属ベース回路基板ならびにパワーモジュール |
EP2966036A4 (en) * | 2013-03-07 | 2016-11-02 | Denka Company Ltd | BORON NITRIDE POWDER AND RESIN COMPOSITION CONTAINING THE SAME |
-
2018
- 2018-08-06 CN CN201880048639.3A patent/CN110959190B/zh active Active
- 2018-08-06 EP EP18844599.3A patent/EP3667718B1/en active Active
- 2018-08-06 WO PCT/JP2018/029456 patent/WO2019031458A1/ja unknown
- 2018-08-06 JP JP2019535653A patent/JP7220150B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1126661A (ja) * | 1997-07-01 | 1999-01-29 | Denki Kagaku Kogyo Kk | 放熱スペーサー |
JP2011144234A (ja) * | 2010-01-13 | 2011-07-28 | Denki Kagaku Kogyo Kk | 熱伝導性樹脂組成物 |
JP2011184507A (ja) * | 2010-03-05 | 2011-09-22 | Denki Kagaku Kogyo Kk | 高熱伝導性フィラー |
JP2014172768A (ja) * | 2013-03-07 | 2014-09-22 | Denki Kagaku Kogyo Kk | 窒化ホウ素複合粉末及びそれを用いた熱硬化性樹脂組成物 |
Also Published As
Publication number | Publication date |
---|---|
EP3667718A1 (en) | 2020-06-17 |
CN110959190B (zh) | 2023-08-08 |
CN110959190A (zh) | 2020-04-03 |
EP3667718B1 (en) | 2021-12-22 |
JP7220150B2 (ja) | 2023-02-09 |
WO2019031458A1 (ja) | 2019-02-14 |
EP3667718A4 (en) | 2020-08-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5497458B2 (ja) | 熱伝導性樹脂組成物 | |
JP7220150B2 (ja) | 低誘電率熱伝導性放熱部材 | |
JP5749536B2 (ja) | 熱伝導性成形体とその用途 | |
CN111492474B (zh) | 绝缘散热片 | |
JP5405890B2 (ja) | 熱伝導性成形体とその用途 | |
WO2010050139A1 (ja) | 酸化亜鉛粒子、その製造方法、放熱性フィラー、樹脂組成物、放熱性グリース及び放熱性塗料組成物 | |
JP2010155870A (ja) | 熱伝導性コンパウンドおよびその製造方法 | |
JP2014105297A (ja) | シート状成形体 | |
JP2019131669A (ja) | 樹脂組成物および絶縁熱伝導性シート | |
CN108603034B (zh) | 热传导构件以及热传导构件的制造方法 | |
JP6786047B2 (ja) | 熱伝導シートの製造方法 | |
JP2017014445A (ja) | 窒化アルミニウム複合フィラーおよびこれを含む樹脂組成物 | |
WO2021044867A1 (ja) | 熱伝導性シリコーン組成物及び熱伝導性シリコーン材料 | |
JP2021109825A (ja) | 熱伝導性フィラー、及びそれを含有する熱伝導性組成物 | |
JP2016169281A (ja) | 複合フィラーおよびこれを含む樹脂組成物 | |
JP2013056996A (ja) | 高熱伝導性樹脂組成物 | |
JP4481019B2 (ja) | 混合粉末及びその用途 | |
CN110892025B (zh) | 导热性片材 | |
WO2022191238A1 (ja) | 熱伝導性樹脂組成物及び熱伝導性樹脂材料 | |
JP2016124908A (ja) | 樹脂成形体 | |
JP2009289765A (ja) | 放熱スペーサー | |
JP5100254B2 (ja) | 放熱材料 | |
US20240132767A1 (en) | Thermally conductive resin composition and thermally conductive resin material | |
WO2021171970A1 (ja) | 熱伝導性シリコーン組成物及び熱伝導性シリコーン材料 | |
WO2023188491A1 (ja) | 熱伝導性シリコーン組成物、熱伝導性シリコーンシート及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210707 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220927 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221027 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230117 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230130 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7220150 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |